Patents for C09J 193 - Adhesives based on natural resins; Adhesives based on derivatives thereof (1,207) |
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06/23/2004 | CN1154514C Covering for human body or one part of article |
05/06/2004 | WO2004037939A1 Heat-curable adhesive composition |
04/29/2004 | US20040082714 Processes for producing polymerized rosin |
04/22/2004 | WO2003029379A8 Method of gluing hydrophobic and oleophobic substrates which are intended for packaging |
04/22/2004 | US20040077759 A blend of at least one styrene block copolymer, and at least one compatible tackifying resin; suitable for the production of multilayer films intended for what are called "repositionable" package that are opened and reclosed easily |
04/21/2004 | CN1491267A Hot-extrudable thermofusible self-adhesives and use thereof in multi-layer films |
03/17/2004 | CN1482199A Mass ultraprecise processing mucilage glue for Ultrathin monocrystal single substrate and its process |
03/10/2004 | EP1395639A1 Hot-extrudable thermofusible self-adhesives and the use thereof in multi-layer films |
02/26/2004 | WO2004016705A2 Hot melt adhesive composition |
02/17/2004 | US6692560 Sizing composition |
02/12/2004 | WO2004013246A1 Acrylic pressure sensitive adhesives |
02/12/2004 | US20040029980 Hybrid plastisol/hot melt compositions |
02/12/2004 | CA2493998A1 Acrylic pressure sensitive adhesives |
02/05/2004 | WO2004011569A1 Hybrid plastisol/hot melt compositions |
02/05/2004 | US20040024127 An addition-condensation copolymer consisting of a polyolefin backbone and polyamide graft through an unsaturated monomer chosen from carboxylic acids, anhydrides, epoxides; processing around 180 degrees Celsius |
01/29/2004 | WO2003095514A3 A phenolic-modifie rosin terpene resin |
01/28/2004 | CN1471410A Hot melt wetness indicator adhesive composition with controllable color change |
12/11/2003 | US20030229178 Heat resistance; tackifier resin |
12/10/2003 | EP1369462A1 Processes for producing polymerized rosin |
11/25/2003 | US6653398 Hot melt, pressure sensitive adhesive |
11/20/2003 | WO2003095514A2 A phenolic-modifie rosin terpene resin |
11/13/2003 | US20030212202 Hot melt adhesive composition |
11/13/2003 | US20030212201 Pressure sensitive adhesives |
11/12/2003 | EP1360069A2 In situ microencapsulated adhesive |
11/05/2003 | EP1358290A1 Hot melt adhesive composition |
11/05/2003 | EP0975707B1 Pololefin based hot melt adhesive composition |
11/05/2003 | CN1453324A Water soluble polymer glue powder |
10/29/2003 | CN1451708A Environment protection spray universal adhesive, and preparation and use method thereof |
10/29/2003 | CN1125860C Adhesive for adhering metal with nonmetal and its prepating process |
10/16/2003 | WO2003085733A1 Thermosetting adhesive sheet with electroconductive and thermoconductive properties |
10/08/2003 | CN1446872A Adhesive for prepn. of seasoning tea and its prepn. process |
10/01/2003 | EP1348749A2 Composition |
09/25/2003 | US20030181586 Adhesive composition |
09/25/2003 | CA2423075A1 Adhesive composition |
09/17/2003 | CN1442193A Method of continuously producing eucommia extract powder, gutta percha, eucommia resin and organic fertilizer using eucommia leaf |
09/10/2003 | EP1342764A2 Hot melt adhesive based on graft copolymers with polyamide blocks |
09/10/2003 | CN1441833A Polyolefin-based hot melt adhesive for deflection yoke |
09/10/2003 | CN1441023A Thermal smelting adhesive based on polyamide block graft copolymer |
09/02/2003 | US6614728 Time-temperature integrating indicator |
08/26/2003 | CA2418785A1 Hot-melt adhesives made from polyamide block graft copolymers |
08/14/2003 | US20030152707 Overcoating cellulose with heated triglyceride; solidification |
07/30/2003 | EP1330272A2 Hot melt wetness indicator adhesive composition |
07/30/2003 | CN1116361C Low foaming dispersed rosin size |
07/22/2003 | CA2271662C Adhesive varnish for absorbing powder paint |
07/17/2003 | WO2003057983A1 Repulpable wax |
07/17/2003 | CA2472159A1 Repulpable wax |
07/15/2003 | US6593407 For hot filled packaging |
07/15/2003 | US6592990 In situ microencapsulated adhesive |
07/08/2003 | US6590070 Ethylene-glycidyl (meth)acrylate copolymer, a rosin having a carboxyl group, and a (meth)acrylate having a carboxyl group such as methacrylic acid; bonding electronic parts; capable of being cured using a low dose of radiation |
07/02/2003 | CN1427771A In situ microencapsulated adhesive |
06/11/2003 | CN1422928A Additive of applying condensed tannin extracts as adhesive for thermosetting wood |
06/05/2003 | US20030105259 Pine rosin/ formaldehyde reaction product used for the production of a hotmelt adhesive, which after bonding is removed from the substrates in alkaline medium |
06/04/2003 | CN1422312A Process for producing polymerized rosin |
05/29/2003 | US20030097964 Sizing composition |
05/28/2003 | CN1420152A Hot-melt adhesive for location of deflecting coil of color display, and method for producing same |
05/21/2003 | EP1144526B1 Light-colored rosin esters and adhesive compositions |
05/21/2003 | CN1419585A Hot melt adhesive based on semicrystalline fiexible polyolefins |
05/13/2003 | US6562888 Light-colored rosin esters and adhesive compositions |
05/07/2003 | CN1416456A Sulfonated copolyester based water -dispersible hot melt adhesive |
05/01/2003 | WO2002090653A3 Sizing dispersion |
04/10/2003 | WO2003029379A1 Method of gluing hydrophobic and oleophobic substrates which are intended for packaging |
04/03/2003 | US20030065048 Radiation curable adhesive |
03/27/2003 | WO2003025530A1 Time-temperature integrating indicator |
03/27/2003 | CA2460253A1 Time-temperature integrating indicator |
03/25/2003 | US6537474 Method for manufacturing plastic-substitute goods by using natural materials |
03/20/2003 | US20030053377 Time-temperature integrating indicator |
03/12/2003 | CN1401726A Toothpaste adhesive--nonionic modified guar gum |
03/12/2003 | CN1401725A Cation guar gum |
03/05/2003 | CN1400994A Polyester tackifier and adhesive composition |
02/27/2003 | WO2002036177A3 Hot melt wetness indicator adhesive composition |
01/14/2003 | US6506242 Colophony, a drying oil, solvent comprises a naphtha hydrocarbon and technical alcohol; display windows |
01/09/2003 | WO2003002684A1 Radiation curable adhesive |
01/09/2003 | CA2421045A1 Radiation curable adhesive |
01/08/2003 | EP1272589A1 Use of a resin for producing a hot-melt-type adhesive |
01/02/2003 | EP1268701A2 Sulfonated copolyester based water-dispersible hot melt adhesive |
11/26/2002 | US6486246 Polyolefin based hot melt adhesive composition |
11/14/2002 | WO2002090653A2 Sizing dispersion |
11/14/2002 | US20020169233 Pressure sensitive or flowable |
11/14/2002 | CA2446338A1 Sizing dispersion |
11/13/2002 | EP1255795A1 Polyester tackifier and adhesive composition |
10/30/2002 | EP1252231A1 Hot melt adhesive based on semicrystalline flexible polyolefins |
10/10/2002 | US20020146526 Hot melt adhesive composition |
10/09/2002 | CN1092222C Thermosol powder contg. colophony and lac, and process for preparing same |
08/22/2002 | WO2002064694A1 Hot-extrudable thermofusible self-adhesives and the use thereof in multi-layer films |
08/22/2002 | CA2437857A1 Hot-extrudable thermofusible self-adhesives and the use thereof in multi-layer films |
08/15/2002 | WO2002062912A1 Hot melt adhesive composition |
08/15/2002 | WO2002062911A1 Processes for producing polymerized rosin |
08/06/2002 | US6428900 Sulfonated copolyester based water-dispersible hot melt adhesive |
07/03/2002 | EP0778871B1 Adhesive agent for adhering an object to its base |
06/06/2002 | WO2002020683A3 In situ microencapsulated adhesive |
05/10/2002 | WO2002036177A2 Hot melt wetness indicator adhesive composition |
04/03/2002 | EP1098947B1 Mixture of colophonium resing and wax |
04/03/2002 | CN1342735A Aqueous emulsion type nm adhesive for paper or plastics and its preparing process |
03/14/2002 | WO2002020683A2 In situ microencapsulated adhesive |
03/07/2002 | WO2001066666A3 Sulfonated copolyester based water-dispersible hot melt adhesive |
02/20/2002 | EP0724613B1 Binders based on fat chemical reaction products |
01/30/2002 | CN1333318A Technology for producing Amorphophallus rivieri glue |
01/17/2002 | DE10031139A1 Method for mounting and demounting semiconductor plates, e.g. for polishing, involves forming easily breakable joint using filler-containing resin-based cement with temperature-dependent adhesive-brittle properties |
01/03/2002 | WO2002000807A1 Polyolefin-based hot melt adhesive for deflection yoke |
01/02/2002 | CN1077128C Adhesive agent for adhering an object to its base |