Patents for C25D 19 - Electrolytic coating plants (590)
08/2005
08/04/2005WO2002097171A3 Plant for the surface treatment of metallic end-products, in particular aluminum, by means of a plasma effect generated in the so-called helmotz layer of a dielectric solvent, changed into a conductor by its solution with an acid in an electrochemical cell
07/2005
07/21/2005US20050155865 Electrolytic processing apparatus and method
07/14/2005WO2005064043A2 Improved metal strip electroplating
07/14/2005CA2551273A1 Improved metal strip electroplating
06/2005
06/29/2005CN1633525A Conveyorized horizontal processing line and method of wet-processing a workpiece
05/2005
05/05/2005US20050092600 Substrate holder, plating apparatus, and plating method
04/2005
04/14/2005US20050076837 Conveyorized horizontal processing line and method of wet-processing a workpiece
03/2005
03/24/2005DE19748926B4 Verfahren zum Galvanisieren einer siliciumhaltigen Aluminiumlegierung, Zylinderblock aus einer siliciumhaltigen Aluminiumlegierung Method of electroplating a silicon-containing aluminum alloy cylinder block of a silicon-containing aluminum alloy
01/2005
01/18/2005US6844274 Substrate holder, plating apparatus, and plating method
01/05/2005EP1492907A1 Electropolishing and/or electroplating apparatus and methods
12/2004
12/30/2004US20040262164 Method and apparatus for managing plating interruptions
12/23/2004US20040256240 System and process to control electroplating a metal onto a substrate
12/01/2004EP1481116A1 Conveyorized horizontal processing line and method of wet-processing a workpiece
12/01/2004EP1230441B1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method
11/2004
11/18/2004DE10210538B4 Horizontal-Durchlaufanlage und Verfahren zum galvanotechnischen Behandeln von Behandlungsgut Horizontal continuous flow system and method for electroplating treatment of treated
11/10/2004EP1222321B9 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
10/2004
10/26/2004US6809029 Semiconductor production device and production method for semiconductor device
09/2004
09/23/2004US20040182694 Electrolzsis cell for restoring the concentration of metal ions in electroplating processes
09/22/2004EP1458905A2 Electrolzsis cell for restoring the concentration of metal ions in electroplating processes
09/15/2004EP1222321B8 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
09/14/2004US6790377 Method for electrochemical fabrication
09/09/2004US20040173064 Turn-table type roll stock apparatus and plating factory for process roll for gravure printing
09/01/2004CN1524711A Turn-table type roll stock apparatus and plating factory for process roll for gravure printing
08/2004
08/25/2004EP1449649A2 Turn-table type cylinder stock in a plating factory for gravure printing cylinders
08/24/2004US6780253 Gradient dragout system in a continuous plating line
08/19/2004US20040159553 Semiconductor manufacturing apparatus and method for manufacturing semiconductor devices
08/04/2004CN1517453A Electroplating device, electroplating cup and cathode ring
07/2004
07/28/2004EP1441048A2 Plating apparatus, plating cup and cathode ring
07/28/2004CN1516755A Plating apparatus, plasting method and method for mfg. semiconductor device
07/22/2004US20040140199 Plating apparatus, plating cup and cathode ring
07/01/2004WO2003002784A3 Electrolysis cell for restoring the concentration of metal ions in electroplating processes
06/2004
06/30/2004CN1508296A Electroplating device and method thereof
06/24/2004US20040118676 Plating apparatus and plating method
06/23/2004EP1431424A2 Plating apparatus and plating method
06/03/2004US20040103921 Method for electrochemically treating articles and apparatus and method for cleaning articles
05/2004
05/06/2004US20040084319 Method for electrochemical fabrication
04/2004
04/28/2004CN1492082A Metal surface treating device
04/21/2004EP1328667B1 Compact processing installation for a printing cylinder
04/08/2004US20040065553 Contacting substrate with masking structure; multilayer, three-dimensional structure ; cycles; etching to remove residues
04/08/2004US20040065552 Method for electrochemical fabrication
02/2004
02/26/2004US20040037682 Substrate holder, plating apparatus, and plating method
02/04/2004EP1222321B1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
01/2004
01/29/2004US20040016645 Providing the component; placing the component in an electrolyte solution; and applying a plurality of pulses to the solution and component, wherein pulses have a pattern comprised of differentmagnitude portions
11/2003
11/25/2003US6652657 Method for electrochemically treating articles and apparatus and method for cleaning articles
11/12/2003CN1455947A Substrate processing apparatus
10/2003
10/23/2003WO2003087436A1 Electropolishing and/or electroplating apparatus and methods
10/23/2003CA2479794A1 Electropolishing and/or electroplating apparatus and methods
10/22/2003CN1125197C Plated aluminum alloy cylinder, planting pretreatment and planting method
09/2003
09/12/2003WO2003074768A1 Conveyorized horizontal processing line and method of wet-processing a workpiece
07/2003
07/30/2003CN1116449C Device for processing printed circuit boards
07/23/2003EP1328667A1 Compact processing installation for a printing cylinder
07/08/2003US6589400 Apparatus for metal coating of bands by electroplating
07/02/2003EP1015669A4 Article, method, and apparatus for electrochemical fabrication
06/2003
06/19/2003WO2003050328A1 Plating apparatus, plating method, and method for manufacturing semiconductor device
06/19/2003US20030113996 Semiconductor production device and production method for semiconductor device
06/19/2003CA2467037A1 Manufacturing method for semiconductor device
06/03/2003US6572742 Apparatus for electrochemical fabrication using a conformable mask
05/2003
05/20/2003US6565722 Installation and method for multilayered immersion coating
05/15/2003US20030089608 Substrate processing apparatus
05/13/2003US6562223 Using electrolyte solutions; for aluminum
03/2003
03/20/2003US20030051995 Plating device and plating method
01/2003
01/09/2003WO2003002784A2 Electrolysis cell for restoring the concentration of metal ions in electroplating processes
12/2002
12/17/2002US6495004 Substrate plating apparatus
12/11/2002CN1095883C Electrodeposition coating system
12/05/2002WO2002097171A2 Plant for the surface treatment of metallic end-products, in particular aluminum, by means of a plasma effect generated in the so-called helmotz layer of a dielectric solvent, changed into a conductor by its solution with an acid in an electrochemical cell
12/05/2002US20020179121 Gradient dragout system in a continuous plating line
11/2002
11/27/2002CN1382232A Method and device for electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
11/27/2002CN1382231A Method and device for electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on surface of electrically insulating film materials and use of
11/05/2002US6475369 Method for electrochemical fabrication
10/2002
10/30/2002EP1252650A1 Substrate processing apparatus
09/2002
09/25/2002EP1243672A1 Plating device and plating method
09/03/2002US6443167 Gradient dragout system in a continuous plating line
08/2002
08/14/2002EP1230441A1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method
07/2002
07/25/2002WO2002058114A1 Substrate processing apparatus
07/17/2002EP1222321A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
04/2002
04/25/2002DE10050750A1 Processing plant for printing cylinder has basic frame supporting units holding printing cylinders, track system for crane, and connections for control, power and fluid.
04/18/2002WO2002031231A1 Semiconductor production device and production method for semiconductor device
04/18/2002WO2002031229A1 Compact processing installation for a printing cylinder
02/2002
02/13/2002EP1179615A2 Method for electrochemically treating articles and apparatus and method for cleaning articles
02/07/2002US20020014255 Disposing an array of dedicated cells which includes an array of electrochemical processing cells; moving tubings relative to the array of dedicated cells, disposing electrolytic fluid in electrode chamber, performing electrolysis
01/2002
01/29/2002US6342146 Plating in baths with metls
01/24/2002US20020008035 Method and apparatus for anodizing objects
11/2001
11/21/2001CN1322863A Electroplating apparatus
08/2001
08/16/2001US20010014409 Article, method, and apparatus for electrochemical fabrication
07/2001
07/05/2001WO2001048275A1 Plating device and plating method
07/03/2001US6254759 Method and apparatus for anodizing objects
05/2001
05/23/2001EP1100984A1 Installation and method for multilayered immersion coating
05/10/2001DE19951325A1 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitenden Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens Method and apparatus for electrolytic treatment of electrically mutually insulated, electrically conductive structures on surfaces of electrically insulating foil material, as well as applications of the method
05/03/2001DE19951324A1 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Oberflächen von gegeneinander vereinzelten Platten- und Folienmaterialstücken sowie Anwendung des Verfahrens Method and apparatus for electrolytic treatment of electrically conductive surfaces of mutually isolated sheet and film material properties as well as application of the method
04/2001
04/26/2001WO2001029290A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
04/26/2001WO2001029289A1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method
04/26/2001CA2384249A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
04/26/2001CA2384244A1 Method and device for the electrolytic treatment of electrolytically conducting structures which are insulated from each other
02/2001
02/14/2001CN2419214Y Electroplating apparatus
01/2001
01/10/2001CN2414080Y High-speed electroplating equipment
11/2000
11/22/2000CN2407017Y Sheet article feeder for continuous electroplating
11/02/2000EP1048756A1 Substrate plating device
10/2000
10/03/2000US6126808 A reaction chamber holding an electrolyte for surface treating the head of aluminum pistons used in combustion engines
07/2000
07/05/2000EP1015669A1 Article, method, and apparatus for electrochemical fabrication
06/2000
06/06/2000US6071384 Arrangement for the electrogalvanic metal coating of strips
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