Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
01/2010
01/05/2010US7642542 Semiconductor light-emitting device and producing method for the same
01/05/2010US7642502 Photo relay having an insulated gate field effect transistor with variable impedance
01/05/2010US7642494 Light emitting apparatus and method for inspecting same
01/05/2010US7642183 High power, high luminous flux light emitting diode and method of making same
01/05/2010US7642122 Method for forming nitride crystals
01/05/2010US7642121 LED bonding structures and methods of fabricating LED bonding structures
01/05/2010US7642108 LED including photonic crystal structure
01/05/2010US7641988 Comprises an epitaxial nitride layer with a light-emitting device structure formed on the above self-supported nitride semiconductor substrate; having large light emission with a low driving voltage; gallium nitride
12/2009
12/31/2009US20090325334 GaN BASED GROUP III-V NITRIDE SEMICONDUCTOR LIGHT-EMITTING DIODE AND METHOD FOR FABRICATING THE SAME
12/31/2009US20090325333 Display device and method for manufacturing the same
12/31/2009US20090323746 Nitride Semiconductor Laser and Method for Fabricating Same
12/31/2009US20090323238 Electronic device including a protection circuit for a light-emitting device
12/31/2009US20090322247 Dimming buck type LED driving apparatus
12/31/2009US20090322209 Luminescent Substance of the Class of Nitride Silicates and Light Source Having such a Luminescent Substance
12/31/2009US20090321782 Apparatus And Method For Nanowire Optical Emission
12/31/2009US20090321781 Quantum dot device and method of making the same
12/31/2009US20090321780 Gallium nitride-based light emitting device with roughened surface and fabricating method thereof
12/31/2009US20090321779 Side view light emitting diode package
12/31/2009US20090321778 Flip-chip light emitting diode and method for fabricating the same
12/31/2009US20090321776 Multi-chip package for LED chip and multi-chip package LED device including the multi-chip package
12/31/2009US20090321775 LED with Reduced Electrode Area
12/31/2009US20090321774 Optical semiconductor device and method for manufacturing the same
12/31/2009US20090321773 Led package frame and led package having the same
12/31/2009US20090321772 Light source
12/31/2009US20090321770 Semiconductor Light-Emitting Device
12/31/2009US20090321769 Method for coating semiconductor device using droplet deposition
12/31/2009US20090321768 Led
12/31/2009US20090321766 Led
12/31/2009US20090321765 Light emitting diode
12/31/2009US20090321763 Light emitting diode
12/31/2009US20090321762 Light emitting diode
12/31/2009US20090321761 Coating for converting optical spectrum and led chip package module using the same
12/31/2009US20090321760 Fabrication of compact opto-electronic component packages
12/31/2009US20090321759 Surface-textured encapsulations for use with light emitting diodes
12/31/2009US20090321758 Led with improved external light extraction efficiency
12/31/2009US20090321757 Dislocation-based light emitter
12/31/2009US20090321756 LED Package Structure and Method of Packaging the Same
12/31/2009US20090321755 Nanocrystal mixture and light-emitting diode using the same
12/31/2009US20090321754 Signal light using phosphor coated leds
12/31/2009US20090321753 Light Emitting Device and Method of Manufacturing the Same
12/31/2009US20090321752 Electric devices and methods of manufaturing the same
12/31/2009US20090321750 Surface mount device
12/31/2009US20090321749 Light Emitting Device and Method of Manufacturing a Light Emitting Device
12/31/2009US20090321748 Light emitting diode and method for manufacturing the same
12/31/2009US20090321745 Semiconductor light-emitting device
12/31/2009US20090321740 Tft-lcd array substrate and manufacturing method thereof
12/31/2009US20090321739 Array substrate for flat display device and method for fabricating the same
12/31/2009US20090321738 Display apparatus using oxide diode
12/31/2009US20090321726 Encapsulation for organic optoelectronic devices
12/31/2009US20090321714 Semiconductor light-emitting device
12/31/2009US20090321713 Method of controlling active layer of iii-nitride semiconductor light emitting device
12/31/2009DE102008030843A1 Opto-electronic arrangement, has adhesive unit arranged between connection support and chip and comprising of electrical conducting material, which provides electrical conducting connection between connection points and contact points
12/31/2009DE102008030819A1 Optoelektronische Vorrichtung Optoelectronic device
12/31/2009DE102008030751A1 Strahlungsemittierender Halbleiterchip Radiation-emitting semiconductor chip
12/31/2009DE102008030584A1 Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement A process for producing an optoelectronic component and optoelectronic component
12/31/2009DE102008030346A1 Arrangement for cooling radiation emitting semiconductor device, has surface of component connected with another surface of another component
12/31/2009DE102008030253A1 Konversionselement und Leuchtmittel Conversion element and bulbs
12/31/2009DE102008021438A1 Konversionsmaterial insbesondere für eine, eine Halbleiterlichtquelle umfassende weiße oder farbige Lichtquelle, Verfahren zu dessen Herstellung sowie dieses Konversionsmaterial umfassende Lichtquelle Conversion material particularly for a semiconductor light source comprising white or colored light source, process for its preparation and this conversion material comprising a light source
12/30/2009WO2009158422A1 Led lamp with remote phosphor coating and method of making the lamp
12/30/2009WO2009158313A1 Surface-textured encapsulations for use with light emitting diodes
12/30/2009WO2009158191A2 Semiconductor light converting construction
12/30/2009WO2009158175A2 Led with reduced electrode area
12/30/2009WO2009158159A2 Light converting construction
12/30/2009WO2009158158A2 Method of fabricating light extractor
12/30/2009WO2009158138A2 Semiconductor light converting construction
12/30/2009WO2009157921A1 Silicon based solid state lighting
12/30/2009WO2009157704A2 Led package and manufacturing method for same
12/30/2009WO2009157689A2 Light emitting device package
12/30/2009WO2009157664A2 Semiconductor device package
12/30/2009WO2009157288A1 Light-emitting device and method for producing same
12/30/2009WO2009157285A1 Light-emitting element lamp and lighting fixture
12/30/2009WO2009157166A1 Light emitting apparatus, planar light emitting apparatus and display apparatus
12/30/2009WO2009157160A1 Packaging structure and method for manufacturing packaging structure
12/30/2009WO2009156856A2 Led with improved external light extraction efficiency
12/30/2009WO2009156354A1 Fabrication of compact opto-electronic component packages
12/30/2009WO2009156348A1 Optical sky-sun diffuser
12/30/2009WO2009156347A1 Illumination device
12/30/2009WO2009155907A2 Conversion element and lighting device
12/30/2009WO2009155899A1 Radiation-emitting semiconductor chip
12/30/2009WO2009155897A1 Method for producing an optoelectronic component and optoelectronic component
12/30/2009WO2009123936A3 Light emitting diodes with smooth surface for reflective electrode
12/30/2009WO2009120998A3 Low resistance ultraviolet light emitting device and method of fabricating the same
12/30/2009WO2009120975A3 Superlattice free ultraviolet emitter
12/30/2009WO2009111790A8 Optical devices featuring nonpolar textured semiconductor layers
12/30/2009WO2009108733A3 Current-injecting/tunneling light-emitting device and method
12/30/2009WO2009106051A3 Miniature housing and support arrangement having at least one miniature housing
12/30/2009WO2008121976A3 Method to fabricate iii-n semiconductor devices on the n-face of layers which are grown in the iii-face direction using wafer bonding and substrate removal
12/30/2009WO2008091585A3 Light recycling systems and methods
12/30/2009EP2139052A1 Semiconductor light-emitting device and method for manufacturing the same
12/30/2009EP2139051A1 Power surface mount light emitting die package
12/30/2009EP2138753A1 Light box
12/30/2009EP2138525A1 Epoxy silicone and method for production thereof, and curable resin composition using the same and use thereof
12/30/2009EP1889302B1 Illumination system with leds
12/30/2009CN201374348Y Light emitting diode with current barrier layer
12/30/2009CN201374347Y Surface-emitting multi-color light-emitting diode
12/30/2009CN201374346Y Novel pink LED
12/30/2009CN201373367Y High-power LED light source module adopting semiconductor for cooling
12/30/2009CN201373344Y Light emitting diode frame structure and light emitting diode packaging module
12/30/2009CN201373331Y LED lens module
12/30/2009CN201373330Y LED combined lens