Patents
Sitemap › H01 - Basic electric elements › H01G - Capacitors; Capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices of the electrolytic type › H01G 4 - Fixed capacitors; Processes of their manufacture
Patents for H01G 4 - Fixed capacitors; Processes of their manufacture (22,458)
10/2007
10/24/2007CN101060034A Electronic bubble surface low temperature depositional film manufacture method
10/24/2007CN101060033A Manufacturing process of the electrode pattern
10/24/2007CN100345228C Capacitor having improved electrodes
10/24/2007CN100344579C Ceramic powder with perofskite structure and its producing method, electronic parts and capacitor
10/24/2007CN100344578C Dielectric ceramic composition and method of production and electronic device of the same
10/23/2007US7285428 Production method of electron source and image display
10/23/2007US7285232 Conductive powder, glass powder and an organic vehicle; for forming a conductor having superior platability and a high density=
10/18/2007WO2007117998A2 Capacitor electrodes produced with atomic layer deposition for use in implantable medical devices
10/18/2007WO2007117942A2 Feedthrough filter terminal assemblies with breathable components to facilitate leak testing
10/18/2007WO2007117873A1 Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor
10/18/2007WO2007117257A1 Improved high voltage capacitors
10/18/2007WO2007116566A1 Capacitor
10/18/2007WO2007116471A1 Capacitative element
10/18/2007US20070243405 Electronic device with lead-free metal thin film formed on the surface thereof
10/18/2007US20070242416 Surface-mounting ceramic electronic component
10/18/2007US20070242415 Energy Storage Device Having A Separator Blocking Parasitic Ions
10/18/2007US20070242413 Power Capacitor
10/18/2007US20070242412 Electrode compositions containing carbon nanotubes for solid electrolyte capacitors
10/18/2007US20070242409 Solid electrolytic capacitor and manufacturing method of the same
10/18/2007US20070242405 Chip type electronic component for test, and mounted state test method
10/17/2007CN200962372Y Integrated restraint electromagnetic interference filter
10/17/2007CN101055802A 积层电容器 Multilayer Capacitors
10/17/2007CN101055801A Separation and protection processing method for chip capacitor upper board
10/17/2007CN101054458A Hydrophobic crosslinkable compositions for electronic applications
10/17/2007CN101054293A Dielectric ceramic composition, electronic component and manufacturing method thereof
10/17/2007CN100343926C Ultrafine metal powder slurry
10/16/2007US7283352 Solid electrolytic capacitor and method for manufacturing the same
10/16/2007US7283351 Gas discharge lamp power supply
10/16/2007US7283348 Multilayer capacitor
10/16/2007US7282419 Thin-film capacitor device, mounting module for the same, and method for fabricating the same
10/16/2007US7282162 Made of a copper-based powder and an organic binder that can be fired at a low temperature in a nitrogen atmosphere; reduced solids content yet maintains a suitable paste viscosity and is able to ensure sufficient thermal decomposability of the organic binder
10/11/2007WO2007115255A2 Integrated power passives
10/11/2007WO2007115238A2 Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same
10/11/2007WO2007114937A1 Flowable compensation layer for multilayer ceramic devices
10/11/2007WO2007059130A3 Cog ceramic for multilayer capacitor
10/11/2007US20070236866 Dielectric element and method for manufacturing same
10/11/2007US20070236865 Dielectric ceramic and multilayer ceramic capacitor
10/11/2007US20070236864 High-speed differential AC coupling device
10/11/2007US20070236863 Capacitors and methods of fabricating the same
10/11/2007US20070236862 Multilayer electronic device and the production method
10/11/2007US20070236861 Implantable co-fired electrical feedthroughs
10/11/2007US20070236860 Capacitor for multiple replacement applications
10/11/2007US20070236858 Enhanced Method for Signal Shaping in Multi-Channel Audio Reconstruction
10/11/2007DE102006016156A1 Hydrolysebeständige, mehrschichtige Polyesterfolie mit Hydrolyseschutzmittel Hydrolysis-resistant, multilayer polyester film with Antihydrolysis
10/10/2007EP1843361A1 Condenser device
10/10/2007EP1842871A1 Polyester film containing a hydrolysis stabilizer
10/10/2007EP1842662A1 Multilayer polyester film containing a hydrolysis stabilizer
10/10/2007CN101052276A Method for manufacturing capacitor embedded in pcb
10/10/2007CN101051565A Surface-mounting ceramic electronic component
10/10/2007CN101051564A Metallizing safety film capacitor
10/10/2007CN100341789C Barium titanate and electronic parts using the material
10/09/2007US7280343 Low profile electrolytic capacitor assembly
10/09/2007US7280342 Low inductance high ESR capacitor
10/09/2007US7279777 Organic polymers, laminates, and capacitors
10/09/2007US7279765 Transparent electrode made from indium-zinc-oxide and etchant for etching the same
10/04/2007WO2007111117A1 Capacitor unit, and its manufacturing method
10/04/2007US20070230090 Capacitor and electronic circuit
10/04/2007US20070230089 Capacitor structure and fabricating method thereof
10/04/2007US20070230088 Multilayer ceramic electronic device and method of production of same
10/04/2007US20070230087 Decoupling capacitor for semiconductor integrated circuit device
10/04/2007US20070230086 Thin film capacitor and method of manufacturing thin film capacitor
10/04/2007US20070228506 Composite capacitor and method for forming the same
10/04/2007US20070227649 Method and device for forming external electrodes in electronic chip component
10/04/2007US20070227642 Method of making multilayer electronic component
10/04/2007US20070227641 Flowable compensation layer for multilayer devices
10/03/2007EP1840914A1 Capacitor layer forming material, process for producing the same, and printed wiring board having built-in capacitor layer obtained using the material
10/03/2007EP1840913A1 Capacitor and electronic circuit
10/03/2007EP1840912A2 Multilayer ceramic electronic device and method of production of same
10/03/2007EP1840104A2 Dielectric particles, dielectric ceramic composition, and method of production of the same
10/03/2007EP1839390A1 Modifiable electrical component, and method for modifying said component
10/03/2007CN200956310Y Nickel electrode tab type multi-layer ceramic capacitor setter plate
10/03/2007CN200956309Y High-reliable air-sealing railway track compensating capacitor sealing structure
10/03/2007CN101049055A Capacitor layer forming material, and printed wiring board having internal capacitor layer obtained by using such capacitor layer forming material
10/03/2007CN101048833A Capacitors having a high energy density
10/03/2007CN101048345A Barium titanate and its manufacturing method as well as capacitor
10/03/2007CN101047069A Method and device for forming external electrodes in electronic chip component
10/03/2007CN101047067A Thin film capacitor and method of manufacturing the thin film capacitor
10/03/2007CN101047066A Multilayer electronic device and the production method
10/03/2007CN101047065A Multilayer electronic device and the production method
10/03/2007CN101047064A Internal electrode paste, multilayer ceramic electronic device and the production method
10/03/2007CN101047063A 电容结构 Capacitance structure
10/03/2007CN101047062A Electronic component, production method of electronic component, mounted structure of electronic component, and evaluation method of electronic component
10/02/2007US7277270 Multilayer filter
10/02/2007US7277269 Refractory metal nickel electrodes for capacitors
10/02/2007US7277268 Laminated ceramic capacitor
10/02/2007US7276841 Thick film electrode and multilayer ceramic electronic device
10/02/2007US7276461 Can be sintered simultaneously with Au, Ag, Cu or the like as a low resistant conductor, and that have less dielectric loss (a large Q-value)
10/02/2007US7276130 Prefiring an element with alternately arranged dielectric layers and internal electrode layers by heating to the firing temperature while introducing H2 after a temperature of at least 1000 degrees C.is achieved and gradually changing the hydrogen concentration to be introduced
10/02/2007US7275316 Method of embedding passive component within via
09/2007
09/27/2007WO2007108107A1 Passive element design program, designing device, and designing method
09/27/2007US20070223177 Multilayer electronic device and the production method
09/27/2007US20070223176 Capacitor with hafnium oxide and aluminum oxide alloyed dielectric layer and method for fabricating the same
09/27/2007US20070220725 Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
09/27/2007DE10222405B4 Chipkondensator und Verfahren zu dessen Herstellung Chip capacitor and process for its preparation
09/26/2007EP1837316A2 Electronic device, dielectric ceramic composition and the production method
09/26/2007EP1789980A4 Utilization of poly(ethylene terephthalate) plastic and composition-modified barium titanate powders in a matrix that allows polarization and the use of integrated-circuit technologies for the production of lightweight ultrahigh electrical energy storage units (eesu)
09/26/2007CN101044092A Fine-particled alkaline-earth titanates and method for the production thereof using titan oxide particles
09/26/2007CN101042960A 电容器组件 Capacitor assembly
09/25/2007US7274277 Ferroelectric devices and method relating thereto
09/25/2007US7273791 Methods for forming a conductive structure using oxygen diffusion through one metal layer to oxidize a second metal layer
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