Patents
Patents for H01C 17 - Apparatus or processes specially adapted for manufacturing resistors (6,327)
09/1976
09/21/1976US3981071 Process of thermistor manufacture
09/14/1976US3979823 Method of manufacturing a resistor having a low temperature coefficient
08/1976
08/10/1976US3974107 Resistors and compositions therefor
06/1976
06/29/1976US3966578 Method of making thin film thermistor
06/08/1976US3962487 Method of making ceramic semiconductor elements with ohmic contact surfaces
06/08/1976US3961599 Apparatus for making miniature layer resistors on insulating chips by digital controls
06/01/1976US3960778 Pyrochlore-based thermistors
05/1976
05/18/1976US3958071 Organoborosiloxane polymer, organic metal compound
05/18/1976US3958039 Method for coating lead-attached electronic device
05/11/1976US3956081 Method of high speed resistor trimming
05/04/1976US3955039 Alloys, electrical films
04/1976
04/20/1976US3952116 Process for forming electrical resistance heaters
04/20/1976US3951672 Glass frit containing lead ruthenate or lead iridate in relatively uniform dispersion and method to produce same
04/13/1976US3950597 Powder compositions of polynary oxides and copper
04/06/1976US3949275 Electric thin-film circuit and method for its production
03/1976
03/30/1976US3947801 Laser-trimmed resistor
03/30/1976US3947278 Duplex resistor inks
03/30/1976US3947277 Duplex resistor inks
03/16/1976US3943685 Machine for loading electric components into a carrier strip
03/09/1976US3943168 Conductor compositions comprising nickel borides
02/1976
02/03/1976US3936789 Spreading resistance thermistor
02/03/1976US3936397 Cadmium-bismuth-boron-germanium oxides
01/1976
01/20/1976US3934058 Method of stabilizing the hot resistance of ceramic positive temperature coefficient resistors
01/06/1976US3930896 Method for producing metal film resistor by electroless plating
01/06/1976US3930822 Process for making carbon-containing glass resistors
01/06/1976US3930821 Process for making carbon-containing glass resistors
01/06/1976US3930304 Method and apparatus for selective burnout trimming of integrated circuit units
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