C25D 7 - Electroplating characterised by the article coated

Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
12/2013
12/04/2013	CN103422134A Electroplating device for diamond cutting lines
12/04/2013	CN103422133A Electroplating continuous production floating conductive device
12/04/2013	CN103422131A Method for partial coating of at least one busbar
11/2013
11/28/2013	WO2013176133A1 Printed wiring board
11/28/2013	WO2013176115A1 Copper foil, negative electrode current collector, and negative electrode material for non-aqueous secondary battery
11/28/2013	WO2013175591A1 Plating structure and coating method
11/28/2013	US20130313125 Production method for r-fe-b based sintered magnet having plating film on surface thereof
11/28/2013	US20130313123 Cross flow manifold for electroplating apparatus
11/28/2013	US20130313121 Method of Forming Interconnects for Three Dimensional Integrated Circuit
11/28/2013	DE112012000757T5 Gleitelement Slider
11/28/2013	DE102012208494A1 Verfahren zum Herstellen eines Bauteilverbunds A method of manufacturing a composite component
11/27/2013	EP2666890A1 Porous metal having high corrosion resistance and process for producing same
11/27/2013	CN203311966U Magnetic ring in cooperation with CDRH class shielding case magnetic core for use
11/27/2013	CN203307463U Electroplating hanger for metallic circular rings
11/27/2013	CN203307459U Solar cell electroplating equipment
11/27/2013	CN203307458U Copper foil electroplating testing device
11/27/2013	CN203307457U Coating copper control device of electroplating process
11/27/2013	CN103409780A Method for carrying out surface alloy modification upon nano-grade porous gold
11/27/2013	CN102723286B Packaging-first and etching-later manufacturing method for chip formal double-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
11/27/2013	CN102723285B Etching-first and packaging-later manufacturing method for chip formal single-surface three-dimensional circuit and packaging structure of chip formal single-surface three-dimensional circuit
11/27/2013	CN102560314B Thickness setting method for ensuring thickness accuracy of galvanizing DX51D+Z end product
11/26/2013	US8591715 Electrodeposition composition and method for coating a semiconductor substrate using the said composition
11/26/2013	DE202013010250U1 Glanzgradeinstellung von Kunststoffsubstraten mit metallischen Finish Gloss level setting of plastic substrates with metallic finish
11/21/2013	WO2013172155A1 Metal coating film and electronic component provided with metal coating film
11/21/2013	US20130306185 Method of Making Hydralic Tubing
11/21/2013	DE112012000897T5 Poröser Aluminiumkörper und Verfahren zur Herstellung desselben Porous aluminum body and method of manufacturing the same
11/21/2013	DE102013105136A1 Dichtungsringe in elektrochemischen Prozessvorrichtungen Seals in electrochemical process devices
11/20/2013	EP2664694A2 Method of making hydraulic tubing
11/20/2013	CN203295649U Automatic alarm device for liquid level in steel band copper plating
11/20/2013	CN203295638U Surface oxidization prevention device for copper plating steel belt
11/20/2013	CN203295637U Device used for matching with high-speed electroplating production line feeding machine
11/20/2013	CN103403228A Through-hole plating method and substrate manufactured using same
11/20/2013	CN103400906A Biomimetic preparation method of crystal silicon solar cell grid line
11/20/2013	CN103397372A Improved structure of pore-filling electroplating line
11/20/2013	CN103397359A Manufacturing method of electroplated connecting fingers free of lead wire residual
11/20/2013	CN103397354A Additive used for reducing voids generated after annealing of through-silicon-via copper plating
11/19/2013	US8586506 Electrodeposition of biaxially textured layers on a substrate
11/18/2013	CA2808865A1 Method of making hydraulic tubing
11/14/2013	WO2013168764A1 Plated terminal for connector, and terminal pair
11/14/2013	WO2013168646A1 Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board
11/14/2013	WO2013166569A1 Lead-free and sulphuric acid-free method for galvanising metallic materials, and stearate-removing composition
11/14/2013	US20130299212 Cnt metal composite and method of manufacturing the same
11/13/2013	EP2611950B1 Process for electrodeposition of copper chip to chip chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv), with heated substrate and cooled electrolyte
11/13/2013	EP2500384B1 Method for producing exhaust pipe
11/13/2013	CN203288585U A wafer electroplated nickel gold product
11/13/2013	CN203284493U Plating hanger for flexible circuit boards
11/13/2013	CN203284492U Automatic plating line hanging device for limb type vibration damper poles
11/13/2013	CN203284486U Auxiliary threading device for electrolysis bath
11/13/2013	CN203284485U Electroplate tool for small hole
11/13/2013	CN103392028A Copper foil with carrier
11/13/2013	CN103388169A Abrasive feeding method for electroplate grinding wheel
11/13/2013	CN103388165A Method for coating surface of copper wire with tin and a tin-coated copper wire prepared by method
11/13/2013	CN103388150A A black slider and a method of manufacturing the black slider
11/13/2013	CN102321899B Device for plating nickel and gold on crystal grains
11/13/2013	CN102277605B Process for manufacturing smooth surface roughened electrolytic copper foil
11/13/2013	CN102181895B One-time electroplating process for lead frame of semiconductor integrated circuit
11/12/2013	US8580101 Outdoor-suitable antique copper color aluminum material and process
11/12/2013	CA2558572C Method for lowering the coefficient of friction of the surface of metal bands with a coating and device for applying a metallic coating onto a steel band
11/06/2013	EP2660363A2 Adjustable anode
11/06/2013	EP2660361A1 Carbon nanotube metal composite material and production method for same
11/06/2013	CN103382566A Electroplating apparatus for solar cell and power supply module thereof
11/05/2013	US8574418 Electroplating method for coating a substrate surface with a metal
10/2013
10/31/2013	WO2013161334A1 Carrier-supported copper foil, process for producing carrier-supported copper foil, and printed wiring board
10/31/2013	WO2013161125A1 Plated terminal for connector
10/31/2013	US20130286099 Liquid ejecting head, method of manufacturing liquid ejecting head, and liquid ejection printing apparatus
10/30/2013	EP2658030A1 Method for manufacturing resonance tube, resonance tube and filter
10/30/2013	EP2655701A1 A method for providing an ecpr master electrode
10/30/2013	EP2655700A1 An ecpr master electrode and a method for providing such ecpr master electrode
10/30/2013	EP2655699A1 An ecpr master electrode, and a method for providing such master electrode
10/30/2013	EP2655698A1 Master electrode for ecpr and manufacturing methods thereof
10/30/2013	EP2655457A1 Composition for metal electroplating comprising leveling agent
10/30/2013	CN203256365U Edge cover device for strip steel electroplating process
10/30/2013	CN203256358U Electroplating equipment of platinum catalyzing net
10/30/2013	CN203256357U Novel wheel hub electroplated profile modeling anode
10/30/2013	CN203256356U Fixture used for electroplating ceramic printed circuit board
10/30/2013	CN103374737A Solar cell electroplating device
10/30/2013	CN103374736A Plating fiber manufacturing apparatus and method for manufacturing plating fibers
10/30/2013	CN103372921A Composite wire saw with plating and manufacturing method thereof
10/30/2013	CN102268719B Vertical plating equipment and plating method thereof
10/24/2013	DE112012000442T5 Verfahren zur Erzeugung einer Aluminiumstruktur und Aluminiumstruktur A method for producing an aluminum structure and aluminum structure
10/23/2013	EP2654111A1 Lithium-ion secondary battery, electrode for secondary battery, and electrolytic copper foil for secondary battery electrode
10/23/2013	EP2652777A1 Device and method for metallizing wafers
10/23/2013	CN203247324U Electroplating production line of wires
10/23/2013	CN203247323U High-weight electro-galvanized layer device
10/23/2013	CN103370450A Method for producing sintered sliding bearings
10/23/2013	CN103370446A Production method for R-Fe-B sintered magnet having plating film on surface thereof
10/23/2013	CN103361707A Electroplating clamp for thin PCB
10/23/2013	CN103361706A Fixture for electroplating circuit board
10/23/2013	CN103361695A Plating method and apparatus
10/23/2013	CN103361694A Micro-pore electroplated copper filling method for three-dimensional (3D) copper interconnection high aspect ratio through-silicon-via technology
10/23/2013	CN103361690A Blind hole cleaning method of PCB (printed circuit board)
10/23/2013	CN103361681A Additive C capable of changing plated copper filling mode of TSV (Through-Silicon-Via) micropores, and electroplating solution comprising same
10/23/2013	CN101920508B Chrome-plated pressure machine hydraulic plate as well as production equipment and chrome-plated process thereof
10/22/2013	US8562808 Polymer thick film silver electrode composition for use as a plating link
10/22/2013	US8562752 Single workpiece processing chamber
10/17/2013	WO2013102558A3 A metallic foam material
10/16/2013	EP2650393A1 Metallic porous body having high corrosion resistance and method for manufacturing same
10/16/2013	CN203238342U Circuit board sedimented copper son basket hook
10/16/2013	CN203238341U Electroplating device
10/16/2013	CN103352241A Local plating device for lead frame

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