Patents
Patents for C08L 79 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups (12,755)
02/2009
02/18/2009CN100462388C Weatherable block copolyester carbonates, methods for their preparation and blends containing them
02/17/2009US7491451 Electroluminescent polymer nanocomposite material, method of manufacturing the same and organic light emitting display apparatus having the same
02/17/2009US7491427 Polyimidesiloxane solution composition
02/17/2009CA2316474C Stabilizer mixtures
02/12/2009WO2009019241A2 Blends of aromatic polyimides and aromatic sulfone polymers
02/12/2009US20090043041 Enhancing Interactivity Between Amine-Functionalized Polymers and Particulate Fillers
02/12/2009US20090043003 Inorganic mesoporous material having chiral twisted structure and process for producing the same
02/11/2009EP2021398A1 Catalysis of polyimide curing
02/11/2009EP1404756B1 Pvc stabilisers
02/11/2009CN101362859A Stable nanometer oxidate dispersion solution, preparation method and application thereof
02/11/2009CN100460467C Electroconductive resin composition and electronic parts using the same
02/05/2009WO2009017252A1 Liquid crystal aligning agent, liquid crystal alignment film, method for producing the same, and liquid crystal display device
02/05/2009US20090036591 Monodisperse silica spheres containing polyamine and process for producing the same
02/05/2009US20090033844 Method of producing fine particles of anthraquinone structure-containing pigment, fine particles of anthraquinone structure-containing pigment produced thereby, colored pigment dispersion composition therewith, colored photosensitive resin composition therewith and photosensitive resin transfer material therewith, and color filter and liquid crystal display device using the same
02/04/2009CN101358035A Production process tape for film-shaped wiring board
02/04/2009CN101358034A Stable dimension type polyimide film and preparation method thereof
01/2009
01/28/2009EP2018401A2 Compositions comprising biscitraconimide, bisitaconimide, and/or citraconimido-itaconimide
01/28/2009CN101353478A Preparation of biomimetic material
01/28/2009CN101353477A Preparation of polyaniline / argentum nano composite material
01/28/2009CN101353458A Halogen-free expansion type flame-retardant and preparation thereof
01/28/2009CN101353434A Preparation of poly(p-phenylene-benzobisoxazole) / polypropylene composite material
01/28/2009CN101353433A Preparation of poly(p-phenylene-benzobisoxazole) / polytetrafluorethylene composite material
01/28/2009CN101353432A Preparation of polyimide glass fiber composite material
01/22/2009WO2007134948A3 Compositions comprising biscitraconimide, bisitaconimide, and/or citraconimido-itaconimide
01/21/2009CN101351507A Flame resistant polymer blends
01/21/2009CN101351506A High glass transition temperature thermoplastic articles
01/21/2009CN101348603A Flame-retardant anti-dropping resin composition
01/21/2009CN101348576A Prepreg and metal foil-clad laminate and printed circuit board obtained by using the same
01/21/2009CN101348575A Prepreg and metal foil-clad laminate and printed circuit board obtained by using the same
01/15/2009WO2009009525A1 Polyetherimide/polyphenylene ether sulfone blends
01/15/2009WO2009008030A1 Process of producing composite film
01/15/2009WO2009008029A1 Circuit substrate
01/15/2009US20090017285 Polymer composition for encapsulating a chemical agent comprising an oxirane composition
01/14/2009EP2014349A1 Membranes made of sulphonated aromatic polyether ketone and polybenzimidazole, and their use
01/14/2009CN101346428A Polyester resin composition and molded body
01/14/2009CN101346413A Two-stage cure polyimide oligomers
01/14/2009CN101343413A Bimaleimide foam material and preparation thereof
01/14/2009CN101343412A Prepreg and laminate
01/14/2009CN101343401A Halogen-free glue solution, halogen-free flame-proof cover copper foil substrate using the glue solution and preparation method thereof
01/14/2009CN101343361A Preparation method for hydrogel material based on ethylene diamine tetra-acetic anhydride
01/14/2009CN101343360A Low-swelling sulfonation polyimide proton exchanging membrane and preparation thereof
01/13/2009US7476476 Heat resistant resin; suitable for surface protective film of a semiconductor device, interlayer insulation film, insulation film of an organic electroluminescent element and for protecting wirings of a circuit board; excellent in pattern formation, heat shrinkability, crack resistance, stress resistance
01/08/2009WO2007149639A9 Conductive wire comprising a polysiloxane/polyimide copolymer blend
01/08/2009US20090012234 Fluoropolymer coagulation method and composition
01/08/2009US20090011124 Organometallic compositions and coating compositions
01/08/2009US20090008132 Flexible wiring board for tape carrier package
01/07/2009EP2011827A1 Polyester resin composition and molded body
01/07/2009CN101339937A Flexible wiring board for tape carrier package
01/07/2009CN101338322A Novel gene vector constructed by high molecular polymer and preparation method
01/07/2009CN101338073A Process for preparing PBO/single-wall carbon nanotube polymer
01/07/2009CN101338072A Organic/inorganic composite enhancement type anhydrous proton conducting film and method for preparing same
01/07/2009CN101338038A Method for enhancing fracture tensile strength of PBI/HP3O4 cast by sol-gel method
01/07/2009CN101338033A Naphthaline type sulfonated polyimides, method for synthesizing same and method for preparing proton exchanging film
01/07/2009CN100449776C Interlayer dielectric and pre-applied die attach adhesive materials
01/06/2009CA2216696C Polysaccharide-bound nitric oxide-nucleophile adducts
01/01/2009US20090005488 Heat resistant resin bonded grindstone
01/01/2009US20090000519 Coatings Reparable by Energy Discharge
01/01/2009US20090000508 Radiation Curable Inkjet Inks, Method of Manufacture, and Methods of Use Thereof
12/2008
12/31/2008WO2009001658A1 One-pack type cyanate/epoxy composite resin composition
12/31/2008WO2009000830A1 Thermoplastic molding materials comprising organic black pigments
12/31/2008WO2008127435A3 Controlled gas release from a melt processable compatible polymer blend
12/31/2008EP2009058A1 Thermosetting polyimide resin composition and cured product thereof
12/31/2008EP1794236B1 Film forming material and preparation of surface relief and optically anisotropic structures by irradiating a film of the said material
12/31/2008EP1390424B2 N-alkylaziridine prepolymers as a dental material
12/31/2008CN101333434A Heat-conducting insulation material and method for manufacturing same
12/31/2008CN101333335A Nylon composite material modified by poly(p-phenylenebenzobisoxazole) and method for preparing same
12/31/2008CN101333334A Modified nylon for automobile engineering and method for preparing same
12/31/2008CN101333320A Conductive heat conducting material and method for manufacturing same
12/30/2008US7470471 Resin composition, prepreg and laminate using the composition
12/30/2008CA2406723C Polyimide film and production process thereof
12/25/2008US20080319140 Blend of a thermoplastic resin with a polysiloxane-vinyl graft copolymer with less than 3% methyl ethyl ketone-insoluble matter; excellent in mold release and slidability
12/25/2008US20080318150 Paper Compositions, Imaging Methods and Methods for Manufacturing Paper
12/24/2008WO2008155879A1 Method for production of coating film of electrically conductive polymer
12/24/2008EP2006332A1 Resin composition and method for producing same
12/24/2008DE102008024344A1 Brennstoffzellenmembranen, Gele und Herstellungsverfahren Fuel cell membranes, gels, and the production method
12/24/2008CN101331182A Fabrics made from a blend of polypyridobisimidazole/flame-retardant treated cellulose fibers and articles made therefrom
12/24/2008CN101330844A Thermal performance garments comprising a bleach tolerant outer shell fabric of polypyridobisimidazole and polybenzobisoxazole fibers
12/24/2008CN101328705A Slide board for railway passenger dedicated line bridge support, modified ultra-high molecular weight polyethylene and production method for producing the slide board
12/24/2008CN101328314A Method for rapidly preparing Ag/PPy composite material
12/24/2008CN101328304A Flame-retardant anti-dropping thermoplastic resin composition
12/24/2008CN100445322C Ultralow dielectric constant polyimide film and its preparation method
12/23/2008CA2293447C Oxidatively stable rigid aromatic polyimide compositions and process for their preparation
12/18/2008WO2008154421A1 Blends of fluoroalkyl-containing ester oligomers with polydicarbodiimide(s)
12/18/2008WO2008153208A1 Resin composition for interlayer insulation of multilayer printed wiring board
12/18/2008WO2008153101A1 Resin composition for forming heat-cured film
12/18/2008US20080312383 Thermosetting Resin Composition, And Laminate and Circuit Substrate Using Same
12/18/2008US20080311303 composed of recurring units derived from a biphenyltetracarboxylic acid compound, a diamine compound, and a monoamine compound having at least one hydroxyl group and recurring units derived from diisocyanate and polybutadiene having hydroxyl group at each terminal; insulation film for electronics
12/17/2008EP2001949A2 Non-stick finish
12/17/2008EP1579272A4 Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems
12/17/2008CN101323703A Poly(amino bimaleimide) resin composition, preparation and use thereof in copper clad laminate
12/17/2008CN101323672A Corona-resistant polyimide film and preparing method thereof
12/17/2008CN100443547C Prepn process of nanometer particle of poly (amide-amine)-poly (L-benzyl-glutamate)
12/16/2008US7465780 Polyimide comprising sulfonic acid group at the terminal of side chain, and polymer electrolyte and fuel cell using the same
12/16/2008CA2391005C Creping adhesives
12/16/2008CA2296043C Adhesive composition for hot bonding and bonding method using same
12/11/2008US20080306220 Thermosetting Resin Composition, Multilayer Body Using Same, and Circuit Board
12/11/2008US20080306180 Polyamide Acid Resin Containing Unsaturated Group, Photosensitive Resin Composition Using Same, and Cured Product Thereof
12/11/2008US20080302558 impregnating a resin composition comprising a resin with an imide structure (polyamideimide copolymer, polyamideimidesoloxane) and a thermosetting resin ( epoxy or polyepoxide)into a fiber base material; prepreg having a property that it can be bent; metal foil-clad laminate and printed circuit board
12/10/2008EP1999305A1 Colorfast dyed polytherimide articles including fiber
12/10/2008EP1707590B1 Polyimide film
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