H01G 4 - Fixed capacitors; Processes of their manufacture

Patents for H01G 4 - Fixed capacitors; Processes of their manufacture (22,458)
11/2006
11/29/2006	CN1870191A Method of production of multilayer ceramic electronic device
11/29/2006	CN1870190A Laminated ceramic capacitor and manufacturing method therefor
11/29/2006	CN1287398C Sol-gel enclosed treatment process for electronic element method
11/28/2006	US7141899 Component carrier
11/28/2006	US7141129 outer dielectric layer may include at least one of CaO, MgO, ZrO2, BaO, and SiO2, and the inner dielectric layer may include BaTiO3
11/28/2006	US7140097 Method of manufacturing chip-type ceramic electronic component
11/23/2006	WO2006123597A1 Digital signal processor
11/23/2006	WO2006123451A1 Stacked type solid electrolytic capacitor and method for manufacturing same
11/23/2006	WO2006029834A3 Fine-particled alkaline-earth titanates and method for the production thereof using titan oxide particles
11/23/2006	US20060264317 Oxides of barium, titanium, copper, and manganese; high reliability when operated with high voltage direct current or high frequency, high voltage alternating current
11/23/2006	US20060262491 Solid electrolytic capacitor and method for manufacturing the same
11/23/2006	US20060262490 Stacked capacitor and method of fabricating the same
11/23/2006	US20060262488 Chip solid electrolyte capacitor and production method of the same
11/23/2006	US20060262482 Capacitor device
11/23/2006	US20060262481 Film carrier tape with capacitor circuit and method for manufacturing the same, and surface-mounted film carrier tape with capacitor circuit and method for manufacturing the same
11/23/2006	DE4416667B4 Festkörperelektrolytkondensator Solid electrolytic capacitor
11/23/2006	DE19937999B4 Dielektrische Keramikzusammensetzung und dieselbe verwendender laminierter Keramikkondensator A dielectric ceramic composition and the same laminated ceramic capacitor using Direction
11/23/2006	DE112004002338T5 Elektronische Komponente Electronic component
11/22/2006	EP1724320A1 Heat-peelable pressure-sensitive adhesive sheet and method of processing adherend with the heat-peelable pressure-sensitive adhesive sheet
11/22/2006	EP1724319A1 Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet
11/22/2006	EP1724244A1 Dielectric particle aggregate, low temperature sinterable dielectric ceramic composition using same, low temperature sintered dielectric ceramic produced by using same
11/22/2006	EP1118089B1 Method of manufacturing ceramic electronic components
11/22/2006	CN1866584A Capacitor device
11/22/2006	CN1285544C Single-crystal ceramic powder preparation method, single-crystal ceramic powder and its composite material and electronic component
11/21/2006	US7139164 Solid electrolytic capacitor
11/21/2006	US7139163 Solid electrolytic capacitor
11/21/2006	US7139161 Semiconductor device and method of manufacturing the same
11/21/2006	US7139160 Electronic component
11/21/2006	US7138713 Chip-type solid electrolytic capacitor and method of producing the same
11/21/2006	US7138677 Capacitor arrangement with capacitors arranged one in the other
11/16/2006	WO2006120883A1 Method for manufacturing thin-film capacitor
11/16/2006	WO2006119753A2 Electrical feedthrough component with a multilayer structure and method for the production thereof
11/16/2006	US20060257659 Small particle size, narrow particle size distribution, spherical morphology and good crystallinity; for making electroluminescent display devices
11/16/2006	US20060256506 Solid electrolyte capacitor and process for producing same
11/16/2006	US20060256504 Laminated ceramic capacitor and manufacturing method therefor
11/16/2006	US20060256503 Capacitor
11/16/2006	US20060256502 Capacitor having separate terminals on three or more sides and methods of fabrication
11/16/2006	US20060256501 Method and apparatus for connecting capacitor electrodes
11/16/2006	US20060254812 Printed circuit boards having embedded thick film capacitors
11/16/2006	US20060254701 Method for manufacturing multi-layered unit for multi-layered ceramic electronic component
11/16/2006	US20060254693 Method of production of multilayer ceramic electronic device
11/16/2006	DE102005022142A1 Elektrisches Durchführungsbauelement und Verfahren zu dessen Herstellung Electrical feedthrough component, and process for its preparation
11/16/2006	DE102005022000A1 Electronic unit e.g. thin-film transistor, manufacturing method, involves pressing semiconducting layer of output structure toward conducting layer of another structure, such that embossed structure cuts off and intercepts conducting layer
11/15/2006	EP1722413A2 Terminal connection structure for semiconductor device
11/15/2006	EP1721878A1 Insulating ceramic composition, insulating ceramic sintered body, and multilayer ceramic electronic component
11/15/2006	EP1721325A1 Housing for high performance components
11/15/2006	EP1282901B1 Lead zirconate titanate dielectric thin film composites on metallic foils
11/15/2006	CN2838011Y Laminated wafer electronic component with inner poles
11/15/2006	CN1863954A System and process for producing nanowire composites and electronic substrates therefrom
11/15/2006	CN1284839C Pressure-sensitive adhesive tape for provisionally fixing green sheet for ceramic electronic part and process for producing ceramic electronic part
11/14/2006	US7136276 Solid electrolytic capacitor and mounting method therefor
11/14/2006	US7136275 Polymeric dielectric material for high-energy density capacitors
11/14/2006	US7136274 Embedded multilayer printed circuit
11/14/2006	US7136273 Hybrid spring contact system for EMI filtered hermetic seals for active implantable medical devices
11/14/2006	US7136272 Low parasitic inductance capacitor with central terminals
11/14/2006	US7135808 Lead terminal, resonator and train of electronic components
11/14/2006	US7135754 Chip type solid electrolytic capacitor having a small size and a simple structure
11/14/2006	US7135413 Cleaning solution for removing damaged portion of ferroelectric layer and cleaning method using the same
11/14/2006	US7135272 Method for forming a photoresist pattern and method for forming a capacitor using the same
11/14/2006	US7135207 Introducing reactant containing a metal-organic compound into reaction chamber including a substrate; introducing reactant containing alcohol; generating metal oxide by a chemical reaction between reactants which is deposited as thin film
11/14/2006	CA2381117C Improved multiple terminal capacitor structure
11/09/2006	WO2006118237A1 Capacitor layer forming material and production method for the capacitor layer forming material
11/09/2006	WO2006118236A1 Method for oxide dielectric layer formation, and capacitor layer forming material comprising oxide dielectric layer formed by said formation method
11/09/2006	WO2006117996A1 Dielectric ceramic, process for producing the same, and laminated ceramic capacitor
11/09/2006	WO2006117912A1 Thin film capacitor and method for manufacturing same
11/09/2006	WO2006117787A1 Solid electrolytic capacitor and method for manufacturing the same
11/09/2006	US20060252221 Methods of forming hafnium-containing materials
11/09/2006	US20060250749 Layer capacitor element and production process as well as electronic device
11/09/2006	US20060250748 Integrated capacitor assembly
11/09/2006	US20060250747 Layer-built capacitor, and its manufacturing method
11/09/2006	US20060249811 Composition for thin film capacitance element, insulating film of high dielectric constant, thin film capacitance element, thin film laminated capacitor and method for manufacturing thin film capacitance element
11/09/2006	US20060249778 Constructions comprising hafnium oxide
11/09/2006	US20060249758 Electric multilayer component
11/09/2006	CA2604616A1 Capacitor layer forming material and production method for the capacitor layer forming material
11/09/2006	CA2604614A1 Method for oxide dielectric layer formation, and capacitor layer forming material comprising oxide dielectric layer formed by said formation method
11/08/2006	EP1720181A1 Stacked ceramic electronic component and manufacturing method thereof
11/08/2006	CN1860569A Method for producing conductive paste for internal electrode of multilayer ceramic electronic component
11/08/2006	CN1860184A Resin composition for composite dielectric body, composite dielectric body, and electrical circuit board using such composite dielectric body
11/08/2006	CN1860004A Method for producing dielectric paste for multilayer ceramic electronic component
11/07/2006	US7133275 Integrated capacitor assembly
11/07/2006	US7133274 Multilayer capacitor and mold capacitor
11/07/2006	US7131174 Ceramic electronic device and method of production of same
11/02/2006	WO2006114914A1 Dielectric ceramic composition and laminated ceramic capacitor
11/02/2006	US20060246674 Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof
11/02/2006	US20060245144 Capacitor
11/02/2006	US20060245142 Capacitor and method for manufacturing the same
11/02/2006	US20060245141 Laminated electronic component
11/02/2006	US20060245139 Package substrate with built-in capacitor and manufacturing method thereof
11/02/2006	EP1717829A2 Method of production of multilayer ceramic capacitor
11/02/2006	EP1384286B9 Inverted-f ferroelectric antenna
11/02/2006	DE102005019838A1 Coupling capacitor arrangement for DC voltage separate connection of high frequency (HF) circuits includes compensating inductors and coupling inductor whose inductances are calculated to compensate for parasitic capacitances
11/01/2006	CN2833833Y Micro-disk porcelain capacitor
11/01/2006	CN2833832Y High-voltage capacitor against breakdown of pigtail end
11/01/2006	CN1856446A A process for the production of niobium oxide power for use in capacitors
11/01/2006	CN1855324A Laminate electronic device
11/01/2006	CN1854105A Nanometer ceramic-material doping agent, ceramic capacitor media material and production thereof
10/2006
10/31/2006	US7130182 Stacked capacitor and method for fabricating same
10/31/2006	US7130181 Semiconductor device
10/31/2006	US7129166 Method of forming an electronic device
10/31/2006	US7128870 Method for the manufacture of multilayer ceramic electronic component

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