Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 27 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
Patents for H01L 27 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate (229,248)
09/2007
09/04/2007US7265395 Semiconductor device
09/04/2007US7265391 Light emitting device and method of manufacturing the same
09/04/2007US7265390 Light emitting device
09/04/2007US7265389 Light emitting diode and fabricating method thereof
09/04/2007US7265385 Active matrix type display device and method of manufacturing the same
09/04/2007US7265384 Thin film transistor and organic electroluminescence display using the same
09/04/2007US7265383 Light emitting device
09/04/2007US7265376 Non-volatile memory cell, memory cell arrangement and method for production of a non-volatile memory cell
09/04/2007US7265372 Method and apparatus for image recording and image recording medium
09/04/2007US7265340 Optical device and method for fabricating the same
09/04/2007US7265330 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
09/04/2007US7265328 Method and apparatus providing an optical guide for an imager pixel having a ring of air-filled spaced slots around a photosensor
09/04/2007US7265327 Photodetecting sensor array
09/04/2007US7265063 Method of forming a component having dielectric sub-layers
09/04/2007US7265051 Semiconductor memory device and method of manufacturing the same
09/04/2007US7265050 Methods for fabricating memory devices using sacrificial layers
09/04/2007US7265047 Post passivation interconnection schemes on top of the IC chips
09/04/2007US7265041 Gate layouts for transistors
09/04/2007US7265039 Method for fabricating semiconductor device with improved refresh time
09/04/2007US7265031 Methods of fabricating semiconductor-on-insulator (SOI) substrates and semiconductor devices using sacrificial layers and void spaces
09/04/2007US7265025 Method for filling trench and relief geometries in semiconductor structures
09/04/2007US7265022 Method of fabricating semiconductor device with STI structure
09/04/2007US7265017 Method for manufacturing partial SOI substrates
09/04/2007US7265010 High performance vertical PNP transistor method
09/04/2007US7265006 Method of fabricating heterojunction devices integrated with CMOS
09/04/2007US7265000 Vertically stacked field programmable nonvolatile memory and method of fabrication
09/04/2007US7264996 Method for separating wafers bonded together to form a stacked structure
09/04/2007US7264990 Methods of nanotubes films and articles
09/04/2007US7264981 Flat panel display device and method of manufacturing the same
09/04/2007US7264979 Method of manufacturing light emitting device
09/04/2007US7264844 Forming oxide buffer layer for improved magnetic tunnel junctions
09/04/2007US7264843 Preparing an organic electroluminescent element including an organic layer having an organic electroluminescent layer sandwiched between a pair of electrodes;wherein the organic electroluminescent element corresponds to a film formation region that is formed of multiple layers of a film forming material
09/04/2007US7264440 Fuel pump
09/04/2007US7264381 Light emitting diode assembly using alternating current as the power source
09/04/2007CA2425609C Method for locating defects and measuring resistance in a test structure
08/2007
08/30/2007WO2007098305A2 Method and apparatus for forming a semiconductor-on-insulator (soi) body-contacted device
08/30/2007WO2007097782A1 Segmented radiation detector with side shielding cathode
08/30/2007WO2007097179A1 Method for manufacturing soi substrate
08/30/2007WO2007097062A1 Solid-state imaging device
08/30/2007WO2007096984A1 Buffer device, buffer arrangement method, and information processing device
08/30/2007WO2007096967A1 Radiation detector
08/30/2007WO2007096581A2 Radio frequency integrated circuit manufacturing
08/30/2007WO2007095780A1 High power pin type led
08/30/2007WO2007075996A3 Apparatus and method for a fast recovery rectifier structure
08/30/2007WO2005122285A3 Methods and devices for fabricating and assembling printable semiconductor elements
08/30/2007US20070203662 Testing circuit and testing method for semiconductor device and semiconductor chip
08/30/2007US20070202696 Method of manufacturing solid-state imaging device and solid-state imaging device
08/30/2007US20070202685 High performance system-on-chip inductor using post passivation process
08/30/2007US20070202684 High performance system-on-chip inductor using post passivation process
08/30/2007US20070202667 Method of manufacturing a semiconductor device
08/30/2007US20070202634 Method of manufacturing semiconductor device with offset sidewall structure
08/30/2007US20070202625 Active matrix organic luminescence display device and manufacturing method for the same
08/30/2007US20070201268 Spin Based Magnetic Sensor
08/30/2007US20070201255 Chalcogenide glass constant current device, and its method of fabrication and operation
08/30/2007US20070201168 Magnetization Direction Control Method And Application Thereof To Mram
08/30/2007US20070200983 Display apparatus and method for manufacturing the same
08/30/2007US20070200805 Organic electroluminescent light emitting display device
08/30/2007US20070200491 Display device and method for manufacturing thereof
08/30/2007US20070200477 Nanofabrication
08/30/2007US20070200201 Structure and method for performance improvement in vertical bipolar transistors
08/30/2007US20070200189 Semiconductor device and method of manufacturing semiconductor device
08/30/2007US20070200178 Gate-all-around type of semiconductor device and method of fabricating the same
08/30/2007US20070200177 Semiconductor laser device and semiconductor laser device manufacturing method
08/30/2007US20070200176 Formation of silicided surfaces for silicon/carbon source/drain regions
08/30/2007US20070200175 Functional device and method of manufacturing it
08/30/2007US20070200174 SOI substrate, mask blank for charged particle beam exposure, and mask for charged particle beam exposure
08/30/2007US20070200173 Embedded substrate interconnect for underside contact to source and drain regions
08/30/2007US20070200172 Thin film power MOS transistor, apparatus, and method
08/30/2007US20070200148 Element for solid-state imaging device
08/30/2007US20070200147 Method For Manufacturing An Optical Film, Apparatus For Manufacturing The Same Optical Film, Polarizing Plate And Image Display Device
08/30/2007US20070200146 Electronic device, method for producing the same, and communication apparatus including the same
08/30/2007US20070200139 Semiconductor device, manufacturing method thereof, and display device
08/30/2007US20070200132 Electrical connection for optoelectronic devices
08/30/2007US20070200123 Organic Electroluminescence Display Device
08/30/2007US20070200122 Light emitting device and method of manufacturing the same
08/30/2007US20070200121 Multi-colored LED array with improved color uniformity
08/30/2007US20070200113 Semiconductor device and fabrication method thereof
08/30/2007US20070200055 Via wave guide with cone-like light concentrator for image sensing devices
08/30/2007US20070200054 Via wave guide with curved light concentrator for image sensing devices
08/30/2007US20070200053 Image pickup apparatus, camera module, electronic device, and fabrication method for image pickup apparatus
08/30/2007DE19811078B4 Halbleiterbauelement Semiconductor device
08/30/2007DE112006000072T5 Phasenwechselspeicherzelle, die durch ein Strukturschrumpfungsmaterialverfahren definiert wird Phase change memory cell, which is defined by a pattern shrink material process
08/30/2007DE112005001926T5 Verfahren zur Herstellung von Kontaktöffnungen mit geringem Abstand in einem Flash-Speicher Process for the preparation of contact holes with a small distance in a flash memory
08/30/2007DE10258412B4 Verfahren zur Herstellung einer Halbleitervorrichtung, insbesondere einer DRAM-Vorrichtung mit einer COB-Struktur A method of manufacturing a semiconductor device, in particular a DRAM device with a COB structure
08/30/2007DE102006005033A1 Semiconductor device arrangement, has temperature measuring arrangement with temperature measuring resistor which is formed over part of semiconductor zone, where evaluation circuit is coupled to temperature measuring resistor
08/29/2007EP1826830A2 Photovoltaic apparatus and method of manufacturing the same
08/29/2007EP1826828A2 Photovoltaic apparatus
08/29/2007EP1826821A2 Electroluminescent device and method for its manufacture
08/29/2007EP1826820A1 Solid-state image pickup device and mask manufacturing method
08/29/2007EP1826819A2 Semiconductor memory device and manufacturing method thereof
08/29/2007EP1826818A2 Semiconductor device and manufacturing method thereof
08/29/2007EP1826738A1 Display device and display device manufacturing method
08/29/2007EP1826580A2 Testing circuit and testing method for semiconductor device and semiconductor chip
08/29/2007EP1826579A1 Multiple-capture DFT system for detecting or locating crossing clock-domain faults during self-test or scan test
08/29/2007EP1825719A1 Illumination system
08/29/2007EP1825667A2 Substitution of defective readout circuits in imagers
08/29/2007EP1825522A2 Lateral trench field-effect transistors in wide bandgap semiconductor materials, methods of making, and integrated circuits incorporating the transistors
08/29/2007EP1825516A2 Organic field effect transistor gate
08/29/2007EP1825515A2 Single chip led as compact color variable light source
08/29/2007EP1825514A1 A microlens array
1 ... 924 925 926 927 928 929 930 931 932 933 934 935 936 937 938 939 940 941 942 943 944 ... 2293