Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 27 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
Patents for H01L 27 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate (229,248)
10/2007
10/11/2007US20070235766 Semiconductor integrated circuit having an oblique global signal wiring and semiconductor integrated circuit wiring method
10/11/2007US20070235765 Memory cells and semiconductor memory device using the same
10/11/2007US20070235764 Integrated Circuit Having Gates and Active Regions Forming a Regular Grating
10/11/2007US20070235763 Substrate band gap engineered multi-gate pMOS devices
10/11/2007US20070235756 Solid-state imaging device, camera and signal processing method
10/11/2007US20070235742 Light emitting device
10/11/2007US20070235737 Array substrate for liquid crystal display device and the fabrication method of the same
10/11/2007US20070235736 Active matrix type display device and method of manufacturing the same
10/11/2007US20070235734 Semiconductor device and method of manufacturing the same
10/11/2007US20070235709 Memory element with improved contacts
10/11/2007US20070235653 Manufacture of Cadmium Mercury Telluride on Patterned Silicon
10/11/2007US20070235635 High Responsivity High Bandwidth Metal-Semiconductor-Metal Optoelectronic Device
10/11/2007US20070235631 Reducing noise in an imager
10/11/2007US20070234538 Plurality of capacitors employing holding layer patterns and method of fabricating the same
10/11/2007DE19903629B4 Integrierte Halbleiterschaltungsvorrichtung A semiconductor integrated circuit device
10/11/2007DE10333232A1 Organisches Elektrolumineszenzelement An organic electroluminescent
10/11/2007DE10308323B4 Halbleiterchipanordnung mit ROM Semiconductor chip assembly with ROM
10/11/2007DE102006030015A1 Verfahren zur Herstellung von Speicherbauelementen und Halbleiterspeicherbauelement Process for the preparation of memory devices and semiconductor memory device
10/11/2007DE102006019122A1 Verfahren zur Herstellung einer integrierten Speichervorrichtung und Speichervorrichtung A method of manufacturing an integrated storage device and storage device
10/11/2007DE102006018235B3 Semiconductor memory component, has substrate at main side, where lower bit lines are formed in substrate and arranged parallel to each other at distance, and word lines arranged over lower bit lines and transverse to lower bit lines
10/11/2007DE102006017795A1 Halbleiterpeicherbauelement und Herstellungsverfahren Halbleiterpeicherbauelement and manufacturing processes
10/11/2007DE102006016530A1 Storage capacitor for dynamic RAM memory module, has two memory electrodes, memory dielectric arranged between two memory electrodes, and intermediate layer made of pure carbon, where one electrode layer completely covers dielectric
10/11/2007DE102006015077A1 Technik zur Bereitstellung von Verspannungsquellen in Transistoren in unmittelbarer Nähe zu einem Kanalgebiet durch Vertiefen von Drain- und Source-Gebieten Technique for providing tension springs in transistors in close proximity to a channel region by recessing drain and source regions
10/11/2007DE102006015076A1 Halbleiterbauelement mit SOI-Transistoren und Vollsubstrattransistoren und ein Verfahren zur Herstellung A semiconductor device with SOI transistors, and bulk transistors and a process for preparing
10/11/2007DE102005063400A1 Halbleiterbauelementanordnung und Verfahren zu deren Herstellung A semiconductor device assembly and method for their preparation
10/11/2007DE102005059034B4 SOI-Isolationsgrabenstrukturen SOI insulation grave structures
10/11/2007DE10154879B4 Halbleiterspeicherbauelement mit Bitleitungen The semiconductor memory device with bit lines
10/11/2007DE10146226B4 Vertikale intern verbundene Grabenzelle und Herstellungsverfahren dafür Vertical internally connected grave cell and manufacturing method thereof
10/11/2007DE10132763B4 Integrierte Halbleiterschaltung, Verfahren zum Kühlen eines Mikrowellenschaltungsbereiches und Verfahren zum Herstellen einer integrierten Halbleiterschaltung A semiconductor integrated circuit, method of cooling a microwave circuit section and method for manufacturing a semiconductor integrated circuit
10/11/2007DE10057806B4 Ferroelektrische Speicheranordnung und Verfahren zu ihrer Herstellung The ferroelectric memory device and methods for their preparation
10/10/2007EP1843470A1 Power system inhibit method and device and structure therefor
10/10/2007EP1843396A2 Organic electroluminscence device and method for manufacturing the same
10/10/2007EP1843395A2 Memory having storage locations within a common volume of phase change material
10/10/2007EP1843389A1 Method and system of providing doping concentration based on diffusion, surface oxidation and etch-back steps, and method of producing solar cells
10/10/2007EP1843194A1 Liquid crystal display device, semiconductor device, and electronic appliance
10/10/2007EP1842854A1 Light-emitting material
10/10/2007EP1842241A1 Monolithic multiple solar cells
10/10/2007EP1224700A4 Lateral rf mos device with improved breakdown voltage
10/10/2007EP1205576B1 Method for producing ceramic
10/10/2007CN200959335Y Deep sub-micron metal-insulator-metal structured capacitor
10/10/2007CN101053113A 传输线 Transmission line
10/10/2007CN101053112A Transmission line pair and transmission line group
10/10/2007CN101053093A Light emitting element and light emitting device using the same
10/10/2007CN101053091A Light-emitting element and light emitting device using the same
10/10/2007CN101053082A Electronic device including a self-assembled monolayer, and a method of fabricating the same
10/10/2007CN101053081A Solid-state image pickup device
10/10/2007CN101053080A Electronic package for image sensor, and the packaging method thereof
10/10/2007CN101053077A Method of forming narrowly spaced flash memory contact openings
10/10/2007CN101053076A 半导体集成电路 The semiconductor integrated circuit
10/10/2007CN101053071A 等离子体处理方法 The plasma processing method
10/10/2007CN101052862A Infrared sensor and its drive method
10/10/2007CN101051985A Method for realizing virtual special net access
10/10/2007CN101051961A Loopback control method and device
10/10/2007CN101051931A System and method for realizing business protection using LCAS protocol
10/10/2007CN101051676A Organic electroluminescence pixel, organic electroluminescence element and its producing method
10/10/2007CN101051671A Transistor, pixel electrode substrate, electro-optic device, electronic apparatus, and process for manufacturing semiconductor element
10/10/2007CN101051654A Semiconductor resistance and semiconductor making process for making same
10/10/2007CN101051653A Single gate non-volatile flash memory cell
10/10/2007CN101051652A Semiconductor device and a method of manufacturing the same
10/10/2007CN101051649A Organic electric exciting light emitting device, photoelectric device and its forming method
10/10/2007CN101051648A Organic lighting element color pixel array mode and its forming method
10/10/2007CN101051647A 有机发光显示装置及其测试方法 The organic light emitting display device and test methods
10/10/2007CN101051646A Phase change memory fabricated using self-aligned processing
10/10/2007CN101051645A Pixel array substrate
10/10/2007CN101051644A Thin film transistor substrate and method of fabricating the same
10/10/2007CN101051643A 半导体装置 Semiconductor device
10/10/2007CN101051642A Thin film transistor array base board and its repairing method
10/10/2007CN101051641A Semiconductor device and a method of manufacturing the same
10/10/2007CN101051640A Non-volatile internal memory structure and its operation method
10/10/2007CN101051639A Single gate pole non-volatile internal storage and its operation method
10/10/2007CN101051638A Semiconductor part
10/10/2007CN101051637A Semiconductor device and method of fabricating the same
10/10/2007CN101051635A Solid-state image pickup device and method for manufacturing thereof
10/10/2007CN101051626A Semiconductor structure of display device and its producing method and pixel capacitance structure
10/10/2007CN101051625A Method for preparing capacitor structure of semiconductor storage
10/10/2007CN101051624A 互补式金属氧化物半导体元件及其形成方法 CMOS device and method of forming
10/10/2007CN101051605A Ditching type capacitor and its producing method
10/10/2007CN101051527A Electronic device with low-voltag transistor realizing
10/10/2007CN101051440A Scan driving circuit and organic light emitting display using the same
10/10/2007CN101051134A Liquid crystal display device, semiconductor device, and electronic appliance
10/10/2007CN101051094A Lens structure for an imaging device and method making same
10/10/2007CN100342551C Semiconductor device and method for mfg. same
10/10/2007CN100342549C Structure of partial SOI power apparatus and implementing method
10/10/2007CN100342548C Operatable grating contact of SOI
10/10/2007CN100342546C Charge-coupled device and its mfg. method
10/10/2007CN100342545C Trench DMOS device with improved drain contact
10/10/2007CN100342543C Package apparatus capable of selecting optimized distance to pack optical sensing module
10/10/2007CN100342542C Solid camera element and its mfg. method
10/10/2007CN100342541C Semiconductor memory
10/10/2007CN100342540C Semiconductor device and method of manufacturing the same
10/10/2007CN100342539C Semiconductor device and mfg. method thereof
10/10/2007CN100342535C Turn-on-efficient bipolar structures with deep N-well for on-chip ESD protection
10/10/2007CN100342525C Control circuit for organic electroluminescent diode and producing method thereof
10/10/2007CN100342524C Structure and method for local resistor element in integrated circuit technology
10/10/2007CN100342523C Three dimensional CMOS integrated circuits having device layers built on different crystal oriented wafers
10/10/2007CN100342520C Method for forming conductive material in opening and structure regarding same
10/10/2007CN100342509C Assembling method for contact image sensor and structure thereof
10/10/2007CN100342494C Strained si based layer made by UHV-CVD, and devices therein
10/10/2007CN100342484C Semiconductor device and mfg method thereof
10/10/2007CN100342463C Method and system for patterning of magnetic thin films using gaseous transformation
1 ... 911 912 913 914 915 916 917 918 919 920 921 922 923 924 925 926 927 928 929 930 931 ... 2293