Patents for F28F 7 - Elements not covered by group , , or (4,023)
01/2010
01/07/2010US20100000718 Silicon-based thermal energy transfer device and apparatus
01/07/2010US20100000716 Heat dissipation device having a clip
01/07/2010US20100000715 Heat dissipation device
01/07/2010US20100000230 Thermoelectric refrigerated secondary shelf
01/05/2010US7641101 Method of assembling a cooling system for a multi-component electronics system
12/2009
12/31/2009US20090322096 Thermal shield for system for generating electric power
12/31/2009US20090321061 Methods and apparatuses for transferring heat from stacked microfeature devices
12/31/2009US20090321060 Cooling Fin
12/31/2009US20090321052 Method of Producing Body Having Flow Path Formed Therein, and Body Having Flow Path Formed Therein
12/31/2009US20090321050 Heat dissipation device
12/31/2009US20090321048 Heat dissipation assembly
12/31/2009US20090321047 Air guiding structure
12/31/2009US20090321046 Flow diverters to enhance heat sink performance
12/31/2009US20090321045 Monolithic structurally complex heat sink designs
12/31/2009US20090321044 Active heat sink designs
12/31/2009US20090321043 Heat absorbing device
12/31/2009US20090320642 Heat exchanger with integrated bypass valve
12/29/2009US7639504 Mounting device for mounting heat sink onto electronic component
12/29/2009US7639498 Conductive heat transport cooling system and method for a multi-component electronics system
12/29/2009US7637310 Heat dissipation device with fixtures for attachment of a fan
12/24/2009US20090316360 Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled
12/24/2009US20090315442 Heat sink lamp and method for manufacturing a heat sink
12/24/2009US20090314471 Heat pipe type heat sink and method of manufacturing the same
12/24/2009US20090314467 Cooling apparatus and method of fabrication thereof with jet impingement structure integrally formed on thermally conductive pin fins
12/24/2009US20090314466 Heat dissipation apparatus having heat pipes inserted therein
12/24/2009DE102009015849A1 Wärmetauscher Heat exchanger
12/24/2009DE102008029096A1 Verdampfer für ein Abwärmenutzungssystem Evaporator for a waste heat recovery system
12/23/2009CN101608880A Heat exchanger and fin thereof
12/22/2009US7636241 Heat dissipating device
12/17/2009US20090311974 Suspension method for compliant thermal contact of electronics modules
12/17/2009US20090310310 Heat sink, electronic device, and method of manufacturing electronic device
12/17/2009US20090310306 Heat dissipation device
12/17/2009US20090308585 Method for Manufacturing Tube and Fin Heat Exchanger with Reduced Tube Diameter and Optimized Fin Produced Thereby
12/17/2009US20090308584 Thermal conduction principle and device of the multi-layers structure with different thermal characteristics
12/17/2009US20090308581 Heat sink
12/17/2009US20090308574 Heat sink assembly
12/17/2009US20090308573 Heat dissipation device
12/17/2009US20090308572 Apparatus for accepting a self-drilling screw
12/17/2009US20090308571 Heat transfer assembly and methods therefor
12/15/2009US7633756 Heat dissipation device with fan holder
12/15/2009US7631402 Retaining device for heat sink
12/10/2009US20090301697 Heat-Transfer Sheet, Heat Transfer System, and Method of Using Heat-Transfer Sheet
12/10/2009US20090301694 Heat dissipation device
12/10/2009US20090301690 Heat dissipation device
12/10/2009US20090301689 Fastening device and heat-dissipating module having the same
12/03/2009US20090296343 Heat dissipation system
12/03/2009US20090294956 Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof
12/03/2009US20090294115 Thermal Interconnect System and Production Thereof
12/03/2009US20090294105 Selectively Grooved Cold Plate for Electronics Cooling
12/03/2009US20090294099 Heat dispensing unit for memory chip
12/03/2009US20090294095 Method and apparatus for managing ambient conditions
12/01/2009US7626822 Heat sink assembly for multiple electronic components
12/01/2009US7624789 Liquid cooling system and an electronic apparatus having the same therein
12/01/2009US7624788 Heat exchanger
11/2009
11/26/2009WO2009003817A3 Heat exchanger for a boiler
11/26/2009US20090288814 Mixed Carbon Foam/Metallic Heat Exchanger
11/26/2009US20090288807 Blowerless heat exchanger based on micro-jet entrainment
11/26/2009US20090288806 Heat Radiating Unit
11/26/2009US20090288804 Heat sink for chips
11/26/2009US20090288803 Heat sink for chips
11/26/2009US20090288802 Heat sink for chips
11/25/2009CN201352084Y Wind guide plate structure for vapor cooling equipment
11/24/2009US7623350 Thermal conducting medium protector
11/24/2009US7623348 Heat sink and cooling apparatus
11/24/2009US7621320 Internal heat exchanger
11/20/2009CA2659944A1 Mixed carbon foam/metallic heat exchanger
11/19/2009US20090283250 High strength and high thermal conductivity heat transfer apparatus
11/19/2009US20090283244 Stacked and Redundant Chip Coolers
11/19/2009US20090283243 Heat dissipation device
11/17/2009US7619894 Heat dissipation device
11/17/2009US7619893 Heat spreader for electronic modules
11/17/2009US7619888 Flat heat column and heat dissipating apparatus thereof
11/12/2009US20090279251 Heat dissipation device with heat pipe
11/12/2009US20090277608 Thermal Control Via Adjustable Thermal Links
11/12/2009US20090277607 Heat sink memory chip
11/10/2009US7616444 Gimballed attachment for multiple heat exchangers
11/10/2009US7614247 Cooling arrangement
11/10/2009CA2405315C Device used as a chemical reactor or heat exchanger in general, with a thin tube plate
11/05/2009WO2009132430A1 Modular heat sink and method for fabricating same
11/05/2009US20090272512 Liquid cooling heat dissipating device
11/03/2009US7613000 Heat dissipation device and electronic device with the same
11/03/2009US7612446 Structures to enhance cooling of computer memory modules
11/03/2009US7612370 Thermal interface
10/2009
10/29/2009US20090269636 Fuel cell cabinet liquid cooling system
10/29/2009US20090269190 Arrangement for automatic running gap control on a two or multi-stage turbine
10/29/2009US20090268408 Heat sink assembly
10/29/2009US20090266531 Heat Sink and Method of Manufacturing the Same
10/29/2009US20090266515 Electronic device cooling apparatus and electronic device including the same
10/29/2009US20090266514 Heat exchange device
10/29/2009US20090266513 Heat dissipation device
10/29/2009US20090266512 Heat dissipation device having fastener assemblies for attachment thereof to a heat-generating component
10/29/2009US20090266511 Methods and systems for using a storage device to control and manage external cooling devices
10/27/2009US7609522 Heat sink assembly
10/27/2009CA2451071C Compact reactor for use in a hydrogen generation/fuel cell system
10/22/2009US20090262500 Cooling device, heat sink, and electronic apparatus
10/22/2009US20090260796 Passive Cooling In Response To Ambient Environmental Properties
10/22/2009US20090260795 Active door array for cooling system
10/22/2009US20090260779 Heat dissipation device having an improved fin structure
10/22/2009US20090260778 Low profile heat sink for semiconductor devices
10/22/2009US20090260137 Safety suit
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