Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
01/2008
01/09/2008CN100361322C Light-emitting device, method of fabricating the device, and LED lamp using the device
01/09/2008CN100361321C Method for controlling crawling glue phenomenon in preparation process of light emitting diode sealing glue
01/09/2008CN100361320C Zinc oxide films containing P-type dopant and process for preparing same
01/08/2008US7317287 Circuit for an LED array
01/08/2008US7317212 Light emitting diode
01/08/2008US7317211 Light-emitting device, light-emitting apparatus, image display apparatus, method of manufacturing light-emitting device, and method of manufacturing image display apparatus
01/08/2008US7317210 Organic light emitting diode, method for the production thereof and uses thereof
01/08/2008US7317202 Method for manufacture of an epitaxial structural element layer sequence and optoelectronic semiconductor chip
01/08/2008US7317181 Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
01/08/2008US7316851 For use in civil or industrial displaying device such as a light- emission type multi- or full-color display, or a displaying panel, and color image forming
01/08/2008US7316790 Securing a document by applying a metal sulfide phosphor powder containing particles that are spherical and have an average particle size of 0.3 to not greater than 10 mu m.; up-converter particles; emits at least two different wavelengths
01/08/2008US7316488 Beam shutter in LED package
01/03/2008WO2008002362A1 Efficient emitting led package and method for efficiently emitting light
01/03/2008WO2008002104A1 Method of forming p-type compound semiconductor layer
01/03/2008WO2008002084A1 Light emitting device
01/03/2008WO2008002068A1 Side view type led package
01/03/2008WO2008001990A1 Iii-nitride semiconductor light emitting device and method for manufacturing the same
01/03/2008WO2008001799A1 Illuminating device
01/03/2008WO2008001623A1 Phosphor
01/03/2008WO2008000244A2 Optoelectronic component and illumination device
01/03/2008WO2007130928A3 Led package with converging optical element
01/03/2008WO2007126836A3 Uniform emission led package
01/03/2008WO2007126720A3 Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
01/03/2008WO2007054819A3 Sealed package with glass window for optoelectronic components and assemblies incorporating the same
01/03/2008WO2006036446A3 White, single or multi-color light emitting diodes by recycling guided modes
01/03/2008WO2005086782A3 Blue light emitting semiconductor nanocrystal materials
01/03/2008US20080004471 Dendrimers
01/03/2008US20080003786 Large area, uniformly low dislocation density gan substrate and process for making the same
01/03/2008US20080003777 Nickel Tin Bonding System for Semiconductor Wafers and Devices
01/03/2008US20080003707 Method for fabricating diode having reflective electrode of alloy metal
01/03/2008US20080003440 Method of Storing GaN Substrate, Stored Substrate, and Semiconductor Device and Method of Its Manufacture
01/03/2008US20080003160 heat treating phosphor grains with a glass composition so that the glass melts and surround the phosphor grains, then cooling and breaking the heat treated mixture to provide phosphors having a glass coating layer formed on the surfaces of the phosphor grains; improved moisture and heat resistance
01/03/2008US20080002412 Liquid crystal display device
01/03/2008US20080002103 Liquid crystal display driving system having light emitting diodes
01/03/2008US20080002102 Liquid crystal display backlight driving system with light emitting diodes
01/03/2008US20080002100 Illumination Device and Display Device Using Illumination Device
01/03/2008US20080001908 Arrangement matrix of primary color LEDs
01/03/2008US20080001526 Method for Fabricating Light-Emitting Display, Method for Manufacturing Led Unit, Structure of Connection Block Having Led Unit
01/03/2008US20080001515 Fluorescent complex and lighting system using the same
01/03/2008US20080001174 directly and securely contact an aluminum alloy film with pixel electrodes and achieve a low electrical resistivity between the pixel electrodes even when a low thermal processing temperature is used; display panels; lower power consumption
01/03/2008US20080001166 Method of fabricating vertical structure leds
01/03/2008US20080001165 OPTO-ELECTRONIC AND ELECTRONIC DEVICES USING N-FACE OR M-PLANE GaN SUBSTRATE PREPARED WITH AMMONOTHERMAL GROWTH
01/03/2008US20080001164 Flip chip type LED lighting device manufacturing method
01/03/2008US20080001163 LED lamp
01/03/2008US20080001162 Process for Structuring at Least One Layer as Well as Electrical Component with Structures From the Layer
01/03/2008US20080001161 Utilizing nanowire for generating white light
01/03/2008US20080001160 LED package with flexible polyimid circuit and method of manufacturing LED package
01/03/2008US20080001139 Photonic Devices Monolithically Integrated with Cmos
01/03/2008US20080001138 Nitride based semiconductor light-emitting device
01/03/2008US20080001126 Excellent in emission characteristics compared to conventional rare-earth activated sialon phosphors; more durable than conventional oxide phosphors; without luminance deterioration even when exposed to excitation sources; vacuum fluorescent displays, field emission display, plasma display panel
01/03/2008US20080001122 for precise reproduction of minute color shades and emits white or intermediate light at high luminance; semiconductors; diodes
01/03/2008DE202007014397U1 Lichtemittierende Vorrichtung A light emitting device
01/03/2008DE112004002138T5 Optobauteil-Gehäusekonstruktion Optocomponent housing construction
01/03/2008DE102007029891A1 Semiconductor structures e.g. LED plate, connecting method, involves heating three-layered structure at temperature, which lies between melting points of middle and outer layers, until middle layer has completely reacted with outer layers
01/03/2008DE10196361B4 Verfahren zur Herstellung eines Gruppe-III-Nitrid-Halbleiterkristalls A method for producing a group III nitride semiconductor crystal
01/02/2008EP1873825A2 Semiconductor device, LED head and image forming apparatus
01/02/2008EP1873817A2 Substrate having thin film of GaN joined thereon and method of fabricating the same, and a GaN-based semiconductor device and method of fabricating the same
01/02/2008EP1873566A2 Light emitting diode with light guide assembly
01/02/2008EP1873563A1 Reflective member, light-emitting device using same and illuminating device
01/02/2008EP1873448A1 A high power led illuminating equipment having high thermal diffusivity
01/02/2008EP1873447A1 An efficient high-power led lamp
01/02/2008EP1873211A1 Phosphor-filled curable silicone resin composition and cured product thereof
01/02/2008EP1872625A1 White light luminaire with adjustable correlated colour temperature
01/02/2008EP1872415A2 Metal oxide semiconductor films, structures and methods
01/02/2008EP1872414A1 Reverse polarization light emitting region for a nitride light emitting device
01/02/2008EP1872400A1 Mounting assembly for optoelectronic devices
01/02/2008EP1872053A2 Lighting module with compact colour mixing and collimating optics
01/02/2008EP1508157A4 High efficiency solid-state light source and methods of use and manufacture
01/02/2008EP1504632A4 Display devices using feedback enhanced light emitting diode
01/02/2008EP1402579A4 High efficiency silicon light emitting device and modulator
01/02/2008CN101099245A Light emission device
01/02/2008CN101099244A Method for producing an area having reduced electrical conductivity within a semiconductor layer and optoelectronic semiconductor element
01/02/2008CN101099227A Functional device and method for forming oxide material
01/02/2008CN101099223A Light emitting diode with conducting metal substrate
01/02/2008CN101098576A A lamp and method of producing a lamp
01/02/2008CN101097985A Package member and manufacturing method therefor
01/02/2008CN101097984A Lighting device
01/02/2008CN101097983A Semiconductor device, LED head and image forming apparatus
01/02/2008CN101097982A Packaging structure for luminescent device
01/02/2008CN101097981A Electroluminescent device and method for producing the same
01/02/2008CN101097980A Silicon based titanium dioxide electroluminescent device and method for producing the same
01/02/2008CN101097979A ZnO based LED and its preparing process
01/02/2008CN101097978A Copper inter-linkage flip-chip LED and its preparing process
01/02/2008CN101097977A Method for producing white light LED lamp and LED lamp using the same
01/02/2008CN101097976A High luminous efficiency LED
01/02/2008CN101097975A Light-emitting diode incorporating an array of light extracting spots
01/02/2008CN101097974A White light LED
01/02/2008CN101097973A High power LED two-dimension light source
01/02/2008CN101097909A Light emitting diode packaging structure and method capable of increasing luminous efficiency
01/02/2008CN101097867A Peeling method, semiconductor device, and manufacturing method therefor
01/02/2008CN101097855A Fabrication process of nitride semiconductor substrate and composite material substrate
01/02/2008CN101097847A Nickel tin bonding system for semiconductor wafers and devices
01/02/2008CN101097356A Liquid crystal display device
01/02/2008CN101097241A Semiconductor device and semiconductor testing device
01/02/2008CN101097053A Light emitting diode with direct view optic
01/02/2008CN100359830C Bidirectional optical transmission apparatus
01/02/2008CN100359709C High power and quick heat radiating light emitting diode in white light
01/02/2008CN100359708C Luminous device and illuminator
01/02/2008CN100359707C Ga Nitride Light emitting device
01/02/2008CN100359706C Organic bonding luminous assembly with ohmic metal contact