Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
01/2012
01/04/2012EP2402152A1 Metal-clad polyimide resin substrate with excellent thermal aging resistance characteristics
01/04/2012CN202099395U Spraying cover
01/04/2012CN1894442B Method and apparatus for fluid processing a workpiece
01/04/2012CN102308026A Tin-plated steel sheet and method for producing the same
01/04/2012CN102308025A Tin-plated steel sheet and method for producing same
01/04/2012CN102306631A Method for improving Sn-Ag solder performance based on galvanization technology
01/04/2012CN102304747A Process for producing high-power light emitting diode (LED) substrate
01/04/2012CN102304735A Silver-copper bimetallic thin film for light anode and laser-induced membrane-changing method
01/04/2012CN102071423B Preparation method of plastic product and plastic product
01/04/2012CN101922032B Method for preparing nickel-coated porous steel strip
01/03/2012CA2501416C Process for increasing strength, flexibility and fatigue life of metals
12/2011
12/29/2011US20110318497 Hoistway sheave resurfacing
12/29/2011US20110315558 Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter
12/29/2011US20110315556 Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks
12/29/2011US20110315555 Plating method
12/29/2011DE102010030465A1 Verfahren zum Herstellen eines Blechformteils aus einem höherfesten Stahlblechmaterial mit einer elektrolytisch aufgebrachten Zink-Nickel-Beschichtung A method for manufacturing a sheet molded part from a high-strength steel sheet material with an electrolytically applied zinc-nickel coating
12/28/2011EP2399281A1 Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
12/28/2011CN202090077U 晶圆处理装置 Wafer processing equipment
12/28/2011CN202090076U 微型孔电镀装置 Micro-hole plating device
12/28/2011CN202088562U 一种具有高耐腐蚀性能的可锡焊铝带 A high corrosion resistance of aluminum can be soldered
12/28/2011CN1914359B 封孔处理剂、封孔处理方法、及用该处理剂处理的印刷基板 Sealing treatment agent, sealing treatment method, and with the treating agent of the printed circuit board
12/28/2011CN102297881A 基于复合二氧化钛纳米管的氢气传感器制备方法 Preparation of hydrogen sensor based composite titania nanotubes
12/28/2011CN102296333A 一种拉镀机阴极输送装置 One kind of pull-plated machine cathode delivery device
12/28/2011CN102296332A 一种聚乙烯表面直接镀导电金属的方法 One kind of a conductive metal deposited directly on the surface of polyethylene Method
12/28/2011CN102296331A 塑料电镀的层次状视觉效果的制法 Plastic plating level system of law-like visual effects
12/28/2011CN102296330A 钛基铅-碳化钨-氧化铈-聚苯胺复合阳极板的制备方法 Titanium-based lead - WC - ceria - Preparation of polyaniline composite anode plate
12/28/2011CN101855388B 镀铬部件及其制造方法 Chrome parts and manufacturing method thereof
12/28/2011CN101768747B 一种在钛合金表面进行表面活化处理的方法 A method of surface activation in the titanium alloy surface treatment
12/28/2011CN101724876B 用于多缸汽缸体电镀预处理设备和方法 Multi-cylinder cylinder block apparatus and method for plating pretreatment
12/28/2011CN101698954B 一种具有远程控制功能的电刷镀电源 A kind of remote control electric power brush
12/28/2011CN101512048B 在半导体器件制造中用于直接镀铜和填充而形成互连的方法和组合物 Methods to form interconnections in semiconductor device fabrication and filling for direct copper and compositions
12/27/2011US8083920 Method for manufacturing solid electrolytic capacitor
12/22/2011WO2011158698A1 Process for production of semiconductor device, and semiconductor device
12/22/2011WO2011081508A4 Production of thin-film mnpo4, nh2o cathodic materials
12/22/2011US20110313539 Medical supplies and method of producing the same
12/22/2011US20110311867 Negative electrode active material for lithium ion secondary battery and lithium ion secondary battery
12/22/2011US20110311838 Composition for treating surface of metal, method for treating surface of metal using the composition, and coating film for treating surface of metal utilizing the composition and the method
12/22/2011US20110311800 Microstructure and microstructure production method
12/22/2011US20110310281 Image capture unit and methods
12/22/2011US20110308958 Nickel-containing layer arrangement for intaglio printing
12/22/2011US20110308956 Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards
12/22/2011DE102010024499A1 Producing three-dimensional structure of successive layers, comprises producing a number of successive layers and uncovering three-dimensional structure after producing number of successive layers by removing a part of sacrificial material
12/21/2011EP2398304A2 Copper clad laminate with copper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with copper-plated circuit layer
12/21/2011EP2396455A1 Chrome-plated part and manufacturing method of the same
12/21/2011CN102290275A 用于高压断路器的闸刀片及其镀银工艺 Shutter blades for high voltage circuit breakers and silver plating
12/21/2011CN102286763A 一种tc4钛合金表面电镀铜工艺方法 One kind tc4 titanium surface copper plating process for
12/21/2011CN102286760A 用金属电化学填充高纵横比的大型凹入特征的方法、水溶液电镀槽溶液、电镀设备以及系统 Electrochemical filled with a metal of high aspect ratio features large recessed methods aqueous solution plating tank, plating equipment and systems
12/21/2011CN102031543B 对气密性不合格的起落架活塞杆进行镀铬层修复的加工方法 Failure of the landing gear on the tightness piston rod chrome plating repair processing methods
12/21/2011CN101956220B 一种电镀前处理除油剂组合物及其制备和使用方法 The former plating degreaser composition and preparation and use
12/21/2011CN101343034B 一种制备硅基金属纳米管的方法 A metallic silicon nanotubes prepared
12/20/2011US8080147 Electrolytic plating method and semiconductor device manufacturing method
12/15/2011WO2011156676A2 Metallic materials with embedded luminescent particles
12/15/2011WO2011156341A1 Method for depositing an electrodepositable coating composition onto a substrate using a plurality of liquid streams
12/15/2011WO2011154715A2 Metal treatment
12/15/2011US20110306924 Atmospheric low-temperature micro plasma jet device for bio-medical application
12/15/2011US20110303341 Method for the miniaturizable contacting of insulated wires
12/15/2011US20110303092 High Permeance Sulfur Tolerant Pd/Cu Alloy Membranes
12/15/2011US20110302761 Process for manufacturing an anodized aluminum disc seal shell
12/15/2011CA2801418A1 Metallic materials with embedded luminescent particles
12/15/2011CA2800380A1 Metal treatment
12/14/2011EP2393965A2 Die for continuous casting
12/14/2011EP2393964A1 Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
12/14/2011CN202072780U 一种电镀系统及其喷流装置 One kind of plating system and the jet device
12/14/2011CN102282294A 增加金属或金属合金表面的钎焊性和耐腐蚀性的溶液和方法 Brazing and corrosion resistance of the solutions and methods to increase the surface of a metal or metal alloy
12/14/2011CN102278333A 一种液压油缸体结构的制造方法 A method for manufacturing structure of the hydraulic cylinders
12/14/2011CN102277604A 一种电镀Ni叠层膜及其制备方法 One kind of plating Ni laminated film and method
12/14/2011CN102277603A 一种感应热/电沉积制备涂层或薄膜的装置及方法 A heat / electrodeposition coating or film preparation apparatus and method induction
12/14/2011CN102029307B 一种电缆自承线用锌包钢的生产工艺 A self-supporting cable wire clad with zinc production process
12/13/2011US8075791 Chemical treatment method
12/08/2011WO2011153228A2 Reduction of copper or trace metal contaminants in plasma electrolytic oxidation coatings
12/08/2011US20110297550 Method of forming the structure of thermal resistive layer
12/07/2011EP2393171A1 Spark plug and process for producing same
12/07/2011EP2392695A1 Method for pulse plating carbon black sheet with metallic nano particle thin film layer, and carbon black sheet&fuel cell polymer electrolyte membrane / electrode assembly prepared using sheet
12/07/2011EP1579463B1 Method for increasing the copper to superconductor ratio in a superconductor wire
12/07/2011CN202064018U 一种改进的半导体引线框架中圆盘电镀结构 An improved semiconductor lead frame plating disc structure
12/07/2011CN102268718A 输入设备、电镀装置及利用该电镀装置进行电镀的方法 Input devices, electroplating apparatus and the electroplating apparatus utilizing electroplating method
12/07/2011CN102268705A 一种具有层状结构的电子封装复合材料的制备方法 Method for preparing a layered structure of Electronic Packaging Materials
12/07/2011CN102268704A 双激光对刻阻断选择电镀法 Dual laser engraved block selection for electroplating
12/07/2011CN102268702A 铜铟镓硒薄膜的光电化学沉积制备法 Photoelectrochemical deposition (CVD) of copper indium gallium selenide thin films
12/07/2011CN101899700B 镁、钛表面超声微弧氧化载银抗菌生物活性涂层制备方法 Magnesium, titanium surface ultrasound micro-arc oxidation silver antibacterial bioactive coating preparation
12/07/2011CN101748456B 一种基材的表面处理方法 A substrate surface treatment method
12/07/2011CN101704160B 一种钨与铜及其合金异种金属连接方法 One of the tungsten and copper and its alloys dissimilar metal connection method
12/06/2011US8070932 Insulating layer within circuit board has non-circuit area free of circuit layout; openings are formed therein; patterned circuit layer is formed on insulating layer; metal identifiable information is disposed in openings; product status of board can be traced, identified via metal patterned information
12/06/2011US8070931 Electrochemical fabrication method including elastic joining of structures
12/06/2011US8070930 Methods for fabricating metal nanowires
12/06/2011US8070929 Catalyst particles on a tip
12/01/2011WO2011149330A1 Method of electrodepositing nickel-cobalt alloy
12/01/2011WO2011148685A1 Surface treatment apparatus
12/01/2011WO2011148242A2 Method of plating stainless steel and plated material
12/01/2011WO2011147756A1 Metallic articles with hydrophobic surfaces
12/01/2011WO2010005983A3 Property modulated materials and methods of making the same
12/01/2011US20110293845 Methods of bonding pure rhenium to a substrate
12/01/2011US20110290654 Apparatus and methods for fast chemical electrodeposition for fabrication of solar cells
12/01/2011US20110290653 Gold alloy electrolytes
12/01/2011DE102010021827A1 Producing corrosion protected metallic component, by applying galvanic coating e.g. zinc coating on portion of component, applying surface protection to portion or total component, and burning surface protection at temperature
12/01/2011CA2800287A1 Metallic articles with hydrophobic surfaces
11/2011
11/30/2011CN202054913U 可焊性镀锡铝合金带 Weldability of aluminum alloy with tin
11/30/2011CN102265711A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil using an electronic circuit and a method which form an electronic circuit
11/30/2011CN102265710A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil and the use of electronic circuits forming an electronic circuit are a method
11/30/2011CN102264812A 用于金属镀的热塑性基底的无铬调理和蚀刻方法 Chrome-free conditioning thermoplastic substrates for metal plating and etching method
1 ... 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 ... 179