Patents
Patents for H01L 27 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate (229,248)
11/2006
11/16/2006US20060255354 Semiconductor device and method for manufacturing the same
11/16/2006US20060255347 Multi element, multi color solid state LED/laser
11/16/2006US20060255330 Embedded silicon germanium using a double buried oxide silicon-on-insulator wafer
11/16/2006US20060255280 Photodiode array, method for manufacturing same, and radiation detector
11/16/2006US20060255243 Image displaying apparatus
11/16/2006US20060255242 Image display apparatus and image pickup apparatus having the same
11/16/2006US20060255241 Integrated circuit device, microcomputer, and monitoring camera system
11/16/2006US20060255240 Back-illuminated image device
11/16/2006US20060255239 Image pick-up apparatus and manufacturing method thereof, radiation image pick-up apparatus, and radiation image pick-up system
11/16/2006US20060254812 Printed circuit boards having embedded thick film capacitors
11/16/2006US20060254508 Thin film formation method by ink jet method, ink jet apparatus, production method of organic EL device, and organic EL device
11/16/2006US20060254497 Semiconductor thin film decomposing method, decomposed semiconductor thin film, decomposed semiconductor thin film evaluation method, thin film transistor made of decomposed semiconductor thin film, and image display device having circuit constituted of thin film transistors
11/16/2006DE4320060B4 Verfahren zur Herstellung eines Halbleiterspeicherzellenkondensators A method for fabricating a semiconductor memory cell capacitor
11/16/2006DE19957123B4 Verfahren zur Herstellung einer Zellenanordnung für einen dynamischen Halbleiterspeicher A process for preparing a cell arrangement for dynamic semiconductor memory
11/16/2006DE19842481B4 Stapelbarer Halbleiterchip und Verfahren zur Herstellung eines gestapelten Halbleiterchipmoduls A stackable semiconductor chip and method of manufacturing a stacked semiconductor chip module
11/16/2006DE10345162B4 Herstellungsverfahren für einen Grabenkondensator mit einem Isolationskragen, der über einen vergrabenen Kontakt einseitig mit einem Substrat elektrisch verbunden ist, insbesondere für eine Halbleiterspeicherzelle Manufacturing method for a grave capacitor with an insulation collar, which is electrically connected through a buried contact on one side with a substrate, in particular for a semiconductor memory cell
11/16/2006DE10322983B4 Herstellungsverfahren für eine Halbleiterstruktur und enstprechende Halbleiterstruktur Manufacturing method of a semiconductor structure and semiconductor structure enstprechende
11/16/2006DE10236678B4 DRAM-Zellenstruktur mit eingebettetem umgebenden Kondensator und Verfahren zu deren Herstellung DRAM cell structure with embedded surrounding capacitor and process for their preparation
11/16/2006DE102006021070A1 Semiconductor device, e.g. flash memory device, has parasitic transistor formed close to deep trench isolation structure, where doped polysilicon material fills cover section of structure to increase threshold voltage of transistor
11/16/2006DE102006017281A1 Image transfer transistor for CMOS image sensor, has thin nitride layer formed on gate insulating layer by decoupled plasma nitridation process, which operates as barrier and blocks out diffusion of dopants from gate layer
11/16/2006DE102005028999A1 Flash memory device has control gates formed over interlayer dielectric film to surround top and sides of floating gates formed over tunnel dielectric film on semiconductor substrate
11/16/2006DE102005021298A1 Optoelektronisch gesteuerter Schalter oder Modulator und Abschwächer Opto-controlled switch or modulator and attenuators
11/16/2006DE102005020897A1 Verfahren zur Herstellung eines Halbleiterbauelements und ein entsprechendes Halbleiterbauelement A process for producing a semiconductor device and a corresponding semiconductor component
11/16/2006DE102004034397B4 Bildsensormodul mit einem Waferebenenpaket Image sensor module with a wafer-level package
11/16/2006DE10023350B4 Temperaturkompensierter Quarzoszillator A temperature compensated crystal oscillator
11/15/2006EP1722604A1 Organic electroluminescence display device
11/15/2006EP1722422A2 Integrated circuit comprising a floating photodiode and manufacturing method thereof
11/15/2006EP1722421A2 Floating integrated photodiode
11/15/2006EP1722420A1 Optoelectronic device and production method
11/15/2006EP1722419A1 Surface passivated photovoltaic devices
11/15/2006EP1722418A2 Semiconductor memory device
11/15/2006EP1722417A2 Overheat detecting circuit
11/15/2006EP1722405A1 Film-forming method
11/15/2006EP1722246A2 Method and apparatus for selectively compacting test responses
11/15/2006EP1721866A1 MEMS device having a trilayered beam and related methods
11/15/2006EP1721336A2 Twin eeprom memory transistors with subsurface stepped floating gates
11/15/2006EP1721324A1 Method and inductor layout for reduced vco coupling
11/15/2006EP1665346A4 Improved method of forming openings in an organic resin material
11/15/2006EP1472732B1 Device for connecting an ic terminal to a reference potential
11/15/2006EP1417712B1 Integrated arrays of modulators and lasers on electronics
11/15/2006EP1415339B1 Method for the parallel production of an mos transistor and a bipolar transistor
11/15/2006EP1353791A4 Noise floor reduction in image sensors
11/15/2006EP1282901B1 Lead zirconate titanate dielectric thin film composites on metallic foils
11/15/2006EP1234335B1 Method of manufacturing a semiconductor device using a halo implantation
11/15/2006EP1212797B1 Esd-protective arrangement for signal inputs and outputs in semiconductor devices with substrate separation
11/15/2006EP1114455B1 Method for producing a storage cell
11/15/2006CN1864403A Photo detecting apparatus
11/15/2006CN1864331A Integrated circuit with electrostatic discharge protection
11/15/2006CN1864282A Organic light emitting diode
11/15/2006CN1864271A Fowler-nordheim block alterable EEPROM memory cell
11/15/2006CN1864269A SOI-LDMOS device
11/15/2006CN1864265A 能量线检测元件 Energy ray detection element
11/15/2006CN1864264A Structure of package for semiconductor image pickup device and fabrication method thereof
11/15/2006CN1864263A Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
11/15/2006CN1864262A Electronically programmable antifuse and circuits made therewith
11/15/2006CN1864261A Wiring protection element for laser deleted tungsten fuse
11/15/2006CN1864260A Module integration integrated circuits
11/15/2006CN1864240A Imager photo diode capacitor structure with reduced process variation sensitivity
11/15/2006CN1864230A Self assembly of conducting polymer for formation of polymer memory cell
11/15/2006CN1864115A Power system inhibit method and device and structure therefor
11/15/2006CN1863161A Method for processing service
11/15/2006CN1863145A Method for correcting service quality in interworking WLAN
11/15/2006CN1862847A Display device
11/15/2006CN1862846A Self-aligned magnetic clad write line and method thereof
11/15/2006CN1862843A Gallium nitride base blue light LED
11/15/2006CN1862838A Vertical diode, matrix position sensitive apparatus and manufacturing method of the same
11/15/2006CN1862837A Memory cells and memory arrays
11/15/2006CN1862836A Flash-speicherbauelement und verfahren zur herstellung desselben
11/15/2006CN1862835A Thin film transistor (tft) and flat panel display including the tft
11/15/2006CN1862833A 半导体器件 Semiconductor devices
11/15/2006CN1862832A High-voltage semiconductor device and method of manufacturing the same
11/15/2006CN1862826A Dispositif a semiconducteur a separation dielectrique et procede de fabrication
11/15/2006CN1862825A Light emitting device and manufacturing method thereof and light emitting display and manufacturing method thereof
11/15/2006CN1862824A Organic electroluminescent display for colour displaying and making method
11/15/2006CN1862823A Image sensor having embedded lens
11/15/2006CN1862822A Embedded silicon germanium using a double buried oxide silicon-on-insulator wafer
11/15/2006CN1862821A Semiconductor device and method for manufacturing the same
11/15/2006CN1862820A Flash memory device and method of manufacturing the same
11/15/2006CN1862819A Non-volatility semiconductor memory cell and mfg. method thereof
11/15/2006CN1862818A Semiconductor device and a method of manufacturing the same
11/15/2006CN1862817A NOR flash memory and mfg. method thereof
11/15/2006CN1862816A Memory element and mfg. method thereof
11/15/2006CN1862815A Non-volatility memory cell and operating method thereof
11/15/2006CN1862814A Semiconducter device and mfg. method thereof
11/15/2006CN1862813A 半导体装置 Semiconductor device
11/15/2006CN1862812A Multi-stage cross cascade circuit and coordination controlling method
11/15/2006CN1862806A Electrostatic discharge protection circuit and semiconductor circuit with same
11/15/2006CN1862804A Semiconductor device and manufacturing method of the same
11/15/2006CN1862801A IC element with pin position correcting function
11/15/2006CN1862790A Semiconductor device and method of manufacturing the same
11/15/2006CN1862789A Multi-layered thin films, thin film transistor array panel including the same, and method of manufacturing the panel
11/15/2006CN1862788A Isolation film in semiconductor device and method of forming the same
11/15/2006CN1862787A Non-volatility memory body and mfg. method and operating method thereof
11/15/2006CN1862764A Trench capacitors with buried isolation layer and methods for manufacturing the same
11/15/2006CN1862704A Threshold voltage shift in NROM cells
11/15/2006CN1862331A Multi-domain member for a display device
11/15/2006CN1862292A Method of manufacturing a microlens substrate, and its application
11/15/2006CN1285171C Oscillator circuit, booster circuit, nonvolatile memory device, and semiconductor device
11/15/2006CN1285128C Active CMOS pixel unit and its making process
11/15/2006CN1285127C Film semiconductor device and method for manufacturing said device