Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
03/2014
03/19/2014CN203487236U Inclined type circuit board chemical nickel immersion gold hanging basket
03/19/2014CN203487235U Full-automatic tank-type chemical plating equipment
03/19/2014CN103643227A Polyimide and silver nanoflower composite film and preparation method thereof
03/19/2014CN103643226A Oil-removing and antirust cleaning liquid for steel substrate chemical copper plating
03/19/2014CN103643225A Method of preparing large-dimension cadmium sulfide film by chemical water-bath method
03/19/2014CN103643224A Microwave hydrothermal method for preparing CoTiO3 membrane
03/19/2014CN103643223A Chemical nickel-plating method and chemical nickel-plating method device for large steel cylinder
03/19/2014CN102964910B Use of water-soluble tetra sodium sulfonate phenyl porphyrin metal complex in microcontact printing
03/19/2014CN102964909B Use of water-soluble zinc porphyrin complex in microcontact printing
03/19/2014CN102676063B Method and special polishing liquid for reworking and repairing solid welding wires
03/19/2014CN102634805B Method for preparing magnesium alloy with super-hydrophobic layer on surface
03/19/2014CN102508327B Method for preparing aluminum and silicon carbide composite material reflector with high volume fraction
03/13/2014WO2014038325A1 Masking agent, and method for producing surface-treated base
03/13/2014WO2013190587A3 Method for the treatment of metal surfaces for bestowing thereon a high hydrophobicity and oleophobicity
03/13/2014WO2013050332A3 Formaldehyde-free electroless copper plating solution
03/13/2014US20140072822 Primer for electroless plating comprising hyperbranched polymer and metal fine particles
03/13/2014US20140072706 Direct Electroless Palladium Plating on Copper
03/12/2014EP2705172A2 Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method
03/12/2014EP2704826A1 Electrode for electrolytic processes and method of manufacturing thereof
03/12/2014CN103635606A Plating process to increase coin blank surface hardness
03/12/2014CN103633184A Processing system and method for depositing thin films on substrate of solar cell
03/12/2014CN103632794A Composite soft magnetic material and method for preparing material
03/12/2014CN103628051A Plating catalyst and method
03/12/2014CN103628050A Method for preparing composite graphene/silane film on surface of metal
03/12/2014CN103628049A Surface treating apparatus and groove body
03/12/2014CN103627923A Conductive material with high thermal conductivity and low friction coefficient and preparation method thereof
03/12/2014CN102575351B Solution and method for activating oxidized surface of semiconductor substrate
03/12/2014CN102260864B Preparation method of attapulgite/copper-core shell structure one-dimensional rod-like superfine copper powder
03/06/2014WO2014034365A1 Aluminum conductive member and method for producing same
03/06/2014US20140065411 Uv curable catalyst compositions
03/06/2014DE102012017058A1 Low-turbulence flow chemical coating unit for coating printed circuit board, has coating module which is provided with propeller device which moves and transports coating material with low-turbulence flow
03/05/2014EP2703451A2 Silver coating pigment, and method for producing same
03/05/2014CN103620087A A chemical bath deposition apparatus for fabrication of semiconductor films
03/05/2014CN103619129A Method for printing copper conducting circuits in ink-jet mode
03/05/2014CN103613289A Method for electroless copper plating on glass substrate
03/05/2014CN103611933A Method for efficiently preparing nickel-coating copper composite powder through ultrasonic chemistry
02/2014
02/27/2014WO2014031661A1 Immobilization of technetium by electroless plating
02/27/2014WO2014029667A2 Method and device for light-induced or light-supported depositing of metal on a surface of a semiconductor component
02/27/2014WO2013053518A3 Electroless palladium plating bath composition
02/27/2014DE102013108240A1 Thin-film processing system useful for chemical bath deposition on solar cell substrates for treatment of substrates, comprises solution delivery unit, unit for chemical bath deposition, and solution outflow
02/26/2014EP2700738A1 Corrosion-resistant alloy coating film for metal materials and method for forming same
02/26/2014EP2699712A2 Edge bending jig and method for mesh-type electrode substrate, and hanging jig and method for mesh-type electrode substrate
02/26/2014CN203451619U Sieve basket used for processing fiber material
02/26/2014CN103608172A Fabrication of mirror-like coatings
02/26/2014CN103602966A Amorphous zinc oxide/titanium/phosphorus composite material manufacturing method
02/26/2014CN103602965A Chemical nickel plating process for solving problems of diffusion plating and skip plating
02/26/2014CN103602964A Method for preparing metal electrode on grapheme conductive film
02/26/2014CN103602963A Novel electroplating facility
02/26/2014CN103602947A Method for plating copper on flexible substrate
02/25/2014US8656858 Device and method for chemically and electrolytically treating work pieces using a conveyor system to transport work pieces between treatment tanks
02/20/2014WO2014026806A2 Plating bath composition for immersion plating of gold
02/20/2014DE102012212598A1 Verzinnende Vorbehandlung von verzinktem Stahl in Gegenwart von Pyrophosphat Tinned pretreatment of galvanized steel in the presence of pyrophosphate
02/19/2014EP2698449A1 Plating bath composition for immersion plating of gold
02/19/2014EP2698448A1 Electroless plating primer including hyperbranched polymer and metallic microparticles
02/19/2014CN103597118A Hard-film-covered member covered by hard film, and method for manufacturing same
02/19/2014CN103597103A Device and method for recovering a recovering material from a recovering fluid containing the recovering material
02/19/2014CN103590022A Method for making film through ultrasonic atomization-microwave pyrolysis
02/19/2014CN103590021A Method for improving precious metal content of precious metal oxide coating
02/19/2014CN103589360A Preparation method of bionic gecko adhesive tape
02/19/2014CN103589065A Composite material containing di-metallocene acylhydrazone type complex and preparation method of composite material
02/19/2014CN103586464A Method for manufacturing single walled carbon nanotube surface nickel copper coating
02/19/2014CN103073303B Method for preparing highly oriented (100) lead-free piezoelectric thin film
02/19/2014CN102703887B Nickel-copper alloy liquid for chemical plating and electroplating and method for preparing nickel-copper alloy noncrystalline-based composite coating
02/19/2014CN102560445B Process for chemically and compositely plating nickel and phosphorus on sintered neodymium iron boron
02/19/2014CN102321892B Method for preparing composite active cathode
02/18/2014US8652345 Method of forming a patterned substrate
02/13/2014WO2014023899A1 Method for metallizing a part for a motor vehicle
02/13/2014WO2014023898A1 Method for metallizing a surface of a part for a motor vehicle
02/13/2014WO2013186082A9 Method for producing indium oxide-containing layers
02/13/2014DE102012015459A1 Horizontal system, used to chemically coat substrate e.g. printed circuit board, includes coating module that is adapted for applying coating material on substrate and includes propeller device for moving material with low-turbulence flow
02/13/2014DE102010011269B4 Verfahren zum Abscheiden einer für das Drahtbonden geeigneten Palladiumschicht auf Leiterbahnen einer Schaltungsträgerplatte und Verwendung eines Palladiumbades in dem Verfahren A method for depositing a position suitable for wire bonding palladium layer on conductor paths of a circuit board and using a palladium bath in the process
02/12/2014CN203429270U Rotation device for surface treatment of workpiece
02/12/2014CN203429262U Water-saving device for PCB (printed circuit board) electroless nickel immersion gold
02/12/2014CN203429254U Integral-tank PCB (Printed Circuit Board) chemical copper filtering and reacting equipment
02/12/2014CN203429253U Electroless plating device
02/12/2014CN203429252U Electromagnetic oven water-bath heating chemical plating device
02/12/2014CN203426102U Welding-wire copper-plating air-blowing device
02/12/2014CN103582722A Electrical contact component
02/12/2014CN103582617A Substrate element for coating with an easy-to-clean coating
02/12/2014CN103572287A Preparation method for wear resistant and anti-bonding process roller surface composite layer
02/12/2014CN103572286A Recombined deposition and decoration method for magnesium alloy surfaces
02/12/2014CN103572270A Preparation method of metal-polymer composite filter screen
02/12/2014CN103572269A Method for manufacturing printed circuit board
02/12/2014CN103572268A Chemical copper plating liquid and chemical copper plating method
02/12/2014CN103572267A Method for forming long-acting surface coating applied to carbon steel-water heat pipe
02/12/2014CN103572266A Catalyst solution for electroless copper plating, producing method thereof, and electroless copper plating method using the same
02/12/2014CN103572265A Plastic surface roughing agent, preparation method thereof, surface metalizing method for bicolor plastic
02/12/2014CN103572264A Circuit board surface treatment method
02/12/2014CN103572263A Plastic surface metallization method and plastic product with surface having metal pattern
02/12/2014CN103569699A Substrate transmitting device
02/12/2014CN102534577B Roughening liquid and preparation method thereof, and acrylonitrile-butadiene-styrene terpolymer surface electroplating method
02/12/2014CN102418091B Plastic product and preparation method for same
02/12/2014CN102216490B Formulations containing mixture of ZnO cubanes and method for producing semiconducting ZnO layers using said formulations
02/12/2014CN102029391B Stainless steel based metal fiber porous material with high specific surface area and preparation method thereof
02/11/2014US8647577 Chemical coating of microwell for electrochemical detection device
02/06/2014US20140037982 Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers
02/05/2014EP2691976A1 Method of controlling silicon oxide film thickness
02/05/2014EP2691561A1 Installation for treating workpieces with a processing fluid
02/05/2014EP2691558A2 Cathodic protection by coating for cooling circuits or other holes or channels
02/05/2014CN103562436A Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for same
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