C09J 11 - Features of adhesives not provided for in group , e.g. additives

Patents for C09J 11 - Features of adhesives not provided for in group , e.g. additives (14,955)
06/2011
06/08/2011	CN102086358A Paper tube glue as well as preparation method and application thereof
06/08/2011	CN102086355A Environmental-protection building material adhesive and preparation method thereof
06/08/2011	CN102086353A Intermediate adhesive material for retreaded tires
06/08/2011	CN102086351A Adhesive assembly tapes
06/08/2011	CN102086349A Non-curing waterproof glue with double character
06/08/2011	CN101790278B Full photophobic copper-clad laminate and preparation method thereof
06/08/2011	CN101740160B Dielectric paste for metal aluminum substrate thick film circuit and preparation method thereof
06/08/2011	CN101675715B Film-like circuit connecting material and connection structure for circuit member
06/08/2011	CN101597468B Vacuum tire self-repairing cement
06/08/2011	CN101255322B Paper plate bridging agent
06/03/2011	WO2011065779A2 Adhesive composition
06/03/2011	WO2011065524A1 Chloroprene polymer latex composition and use thereof
06/03/2011	WO2011065476A1 Adhering method using electrostatic powder adhesive, and powder adhesive to be used in adhering method
06/03/2011	WO2011065252A1 Adhesive sheet and electronic component
06/03/2011	WO2011065174A1 Single-component epoxy resin composition and use thereof
06/03/2011	WO2011063525A1 Novel emulsified release agent for composite panel
06/03/2011	CA2782219A1 Novel emulsified release agent for composite panel
06/03/2011	CA2782199A1 Chloroprene polymer latex composition and use thereof
06/01/2011	EP2327751A1 Process for producing a heat shrinkable tube
06/01/2011	DE102009054423A1 Fastening agent for fastening two objects, consists of a mixture of an aerobic adhesive and a hydrophilic material, where the mixture contains indicators by which optical, electrical and/or thermal conductivity of the mixture is changeable
06/01/2011	CN1872935B Adhesive composition, adhesive sheet and surface-protective film
06/01/2011	CN1736517B Formaldehyde collecting agent and preparation process thereof
06/01/2011	CN102083931A Adhesive composition, polarizing plate, and liquid crystal display
06/01/2011	CN102083929A Transparent adhesive sheet for flat panel display
06/01/2011	CN102079958A Diamond-filled isotropical high-performance heat-conductive adhesive and preparation method thereof
06/01/2011	CN102079957A Low-temperature rapidly-curable surface mounting adhesive
06/01/2011	CN102079954A Pressure-sensitive adhesive tape
06/01/2011	CN101503603B Low temperature softening organic heat conducting glue
06/01/2011	CN101215453B Adhesive for middle-temperature solidifying epoxy pre-dipping material and preparation method thereof
05/2011
05/30/2011	CA2717290A1 A two-component adhesive suitable for construction purposes, its use and the cured structural bonds obtained thereby
05/26/2011	WO2011062850A2 Moisture curable polyamides and methods for using the same
05/26/2011	WO2011062149A1 Circuit connection material, connection structure using same, and temporary pressure-bonding method
05/26/2011	WO2011062127A1 Adhesive composition for polarizing plate and polarizing plate using the same
05/25/2011	CN102077131A Optical bonding with silicon-containing photopolymerizable composition
05/25/2011	CN102076806A Active-energy-ray-curing adhesive composition
05/25/2011	CN102076802A Adhesive composition for optical film, adhesive layer for optical film, and adhesive optical film, and image display device
05/25/2011	CN102076801A Silver coated flaky material filled conductive curable composition and application in die attach
05/25/2011	CN102076733A Epoxy resin composition
05/25/2011	CN102070997A Water-tolerant casein glue and preparation process thereof
05/25/2011	CN102070990A Adhesive composition, adhesive and adhesive sheet
05/25/2011	CN102070067A High-ductility hand strap
05/25/2011	CN101705065B Water-resistant white latex
05/25/2011	CN101175830B Adhesive composition, adhesive sheet, and surface protection film
05/25/2011	CN101148572B Epoxy group anti-skid glue and preparation method thereof
05/24/2011	CA2470631C Method for connecting two bodies
05/19/2011	WO2011059084A1 Circuit connecting material and connection structure for circuit member using same
05/19/2011	WO2011059043A1 Process for production of acrylic adhesive sheet
05/19/2011	DE102009046664A1 Kompositpartikel mit organischen und anorganischen Domänen Composite particles with organic and inorganic domains
05/18/2011	EP2322445A1 Decorative can body and process for producing the same
05/18/2011	CN102066514A Resin composition, resin-containing carrier material, multi-layered printed circuit board, and semiconductor device
05/18/2011	CN102061140A Hot-melt pressure sensitive adhesive for automobile interior part
05/18/2011	CN102061139A Automobile hot-melt lamp adhesive
05/18/2011	CN102060954A Acrylic emulsion as well as preparation method and application thereof
05/18/2011	CN102060103A Wood propeller and manufacturing method thereof
05/18/2011	CN102058488A Low-pressure type propellant and application thereof
05/18/2011	CN101607458B Medical paper-plastic composite blue film and preparation method thereof
05/18/2011	CN101481591B Preparation of organic cobalt salt adhesion promotion agent
05/12/2011	WO2011055827A1 Pressure-sensitive adhesive composition
05/12/2011	WO2011055784A1 Thermopolymerization initiator system and adhesive composition
05/12/2011	WO2011055735A1 Layered rubber/metal product
05/12/2011	WO2011055588A1 Adhesive composition
05/12/2011	WO2011055580A1 Adhesive composition, circuit connecting structure, semiconductor device and adhesion improvement agent for glass
05/12/2011	WO2011054782A1 Adhesives and sealants comprising ester based on 2-propylheptanol
05/11/2011	EP2319893A1 Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition
05/11/2011	EP2319892A1 Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component
05/11/2011	CN102057012A Flame-retardant adhesive composition and laminated film
05/11/2011	CN102057011A Heat curable adhesive and resin laminated-type IC card
05/11/2011	CN102057001A Adhesive composition for slightly adhesive base, adhesive using the same and optical disk device
05/11/2011	CN102056950A Curable compositions
05/11/2011	CN102056720A Process for fastening a silicon block on a support intended therefor and corresponding arrangement
05/11/2011	CN102051155A Preparation method of low-cost silicon-containing pitch binder
05/11/2011	CN102051150A Adhesive for bonding metal heat-conducting piece
05/11/2011	CN102051149A Preparation methods of hot melt pressure-sensitive adhesive and protective film as well as hot melt pressure-sensitive adhesive
05/11/2011	CN102051146A Water-dispersed acrylic acid series sticker composition and adhesion sheet and preparation method thereof
05/11/2011	CN102051144A Metal adhesive for metal connection
05/11/2011	CN102051143A Adhesive for connection of circuit member and semiconductor device using the same
05/11/2011	CN102051142A Adhesive for connection of circuit member and semiconductor device using the same
05/11/2011	CN102051141A Adhesive for connection of circuit member and semiconductor device using the same
05/11/2011	CN102051140A Thermally conductive composition
05/11/2011	CN101518171B Highly thermally conductive acrylic adhesive sheet
05/11/2011	CN101368072B Bond composition and optical element
05/10/2011	US7939604 Pressure sensitive adhesive composition for optical members, pressure sensitive adhesive layer for optical members, pressure sensitive adhesive optical member and image display
05/05/2011	WO2011052376A1 Adhesive resin composition, coverlay film, and circuit board
05/05/2011	WO2011051056A1 Laminating adhesive having silane cross-linking
05/05/2011	WO2011002876A3 Ultrafast heat/room temperature adhesive composition for bonding applications
05/05/2011	US20110105875 Biomedical sensing methods employing hydro-insensitive alternating current responsive composites
05/05/2011	US20110105637 Adhesive encapsulating composition and electronic devices made therewith
05/04/2011	EP2316897A1 Insulating sheet and laminated structure
05/04/2011	CN201815271U Adhesive substance coloring system
05/04/2011	CN1865382B Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
05/04/2011	CN102047401A 粘结膜 Adhesive film
05/04/2011	CN102047393A Dicing method
05/04/2011	CN102047347A Circuit connection material and circuit connection structure
05/04/2011	CN102046749A Use of an encapsulated adhesion promoter in an aqueous adhesive joint bonding two substrates, at least one of which comprises a (TPE-PA) material
05/04/2011	CN102046746A Acrylic pressure-sensitive adhesive tape or sheet
05/04/2011	CN102046745A Acrylic pressure-sensitive adhesive tape or sheet
05/04/2011	CN102046713A Thermally conductive composite material comprising aluminum powder, process for producing the composite material and use of the composite material
05/04/2011	CN102040939A Die bond agent composition for optical semiconductor element and optical semiconductor device using the composition
05/04/2011	CN102040938A Nano-particle modified cyanate adhesive and preparation method thereof
05/04/2011	CN102040937A Polyurethane adhesive with modified nano particles and preparation method thereof

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