Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
03/2010
03/25/2010US20100072487 Light emitting diode, package structure and manufacturing method thereof
03/25/2010US20100072486 Wavelength converting elements with reflective edges
03/25/2010US20100072483 Thin film transistor array panel and method for manufacturing the same
03/25/2010US20100072482 Organic light emitting display and method of manufacturing the same
03/25/2010US20100072481 Method and Resulting Structure Using Silver for LCOS Devices
03/25/2010US20100072479 LCD Pixel Array Structure
03/25/2010US20100072477 Liquid crystal display device
03/25/2010US20100072471 Display device
03/25/2010US20100072470 Display device
03/25/2010US20100072469 Display device and manufacturing method of the same
03/25/2010US20100072468 Display device
03/25/2010US20100072467 Semiconductor device
03/25/2010US20100072456 Opto-electronic read head
03/25/2010US20100072416 Heat-dissipating resin composition, substrate for led mounting, reflector, and substrate for led mounting having reflector portion
03/25/2010US20100072407 Device and method for managing radiation
03/25/2010DE102008047100A1 Substrate for development of electronic components, particularly light emitting diode from punched copper-colored metal foil and non-metallic foil, includes coating copper-colored metal foil with metal
03/25/2010CA2741752A1 Optical disk for lighting module
03/25/2010CA2737066A1 Lighting module
03/25/2010CA2735508A1 Lighting module
03/25/2010CA2735165A1 Optical cup for lighting module
03/25/2010CA2674959A1 Multi-band multiwavelengh quantum dot mode-locked lasers
03/24/2010EP2166580A1 Solid state lamp
03/24/2010EP2166574A1 Zno-based thin film and zno-based semiconductor element
03/24/2010EP2166037A1 Epoxy resin-forming liquid preparation containing inorganic particle
03/24/2010EP2165375A1 Light emitting diode
03/24/2010EP2165374A2 Radiation-emitting semiconductor body
03/24/2010EP2165373A2 Thin flash or video recording light using low profile side emitting led
03/24/2010CN201430165Y high-power led
03/24/2010CN201430164Y High-power LED packaging base
03/24/2010CN201430163Y Novel LED single-base packaging structure
03/24/2010CN201430162Y Novel LED packaging base
03/24/2010CN201430161Y LED device package structure
03/24/2010CN201430160Y High-efficiency heat dissipation type high-power LED bracket
03/24/2010CN201429033Y Novel LED series module packaging structure
03/24/2010CN201429032Y Novel LED parallel module packaging structure
03/24/2010CN201429024Y LED light
03/24/2010CN201428966Y High-power LED illumination lamp light source
03/24/2010CN101682324A Semiconductor device
03/24/2010CN101682167A Optical communications module, process for manufacturing the same, and optical transmitter and receiver apparatus
03/24/2010CN101681975A Main substrate of nitride-based illuminating device
03/24/2010CN101681974A Driving circuit for light emitting diode
03/24/2010CN101681973A Transparent ohmic contacts on light emitting diodes with growth substrates
03/24/2010CN101681972A Transparent ohmic contacts on light emitting diodes with carrier substrates
03/24/2010CN101681971A Light emitting diode
03/24/2010CN101681970A Semiconductor light emitting element and method for manufacturing the same
03/24/2010CN101681969A Method for the production of a plurality of optoelectronic components, and optoelectronic component
03/24/2010CN101681968A Led driving circuit
03/24/2010CN101681967A Luminescence diode chip with an angle filter element
03/24/2010CN101681966A Lamp with controllable spectrum
03/24/2010CN101681965A Glass for optical device covering, glass-covered light-emitting element, and glass-covered light-emitting device
03/24/2010CN101681964A Method for producing optoelectronic components, and optoelectronic component
03/24/2010CN101681963A 紫外线辐射发光二极管装置 UV radiation-emitting diode device
03/24/2010CN101681962A Semiconductor light-emitting device
03/24/2010CN101681961A Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures
03/24/2010CN101681960A Light emitting device and package assembly for light emitting device
03/24/2010CN101681959A Semiconductor light emitting device and method of fabricating the same
03/24/2010CN101681958A Opto-electronic semiconductor body and method for the production thereof
03/24/2010CN101681957A led with porous diffusing reflector
03/24/2010CN101681956A Quantum dot light emitting device
03/24/2010CN101681918A Nanostructured led array with collimating reflectors
03/24/2010CN101681908A Illuminant
03/24/2010CN101681877A Light emitting diode with vertical structure
03/24/2010CN101681828A Method for manufacturing semiconductor element
03/24/2010CN101681817A Compound-type thin film, method for compound-type thin film formation, and electronic apparatus using the thin film
03/24/2010CN101680992A Color-tunable illumination system, lamp and luminaire
03/24/2010CN101680639A Silicon moulded part comprising luminous bodies
03/24/2010CN101680613A Lighting device
03/24/2010CN101680114A Method for manufacturing gan-based nitride semiconductor self-supporting substrate
03/24/2010CN101679861A M-c-n-o fluorescent substance
03/24/2010CN101679613A Sealing agent for optical semiconductor element, and optical semiconductor element
03/24/2010CN101678569A Method for producing an opto-electronic component and opto-electronic component
03/24/2010CN101677120A Method of producing light emitting diode
03/24/2010CN101677119A White light-emitting diode
03/24/2010CN101677118A Semiconductor luminous element
03/24/2010CN101677117A Method for configuring high color rendering light emitting diode and system
03/24/2010CN101677116A Encapsulating method and encapsulating module for LED chip
03/24/2010CN101677115A Luminous element and preparation method thereof
03/24/2010CN101677107A Layered semiconductor light emitting device and image forming apparatus
03/24/2010CN101677097A Optical package element, display device, and electronic apparatus
03/24/2010CN101677070A Method for producing light-emitting diode and packaging adhesive material thereof by utilizing lithography process
03/24/2010CN101676625A LED light-emitting lens group and array
03/24/2010CN101676616A Plane Fresnel LED optical lens and LED assembly thereof
03/24/2010CN101676615A Convex Fresnel LED optical lens for angular distribution patterns and LED assembly thereof
03/24/2010CN101676603A Encapsulation structure of emulational candle device
03/24/2010CN100595939C ZnO base luminescent part with adulteration layer structure
03/24/2010CN100595938C Semiconductor light emitting device, manufacturing method thereof, and light emitting device using the same
03/24/2010CN100595937C Semiconductor light emitting device and light emitting device
03/24/2010CN100595936C Micro optical base board and LED with L1 micro optical structure
03/24/2010CN100595935C Semiconductor light emitting device with lateral current injection in the light emitting region
03/24/2010CN100595919C LED combined light illuminating display device for generating optical flow beam
03/24/2010CN100595918C Module comprising radiation-emitting semiconductor bodies
03/24/2010CN100595259C Phosphor for white light LED and its prepn process
03/24/2010CN100595258C Alkaline earth halogen silicate phosphor powder and preparation method thereof
03/24/2010CN100595035C Method of surface treatment, crystal substrate, and semiconductor device
03/23/2010US7683981 Light emitting diode substrate, method of manufacturing the same, and liquid crystal display device using the same
03/23/2010US7683864 LED driving apparatus with temperature compensation function
03/23/2010US7683539 Light emitting device package and method for manufacturing the same
03/23/2010US7683474 LED assembly with LED position template and method of making an LED assembly using LED position template
03/23/2010US7683470 LED package
03/23/2010US7683396 High power light emitting device assembly utilizing ESD protective means sandwiched between dual sub-mounts