| Patents for C09J 135 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers (638) |
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| 11/29/2006 | EP1159369B1 Removable emulsion pressure-sensitive adhesives |
| 11/29/2006 | CN1286934C Resin bonding type compound for magnet and resin bonding type magnet using same |
| 11/15/2006 | EP1721951A1 Water-based adhesive for polarizing element and polarizer obtained with the same |
| 11/01/2006 | CN1854231A Die attach adhesives with improved stress performance |
| 10/19/2006 | WO2006108688A2 Dispersion |
| 10/19/2006 | CA2602235A1 Dispersion |
| 10/12/2006 | US20060225840 Non-leaching adhesvie system and its use in a liquid immersion objective |
| 09/27/2006 | CN1839187A Non-leaching adhesive system and its use in a liquid immersion objective |
| 09/26/2006 | US7112639 Polymers |
| 09/06/2006 | EP1697481A2 Bioadhesive polymers with catechol functionality |
| 08/29/2006 | US7098291 Hot-melt adhesive |
| 08/23/2006 | EP1409561B1 Process for improving water-whitening resistance of pressure sensitive adhesives |
| 08/10/2006 | WO2006057797A3 Switch structures or the like based on a thermoresponsive polymer |
| 08/02/2006 | CN1267467C MIxture of grafted polyamide-block and flexible polyolefin copolymers |
| 07/05/2006 | EP1675908A1 A composition useful as an adhesive and use of such a composition |
| 07/05/2006 | EP1448340B1 Assembly system for stationing semiconductor wafer and process for manufactoring semiconductor wafer |
| 06/22/2006 | DE102004060286A1 Radikalisch homo- oder copolymerisierbare Verbindungen, ein Verfahren zu ihrer Herstellung und ihre Verwendung Free-radically homopolymerizable or copolymerizable compounds, a process for their preparation and their use |
| 06/13/2006 | US7060759 Urethane polymer compositions |
| 06/01/2006 | WO2006057797A2 Switch structures or the like based on a thermoresponsive polymer |
| 05/24/2006 | EP1658343A2 Non-leaching adhesive system and its use in a liquid immersion objective |
| 05/24/2006 | CN1775884A Anisotropic conductive rubber film comprising oxidation-reduction initiating system microcapsule and its preparation |
| 05/09/2006 | US7041754 acrylic-/vinyl- ester containing polymers, nonionic surfactants, anionic surfactants, and deionized water; improved stability, durability |
| 05/02/2006 | US7037572 Trough-edge building panel and method of manufacture |
| 04/19/2006 | CN1252144C Adhesive of fixing matrix for microelectronic device |
| 04/12/2006 | CN1757676A Urethane polymer compositions |
| 04/05/2006 | CN1249190C Pressure-sensitive adhesive composition curable with actinic energy ray and pressure-sensitive adhesive sheet |
| 04/05/2006 | CN1249113C Urethane polymer compositions |
| 04/04/2006 | US7021018 Panelized wall system utilizing adhesive-edge building panels |
| 03/15/2006 | CN1245429C Carbamate polymer composition |
| 03/08/2006 | EP1159368B1 Pressure-sensitive adhesive compositions and pressure-sensitive adhesive label constructions exhibiting low adhesive residue in printers |
| 01/24/2006 | US6988343 Panelized wall system utilizing trough-edge building panels |
| 12/29/2005 | US20050288427 prevents exfoliation of an adhesive or reduction in adhesive strength of circuit by minimizing the heat-contraction occurring in the process of a polymerization or a hardening reaction when connecting micro-circuits, a short circuit between adjacent electrodes can be prevented when connecting circuits |
| 12/28/2005 | CN1712483A Isotropic conductive adhesive and adhesive film using the same |
| 11/17/2005 | WO2005108519A1 Aqueous resin dispersion for adhesive and composition thereof |
| 11/10/2005 | WO2005105942A1 Curable adhesive composition and its use in the optical field |
| 11/10/2005 | US20050250870 Curable adhesive composition and its use in the optical field |
| 11/02/2005 | EP0869761B1 Improved denture adhesive composition |
| 10/19/2005 | EP1347788B1 Antimicrobial hot melt adhesive |
| 10/19/2005 | EP0774949B1 Denture adhesive |
| 10/13/2005 | WO2005019365A3 Non-leaching adhesive system and its use in a liquid immersion objective |
| 10/06/2005 | US20050222330 Adding an aromatic bismaleimide resin powder that does not dissolve in liquid curable resins; cyanate ester resin, polyisobornyl or lauryl (meth)acrylate and/or (meth)acrylated polybutadiene; flexibility, heat resistance; semiconductor packages |
| 10/05/2005 | EP1582574A1 Method to improve high temperature cohesive strength with adhesive having multi-phase system |
| 10/05/2005 | CN1676564A Method to improve high temperature cohesive strength with adhesive having multi-phase system |
| 09/21/2005 | EP1117365B1 Improved denture adhesive |
| 09/15/2005 | WO2005085383A1 Water-based adhesive for polarizing element and polarizer obtained with the same |
| 09/15/2005 | US20050202070 Antimicrobial properties; use in surgical incise drapes; iodine and/or iodide salt are combined with a pre-adhesive composition in a hot melt mixer, with an iodine/iodide complexing agent such as polyvinylpyrrolidone present in the mixture |
| 09/15/2005 | US20050201974 Bioadhesive polymers with catechol functionality |
| 09/15/2005 | CA2557763A1 Water-based adhesive for polarizing element and polarizer obtained with the same |
| 09/06/2005 | US6939936 Iodine/iodide-containing hot melt coatable adhesive, methods and uses therefor |
| 08/31/2005 | CN1663048A Interlayer dielectric and pre-applied die attach adhesive materials |
| 08/03/2005 | CN1213084C Preparation method and application of modified double maleimide resin |
| 08/02/2005 | US6924016 Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer |
| 07/28/2005 | WO2005056708A3 Bioadhesive polymers with catechol functionality |
| 07/20/2005 | CN1643095A Adhesive compositions containing organic spacers and methods for use thereof |
| 06/23/2005 | WO2005056708A2 Bioadhesive polymers with catechol functionality |
| 06/23/2005 | CA2549195A1 Bioadhesive polymers with catechol functionality |
| 04/14/2005 | WO2005033198A1 A composition useful as an adhesive and use of such a composition |
| 04/13/2005 | EP0947189B1 Wet tacky compositions, plaster patches comprising the same, and methods for using the same |
| 04/13/2005 | CN1606501A Trough-edge building panel and method of manufacture |
| 04/13/2005 | CN1606500A Trough-edge building panel and method of manufacture |
| 04/05/2005 | US6875520 Mixture of grafted polyamide-block and flexible polyolefin copolymers |
| 03/30/2005 | EP1417096A4 Optical adhesive coating having low refractive index |
| 03/22/2005 | US6870001 Emulsifier mixture for emulsion polymerization |
| 03/03/2005 | WO2005019365A2 Non-leaching adhesive system and its use in a liquid immersion objective |
| 03/03/2005 | CA2535967A1 Non-leaching adhesive system and its use in a liquid immersion objective |
| 03/01/2005 | US6861152 Pressure sensitive adhesives |
| 01/19/2005 | EP1497389A1 Iodine/iodide-containing hot melt coatable adhesive, methods and uses therefor |
| 01/19/2005 | CN1568244A Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer |
| 01/13/2005 | US20050008832 Connecting microelectronic circuit |
| 12/15/2004 | EP1135449B1 Hot-melt adhesive for glueing dvds |
| 12/08/2004 | CN1553924A Process for improving water-whitening resistance of pressure sensitive adhesives |
| 11/25/2004 | US20040234753 Flame-retardant pressure-sensitive adhesive, processes for preparing it, and its use for producing a pressure-sensitive adhesive tape |
| 10/28/2004 | US20040211139 Panelized wall system utilizing joint tape |
| 10/19/2004 | US6806309 Maleimide containing monomer, cure initiator and polymers; controlled bond line thickness and uniformity; semiconductor packaging; stacking without need for spacer die |
| 10/14/2004 | US20040202810 Joint tape and method of manufacture |
| 10/13/2004 | EP1198502B1 Pressure sensitive adhesives |
| 10/12/2004 | US6803100 Effective even after high temperature storage; colloid dispersion containing n-vinyl-pyrrolid-2-one and water insoluble acrylic ester copolymer with micelle forming emulsifier |
| 09/30/2004 | US20040192820 Mixture of acrylic ester-vinyl ester copolymer with nonionic and anionic surfactant in deionized water; impreoved stability, durability |
| 09/30/2004 | DE10312031A1 Schwerentflammbare Haftklebemasse, Verfahren zu ihrer Herstellung sowie ihre Verwendung zur Herstellung eines Haftklebebandes Flame-resistant PSA processes for their preparation and their use for producing an adhesive tape |
| 09/29/2004 | EP1461204A1 Adhesive-edge building panel and method of manufacture |
| 09/29/2004 | CN1532247A Flame-retardant pressure sensitive adhesive, its preparing process and its use in producing pressure sensitive adhesive tape |
| 09/22/2004 | EP1460119A1 Flameproof adhesive, its production as well as its use in the production of adhesive tape |
| 09/21/2004 | CA2131542C Improvements in emulsion pressure-sensitive adhesives |
| 09/15/2004 | EP1147155B1 Rewettable adhesive systems |
| 09/01/2004 | EP1451419A1 Caulkless panelized wall system |
| 09/01/2004 | EP1451262A1 Joint tape and method of manufacture |
| 09/01/2004 | EP1451007A1 Trough-edge building panel and method of manufacture |
| 09/01/2004 | CN1164657C Pressure sensitive adhesives |
| 08/31/2004 | US6784025 Semiconductor package with a die attach adhesive having silane functionality |
| 08/25/2004 | EP1448340A1 Assembly system for stationing semiconductor wafer and process for manufactoring semiconductor wafer |
| 08/25/2004 | CN1523074A Room temperature printable adhesive paste |
| 08/18/2004 | EP1447421A1 Room temperature printable adhesive paste |
| 08/12/2004 | US20040158008 Bonding silicon chip to substrate; mixture of epoxy resin and bismaleimide resin |
| 08/05/2004 | WO2004065439A1 Petroleum resin, production process therefor, and adhesive compositions |
| 07/27/2004 | US6767424 Hot-melt adhesive for glueing DVDs |
| 07/22/2004 | US20040142192 polymer with acid functional groups and polymer with basic functional groups, which may be combined an a single polymer; especially industrial contact glues used in the foam industry containing polychloroprene |
| 07/14/2004 | CN1513043A Coagulating agent and solution for production of bi-component or multi-component glues ,glueing method and corresponding device |
| 05/26/2004 | EP1422279A1 Semiconductor package with a die attach adhesive having silane functionality |
| 05/20/2004 | US20040097638 Polymer comprised of at least vinyl acetate, acrylic acid or acid anhydride and monomer having high water solubility and low glass transition temperature |
| 05/20/2004 | US20040097014 Semiconductor package with a die attach adhesive having silane functionality |