Patents
Patents for H01L 27 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate (229,248)
05/2007
05/31/2007US20070122993 Method of simultaneously fabricating isolation structures having rounded and unrounded corners
05/31/2007US20070122992 Electronic component manufacturing method and electronic component
05/31/2007US20070122980 Flash Memory Array with Increased Coupling Between Floating and Control Gates
05/31/2007US20070122971 Vertical soi trench sonos cell
05/31/2007US20070122970 Methods of fabricating memory devices with memory cell transistors having gate sidewall spacers with different dielectric properties
05/31/2007US20070122968 Fabrication method and structure for providing a recessed channel in a nonvolatile memory device
05/31/2007US20070122950 Method for manufacturing conductive layer and semiconductor device
05/31/2007US20070122946 Semiconductor device and method of manufacturing the same
05/31/2007US20070122945 Methods of fabricating integrated circuit devices having fuse structures including buffer layers
05/31/2007US20070122928 Electro-optical device, method of manufacturing the same, and electronic apparatus
05/31/2007US20070122919 Method of producing an integrated circuit arrangement with field-shaping electrical conductors
05/31/2007US20070122553 forming a frame having an undercut near the bottom on an electrode film, forming the patterned thin film by plating through the use of the frame; patterned thin film includes linear portions disposed side by side, and each linear portions has a portion having greater width, close to the electrode film
05/31/2007US20070122146 Camera module package
05/31/2007US20070121385 Pattern layout of world line transfer transistors in nand flash memory which executes subblock erase
05/31/2007US20070121383 Behavior based programming of non-volatile memory
05/31/2007US20070121369 Resistive memory cell arrangement and a semiconductor memory including the same
05/31/2007US20070121364 One-time programmable, non-volatile field effect devices and methods of making same
05/31/2007US20070121361 Semiconductor Memory Device, Electronic Card and Electronic Device
05/31/2007US20070121129 Color conversion layer and light-emitting device
05/31/2007US20070121111 Imaging of Biological Samples
05/31/2007US20070120994 Solid-state imaging device
05/31/2007US20070120993 Solid-state imaging device and control method for same
05/31/2007US20070120992 Driving method for solid-state image pickup device and image pickup apparatus
05/31/2007US20070120991 Photoelectric conversion device and gate voltage control method
05/31/2007US20070120990 Solid-state image pickup device and signal processing method therefor
05/31/2007US20070120681 Semiconductor device
05/31/2007US20070120605 Integrated switchless programmable attenuator and low noise amplifier
05/31/2007US20070120592 Semiconductor device with pump circuit
05/31/2007US20070120471 Display device and method for fabricating the same
05/31/2007US20070120465 Transflective display having full color oled blacklight
05/31/2007US20070120261 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
05/31/2007US20070120260 Semiconductor integrated circuit wiring design method and semiconductor integrated circuit
05/31/2007US20070120244 Semiconductor device having electrostatic breakdown protection element
05/31/2007US20070120237 Semiconductor integrated circuit
05/31/2007US20070120228 Semiconductor wafer and manufacturing method therefor
05/31/2007US20070120204 Semiconductor device and manufacturing method thereof
05/31/2007US20070120202 Semiconductor Integrated Circuit Device and Method of Testing the Same
05/31/2007US20070120189 Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same
05/31/2007US20070120188 Light-emitting device and electronic apparatus
05/31/2007US20070120187 Lateral soi semiconductor device
05/31/2007US20070120169 Trench capacitor
05/31/2007US20070120168 Metal semiconductor field effect transistors (MESFETS) having channels of varying thicknesses and related methods
05/31/2007US20070120165 Semiconductor device with ferroelectric capacitor and fabrication method thereof
05/31/2007US20070120163 Complementary metal oxide semiconductor image sensor and method for fabricating the same
05/31/2007US20070120159 CMOS image sensor having duble gate insulator therein and method for manufacturing the same
05/31/2007US20070120155 Colors only process to reduce package yield loss
05/31/2007US20070120149 Package stiffener
05/31/2007US20070120140 Semiconductor apparatus with thin semiconductor film
05/31/2007US20070120131 Semiconductor device
05/31/2007US20070120129 Rare earth doped layer or substrate for light conversion
05/31/2007US20070120128 Semiconductor memory device
05/31/2007US20070120127 Semiconductor device and semiconductor device production system
05/31/2007US20070120125 Semiconductor Integrated Circuit Device and Method of Testing the Same
05/31/2007US20070120103 Switch circuit and method of switching radio frequency signals
05/31/2007US20070120062 Subpixel routing and processing for an imaging sytstem or the like
05/31/2007US20070120059 Use of spinel ferrites as sensitive material for bolometric infrared detector devices
05/31/2007DE19958229B4 Optisches Halbleiter-Sensorbauelement A semiconductor optical sensor device
05/31/2007DE19521469B4 Hochspannungstransistorstruktur für eine Halbleitervorrichtung sowie Verfahren zu deren Herstellung High-voltage transistor structure for a semiconductor device as well as processes for their preparation
05/31/2007DE10341059B4 Integrierte Schaltungsanordnung mit Kondensator und Herstellungsverfahren Integrated circuit arrangement having a capacitor and manufacturing method
05/31/2007DE102006055957A1 Verfahren zur Charakterisierung eines lokalen Magnetfeldes und Vorrichtung zur Durchführung des Verfahrens A method for characterizing a local magnetic field, and apparatus for carrying out the method
05/31/2007DE102006055407A1 Organic light-emitting diode (OLED) e.g., for displays and monitors, has OLED-element arranged in seated space between two glass discs
05/31/2007DE102005057073A1 Forming semiconductor component comprises forming metal silicide on two transistors while other is masked and then forming contact layers of given internal tension
05/31/2007DE102005056908A1 Integrated circuit and production process has Shockley diode or thyristor especially for electrostatic discharge, ESD, protection with inner region screened by tub implantation
05/31/2007DE102005056906A1 Integrated circuit used as a block-type capacitor between two operating potential lines of the integrated circuit comprises two capacitors arranged in series forming a circuit node electrically insulated from other components of the circuit
05/31/2007DE102005056262A1 Production of layer arrangement, such arrangement and electronic component, comprises covers carbon layer with protective layer of carbide before applying electrically isolating layer
05/31/2007DE102005055838A1 Production of a contact site in a surface region of a semiconductor structure in the production of power transistors comprises forming a recess in a surface region up to a prescribed recess depth, implanting a dopant and further processing
05/31/2007DE102005055302A1 Multi-bit memory element and production process has U-shaped trench structure with conductive region and insulating region containing at least two floating gates
05/31/2007DE102005055278A1 Organischer pixelierter Flachdetektor mit erhöhter Empfindlichkeit Organic pixelated flat detector with increased sensitivity
05/31/2007DE102005037573B4 Thyristor mit Freiwerdeschutz in Form eines Thyristorsystems und Verfahren zur Herstellung des Thyristorsystems Thyristor with free Become protection in the form of a Thyristorsystems and method for producing the Thyristorsystems
05/31/2007DE102004030860B4 Verfahren zum Schützen eines Metallisierungsgebiets in einer Halbleiterstrukturmit mindestens einem Metallisierungsgebiet A method of protecting a Metallisierungsgebiets in a Halbleiterstrukturmit least one Metallisierungsgebiet
05/30/2007EP1791404A1 Electronic component and manufacturing method thereof
05/30/2007EP1791345A1 Image sensor pixel with multiple outputs
05/30/2007EP1791182A2 Method of fabricating organic light emittind diode (oled)
05/30/2007EP1791181A1 Transistor structure with high input impedance and high current capability and manufacturing process thereof
05/30/2007EP1790953A1 Opto-electrical angle measuring apparatus
05/30/2007EP1790016A1 Multijunction laser light detector with multiple voltage device implementation
05/30/2007EP1790015A1 Solar cell assembly and method for connecting a string of solar cells
05/30/2007EP1790011A1 Semiconductor radiation detector with a modified internal gate structure
05/30/2007EP1790010A2 Integrated semiconductor cascode circuit for high-frequency applications
05/30/2007EP1790009A1 Integrated circuit resistor
05/30/2007EP1789474A1 Linear polysiloxanes, silicone composition, and organic light-emitting diode
05/30/2007EP1684467B1 Power saving via variable listen intervals in a WLAN
05/30/2007EP1639648A4 Integrated circuit having pairs of parallel complementary finfets
05/30/2007EP1500116B1 Method of forming mram devices
05/30/2007EP1380053B1 Nanoelectronic devices and circuits
05/30/2007EP1279176B1 Magnetic element with insulating veils and fabricating method thereof
05/30/2007EP1263048B1 Ferroelectric memory device and its manufacturing method, and hybrid device
05/30/2007CN2906930Y Photoelectric diode structure
05/30/2007CN2906929Y 沟槽电容结构 Trench capacitor structure
05/30/2007CN2906928Y 集成电路芯片 IC chip
05/30/2007CN2906675Y High brightness display with novel sub-pixel layout and arrangement
05/30/2007CN1973532A Solid-state image pickup device and sampling circuit
05/30/2007CN1973374A Semiconductor device with multiple semiconductor layers
05/30/2007CN1973373A Solid state imaging device, manufacturing method of the same, and substrate for solid state imaging device
05/30/2007CN1973312A Display
05/30/2007CN1972540A Transferring substrate, transferring method, and method for manufacturing display device
05/30/2007CN1972387A Solid imaging element and device
05/30/2007CN1972044A Semiconductor device and method of fabricating the same
05/30/2007CN1971970A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/30/2007CN1971969A Light-emitting element and display device