Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
06/2013
06/26/2013CN103173822A Environmentally-friendly chemical tinning technology
06/26/2013CN103173821A Treatment technology for improving coating layer bonding strength of tungsten alloy
06/26/2013CN103173820A Protection method of precision holes or grooves in chemical nickel-plating process of metal parts
06/26/2013CN103173818A Environment-friendly silver electroplating technique
06/26/2013CN103173813A Electroplating process of electroplated metal fastener
06/26/2013CN103173810A Copper-clad aluminum conductor production process
06/26/2013CN103173755A Tinning passivation solution
06/26/2013CN103173646A Iron-palladium alloy nanometer wire and preparation method thereof
06/26/2013CN102013488B Tin/copper foam alloy cathode material for lithium ion cells and preparation method thereof
06/26/2013CN101369522B Method for processing a substrate
06/25/2013US8470155 Copper/niobium composite piping material produced by copper electroforming, process for producing the same and superconducting acceleration cavity produced from the composite piping material
06/25/2013US8470154 Heterogeneous LIGA method
06/20/2013WO2013088647A1 Method for manufacturing metal lattice, metal lattice, x-ray imaging device, and intermediate product for metal lattice
06/20/2013WO2012080716A3 Electro chemical deposition apparatus
06/20/2013US20130155523 Lens and pattern printing and coating method for manufactuirng same
06/20/2013US20130153428 Metal Surface and Process for Treating a Metal Surface
06/20/2013US20130153091 Hot-rolled steel sheet, cold-rolled steel sheet, galvanized steel sheet, and methods of manufacturing the same
06/20/2013DE102011088804A1 Manufacture of thin film solar cell involves carrying out electrochemical deposition of copper, indium and selenium-containing layer, performing heat treatment and forming homogeneous copper-indium-selenium absorber layer
06/19/2013EP2603558A1 Thermoplastic moulding compositions with improved adhesion of electroplated metal layer
06/19/2013CN203007457U PCB (Printed Circuit Board) electroplating tank
06/19/2013CN103167845A Method of making a stent with hollow struts
06/19/2013CN103160896A Preparing method of black hole solution for printed circuit board
06/19/2013CN103160895A Nonmetal copper plating process
06/19/2013CN103160894A Steel wire copper preplating electroplating solution
06/19/2013CN103160893A Steel wire copper plating process
06/19/2013CN103160892A Preparation method of titanium alloy silver coating
06/19/2013CN103160891A Method and equipment for brush-plating conductive metal on steel rail surface of railway
06/19/2013CN103160888A Nonmetal copper plating solution
06/19/2013CN103160885A Process of cyanide-free electro-coppering
06/19/2013CN103160882A Cyanide-free copper plating process
06/19/2013CN103160875A Tinning technique
06/19/2013CN103160873A Tinning process
06/19/2013CN103156507A Cookware in a combination of enamel and brushing electroplating and manufacture method thereof
06/19/2013CN102260891B Method for electrodepositing nanocrystalline nickel-cobalt alloy by double-pulse
06/19/2013CN102230982B Optical diaphragm structure and soft lithography seal master pattern which is used to manufacture optical diaphragm structure
06/19/2013CN101952479B Plated steel sheet for can and process for producing the plated steel sheet
06/19/2013CN101031367B Silver plating in electronics manufacture
06/13/2013WO2013084949A1 Metal porous body manufacturing method and grease filter
06/13/2013WO2013084429A1 Method for manufacturing metal lattice, metal lattice, and x-ray imaging apparatus
06/13/2013WO2013083987A1 Method of manufacture a sliding bearing
06/13/2013WO2013083600A2 Novel adhesion promoting agents for metallization of substrate surfaces
06/13/2013WO2013037071A8 Zincating aluminum
06/13/2013US20130149437 Method for manufacturing printed circuit board
06/13/2013US20130148788 Gratings for x-ray imaging, consisting of at least two materials
06/13/2013US20130146467 Preparing Electrodes for Electroplating
06/13/2013US20130146466 Cathodic electrocoating compositions
06/13/2013US20130146342 Pattern-forming composition and pattern-forming method using the same
06/13/2013DE102011121125A1 Method for coating of indium-tin oxide used for thin-film solar cell, involves forming alloy layer by performing electrochemical deposition of indium and tin on substrate and oxidizing substrate by direct current sulfuric acid method
06/13/2013DE102011120581A1 Verfahren zur Herstellung eines vorderseitig galvanisch beschichteten Bedien-, Dekor- oder Anzeigeelements mit nicht beschichteten Bereichen A method for producing a front side electroplated operating, decorative or display element with non-coated areas
06/13/2013DE102011088211A1 Kontaktelement und Verfahren zu seiner Herstellung Contact element and process for its preparation
06/12/2013EP2602359A1 Steel sheet for hot stamping, and process for manufacturing hot-stamped steel products using steel sheet for hot stamping
06/12/2013EP2602357A1 Novel adhesion promoting agents for metallization of substrate surfaces
06/12/2013CN202998516U Flexible conductive heating body with electroplated conductor rail
06/12/2013CN202989319U Electroplating drag cylinder plate
06/12/2013CN202989309U Traction motor end cap bearing chamber rotating brush plating machine
06/12/2013CN202989308U Plating preventing machine for automotive upholstery
06/12/2013CN103147113A Communication filter electroplating equipment and electroplating method of communication filter electroplating equipment
06/12/2013CN103147104A Corrosion-resistant coating sealing agent
06/12/2013CN103147103A Electro-brush plating power source controlled by touch screen
06/12/2013CN103147102A Conic micro-grade and nano-grade array structure material and its preparation method
06/12/2013CN103147076A Surface metallization method for complicated hard polyimide shielding cavity
06/12/2013CN103144628A Brake pump and production method thereof
06/12/2013CN102732926B High-molecular crystal sprayed film
06/12/2013CN101981234B Tinned copper alloy bar with excellent abrasion resistance, insertion properties, and heat resistance
06/12/2013CN101865627B Manufacture method of heat radiation interface device and product thereof
06/11/2013US8461036 Multiple surface finishes for microelectronic package substrates
06/06/2013WO2013079219A1 Method for producing electrically conductive structures on non-conductive substrates and structures made in this manner
06/06/2013US20130143060 Net-shape structure with micro-truss core
06/05/2013EP2599894A1 Three-piece resealable can for acidic liquid
06/05/2013EP2599889A1 Method for hot-stamping galvanized steel sheet
06/05/2013EP2598676A1 Device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatment
06/05/2013CN202968721U Machine for electroplating and sticking films in tape area
06/05/2013CN103132123A Fixture for fixing soft material plated piece substrate
06/05/2013CN103132114A wear-resistant worpiece and manufacturing method of wear-resistant coating thereof
06/05/2013CN103132112A Molybdenum plate nickel plating method for silicon power electronic device
06/05/2013CN101301631B Method for preparing protective coating of catalytic converter for purifying motorcycle tail gas during electroplating process
06/05/2013CN101145633B A built-in mobile phone antenna and its making method
05/2013
05/30/2013WO2013077308A1 Electrolyte jet processing device and electrolyte jet processing method
05/30/2013US20130134045 Dynamic current distribution control apparatus and method for wafer electroplating
05/30/2013US20130133926 Build-up printed circuit board and method of manufacturing the same
05/29/2013EP2596157A1 Press-in pin and method for producing same
05/29/2013DE102008029219B4 Verfahren für einen Flachdruck und eine Metall-Plattierung Method for a lithographic printing and a metal plating
05/29/2013CN202954124U Electrochemical deposition equipment for horizontal workpiece
05/29/2013CN202954122U Circuit board electroplating device
05/29/2013CN202954117U Electrochemical deposition equipment for cylindrical workpiece
05/29/2013CN202954116U Plated part capable of preventing accumulation of plating solution
05/29/2013CN202954115U Plating piece preventing accumulation of plating solution
05/29/2013CN202954113U Copper-tin alloy plating structure
05/29/2013CN202954112U Electrochemical deposition equipment for bending workpiece
05/29/2013CN202954111U Electrochemical deposition device for vertical workpieces
05/29/2013CN202954110U Portable copper bar electric brush tinning device
05/29/2013CN103124810A Method for manufacturing copper foil for printed circuit board and copper foil for printed circuit board
05/29/2013CN103123924A Manufacturing method for back-illuminated CMOS (complementary metal oxide semiconductor) image sensor
05/29/2013CN103122472A Pretreatment method for hard chromium plating process on surface of nuclear stainless steel material
05/28/2013US8450210 Sequential station tool for wet processing of semiconductor wafers
05/28/2013US8449948 Method and system for corrosion protection of layers in a structure of a magnetic recording transducer
05/28/2013US8449753 Plating pretreatment apparatus and method for cylinder block
05/28/2013US8449752 Trailing plated step
05/23/2013WO2013074038A1 Electrical contact with embedded solid lubricant particles
05/23/2013WO2013073452A1 Method for manufacturing brass-plated steel wire and brass -plated steel wire
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