| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 01/13/1988 | EP0252440A2 Mist supplying device for forming thin film |
| 01/12/1988 | US4719145 Catalytic process and systems |
| 01/12/1988 | US4719128 Method of and apparatus for bailout elimination and for enhancing plating bath stability in electrosynthesis/electrodialysis electroless copper purification process |
| 01/12/1988 | US4719127 Metal oxide film |
| 01/12/1988 | US4719126 Pyrolytic deposition of metal oxide film from aqueous suspension |
| 01/12/1988 | US4718990 Controlling film thickness |
| 01/12/1988 | US4718972 Method of removing seed particles from circuit board substrate surface |
| 01/07/1988 | EP0251302A2 Alcaline chemical copper plating bath |
| 01/07/1988 | EP0251080A2 Process for metallising metallic articles by mechanical-chemical treatment |
| 01/07/1988 | EP0250867A1 Seeding process for electroless metal deposition |
| 01/05/1988 | US4717629 Impregnation pores of metal foam with metal coated alloy particles and compression molding |
| 01/05/1988 | US4717421 Stannous halide, alkali metal halide, palladium halide |
| 12/29/1987 | US4716059 Electroless codeposition |
| 12/29/1987 | US4716055 Conductive fiber and method of making same |
| 12/29/1987 | US4715941 Oxygen plasma etching of silicon-containing substance |
| 12/29/1987 | US4715894 Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
| 12/23/1987 | CN86103987A Chemical plating of copper, nickel and cobalt on ceramic and glass at normal temp. |
| 12/22/1987 | US4714535 Molded framework for electroless and electrolytic plating racks |
| 12/17/1987 | DE3619881A1 Process and product for improving the adhesive strength of a metal coating on a lead-containing brass moulding produced by machining |
| 12/16/1987 | EP0249425A2 Treating laminates |
| 12/09/1987 | EP0248683A2 Composition and process for the electrolytic coating of circuit boards without an electroless metal coating |
| 12/09/1987 | EP0248522A1 Electroless copper plating and bath therefor |
| 12/09/1987 | CN87102861A Electroless copper plating and bath therefor |
| 12/08/1987 | US4711822 Metal core printed circuit boards |
| 12/03/1987 | WO1987007311A1 Corrosion/wear-resistant metal coating compositions |
| 12/01/1987 | US4710403 Metallized polymers |
| 12/01/1987 | US4710224 Flowing hydrazine and inert gas into bath; copper deposition |
| 11/19/1987 | EP0245684A2 Metallized membranes |
| 11/17/1987 | US4707378 Method and apparatus for controlling the organic contamination level in an electroless plating bath |
| 11/17/1987 | US4707377 Copper plating |
| 11/17/1987 | CA1229266A1 Process for preparing a substrate for subsequent electroless deposition of a metal |
| 11/17/1987 | CA1229265A1 Method of providing a metal mirror |
| 11/11/1987 | EP0245016A2 Metallized polymers |
| 11/11/1987 | EP0244535A1 Improved electroless plating process |
| 11/04/1987 | EP0243794A1 Electroless plating method |
| 11/03/1987 | CA1228846A1 Reclamation of a palladium-tin based electroless plating catalyst from the exhausted catalyst solution and accompanying rinse waters |
| 10/28/1987 | EP0242745A1 Method and apparatus for controlling the chemical state of an electroless plating bath |
| 10/27/1987 | CA1228513A1 Composition and process for treating plastics with alkaline permanganate solutions |
| 10/21/1987 | EP0241754A1 Process for the adhesive metal-coating of polyether imide |
| 10/21/1987 | EP0241739A1 Method of modifying surfaces and application of the method in forming layered structures |
| 10/20/1987 | US4701351 Thin polymer layer complexes with noble metals; improves adhesion, consistency |
| 10/20/1987 | US4701350 Pretreatment with polyelectrolyte adsorption modifier |
| 10/20/1987 | CA1228267A1 Process for pretreating polyamide substrates for electroless metallisation |
| 10/14/1987 | EP0240589A1 Process and apparatus for regenerating an electroless copper-plating bath |
| 10/13/1987 | US4699811 Chromium mask for electroless nickel or copper plating |
| 10/13/1987 | US4699081 Means for detecting and adjusting metal salt concentration in an electroless plating bath |
| 10/07/1987 | EP0240268A1 Process for metallizing glass surface |
| 10/07/1987 | EP0239839A1 Electrophoretic insulation of metal circuit board core |
| 10/06/1987 | US4698124 Oxidizing with inorganic chlorates, hypochlorites, peroxydisulfates |
| 10/06/1987 | EP0227746A4 Process for conditioning the surface of plastic substrates prior to metal plating. |
| 10/06/1987 | CA1227767A1 Pickling, drying and metal coating carbonamide polymer prior to galvanic metal deposition |
| 09/23/1987 | EP0237663A1 Electroless deposition magnetic recording media process |
| 09/22/1987 | US4695505 Improved elongation |
| 09/22/1987 | US4695489 Electroless nickel plating composition and method |
| 09/16/1987 | EP0236875A2 Process for determining the activity of a palladium-tin catalyst |
| 09/16/1987 | EP0236718A1 Electroless plating with bi-level control of dissolved oxygen |
| 09/15/1987 | US4693916 Hydrosilicofluoric acid and metal or metal compound |
| 09/15/1987 | US4693907 Process or non-electrolytic copper plating for printed circuit board |
| 09/15/1987 | CA1226769A1 Multilayered chromium oxide bonded, hardened and densified coatings and method of making same |
| 09/11/1987 | WO1987005338A1 Palladium-base electroless plating solution |
| 09/09/1987 | EP0236034A2 Selective electroless plating of vias in vlsi devices |
| 09/09/1987 | EP0235297A1 Hot-dipped steel plate and process for its production |
| 09/09/1987 | CN87101667A Machine parts |
| 09/08/1987 | US4692360 Metal interlayers in films by counter-current diffusion |
| 09/08/1987 | US4692356 Redox reactions; indium-tin alloy, catalytic germination layer, vitreous substrate, copper plating |
| 09/08/1987 | US4692349 Selective electroless plating of vias in VLSI devices |
| 09/08/1987 | US4692346 Method and apparatus for controlling the surface chemistry on objects plated in an electroless plating bath |
| 09/01/1987 | USH325 Electroless deposition of transition metals |
| 09/01/1987 | US4690715 Disulfides and phosphines bonding with substrate and noble metals, silver, aluminum |
| 09/01/1987 | CA1226180A1 Process for the adhesion-activation of polyamide substrates for electroless metallisation |
| 08/19/1987 | EP0233145A1 Polymeric compositions containing a dissolved dibenzal acetone palladium complex |
| 08/19/1987 | EP0232434A1 Method for depositing thin, transparent metal oxide films |
| 08/18/1987 | CA1225549A1 Electroless plating bath monitor |
| 08/18/1987 | CA1225501A1 Aqueous electroless nickel plating bath and process |
| 08/12/1987 | EP0232063A2 Metal interlayers in films by counter-current diffusion |
| 08/12/1987 | EP0231795A2 Method for making printed circuit boards |
| 08/12/1987 | CN87100186A Process for adhesiven metallization on the ceranlic matarial |
| 08/11/1987 | US4686114 Pretreatment by applying sensitizing solution, then optical beam to unmasked segments to flash evaporate sensitizer before plating |
| 08/11/1987 | US4686017 Depositing or removing a metal |
| 08/04/1987 | US4684550 Electroless copper plating and bath therefor |
| 08/04/1987 | US4684545 Electroless plating with bi-level control of dissolved oxygen |
| 08/04/1987 | CA1224985A1 Porous ceramic thin film and process for preparing the same |
| 08/04/1987 | CA1224957A1 Method for depositing a metal on a surface |
| 07/29/1987 | EP0229915A1 Process for the highly adhesive metallization of ceramic materials |
| 07/22/1987 | EP0229344A1 Method for selective chemical plating |
| 07/21/1987 | US4681774 Sensitization |
| 07/21/1987 | US4681630 Method of making copper colloid for activating insulating surfaces |
| 07/16/1987 | WO1987004190A1 Fabrication of electrical conductor by augmentation replacement process |
| 07/15/1987 | EP0228664A1 Copper deposition from electroless plating bath |
| 07/14/1987 | CA1224276A1 Process for producing printed circuits |
| 07/14/1987 | CA1224092A1 Microporous metal-plated polytetrafluoroethylene articles and method of manufacture |
| 07/08/1987 | EP0227746A1 Process for conditioning the surface of plastic substrates prior to metal plating |
| 07/01/1987 | EP0227518A1 Hydrazine bath for the chemical deposition of nickel and/or cobalt, and process for preparing the same |
| 06/24/1987 | EP0225885A1 Method and composition for electroless nickel deposition |
| 06/23/1987 | US4675207 Process and apparatus for the deposition on a substrate of a thin film of a compound containing at least one cationic constituent and at least one anionic constituent |
| 06/23/1987 | US4675111 Solution waste treatment module |
| 06/23/1987 | US4674440 Apparatus for automatically replenishing an electroless plating bath |
| 06/23/1987 | CA1223157A1 Method for controlling plating rate in an electroless plating system |
| 06/16/1987 | US4673585 Process for the preparation of the surface of uranium or uranium-based alloy parts |
| 06/10/1987 | EP0225244A1 Pretreating process for uranium-titanium alloy work pieces, particularly for electroless nickel plating |