Patents
Patents for C08L 77 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers (26,845)
08/2004
08/25/2004CN1524101A Soluble self-orienting mateials and conductive polymer compositions having the same
08/25/2004CN1523060A Detaching type polymer/montmorillonite composite material and preparing method thereof
08/25/2004CN1523048A Compositions comprising cellulose ether with high bulk density, their use in building materials and a process for the manufacture thereof
08/25/2004CN1163544C Fiber-reinforced thermoplastic resin formed product
08/25/2004CA2458294A1 Transparent molding composition for optical applications
08/24/2004US6780941 Blending thermoplastic polyester with fiber-forming polyamide for improved color strength and dimensional stability; carpets; floorcoverings
08/24/2004US6780933 Intermediate layer disposed between the core and cover, is formed from a blend comprising at least one glycidyl polymer
08/24/2004US6780522 Transparent high strength polyamide film
08/24/2004US6780481 Melt processable thermoplastic polymer composition
08/24/2004CA2097614C Polyamide compositions
08/19/2004WO2004070694A2 Compositions and assembly process for liquid crystal display
08/19/2004WO2004069926A1 Poly(alpha-methylene-gamma-methyl-gamma-butyrolactone- co-glycidyl methacrylate): preparation, polymer blends derived therefrom, and end uses thereof
08/19/2004WO2004069909A2 Article comprising light absorbent composition to mask visual haze and related methods
08/19/2004US20040162397 show a strong tendency to polarize and have commonly conjugated double bond that makes an inter-molecular force remarkably strong by dispersion force among electrons
08/19/2004US20040161621 Antistatic agents; multilayer; printable
08/19/2004US20040161571 Computers; heat exchanging interface containing heat conductive fillers; elastomer layers
08/19/2004DE19847626B4 Mit Kupfersalz und aliphatischem halogeniertem Phosphat stabilisierte Polyamidzusammensetzung With copper salt and aliphatic halogenated phosphate stabilized polyamide composition
08/19/2004DE10304816A1 Celluloseether enthaltende Abmischungen mit erhöhtem Schüttgewicht, deren Verwendung in Baustoffsystemen sowie ein Verfahren zur Herstellung von Celluloseether enthaltenden Abmischungen mit erhöhtem Schüttgewicht Cellulose-containing mixtures with increased bulk density, their use in building material systems and a process for the production of cellulose-containing mixtures with increased bulk density
08/18/2004EP1447843A2 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate, and semiconductor device
08/18/2004EP1446451A2 Polyacetal resin composition stable to chlorine and chlorides and arcicle prepared therefrom
08/18/2004EP1232217B1 Flame-retardant thermoplastic composition with improved properties
08/18/2004EP1129127B1 Tough, dimensionally-stable transparent film having a copolyamide layer containing solid nanoscale filling materials with nucleating effect and its use for packaging foodstuffs
08/18/2004EP1123429B1 Grafted poly(p-phenylene terephthalamide) fibers
08/18/2004EP0842224B1 Flexible thermoplastic resins with improved tensile strength
08/18/2004CN1522388A Photosensitive resin composition, method for producing pattern and electronic parts
08/18/2004CN1521211A Thermoplastic resin composition, resinous material including same composition, and sliding members using same material
08/18/2004CN1162480C Thixotropic agent based on alkyd resin
08/18/2004CN1162474C Impact-resistant thermoplastic resin composition
08/17/2004US6777496 Polymeric additives and polymeric articles comprising said additive
08/17/2004US6777488 Aqueous polyamide resin dispersion and process for producing the same
08/17/2004US6777475 Resin composition improved in low-temperature impact resistance
08/17/2004US6777472 Highly-neutralized ethylene copolymers
08/17/2004US6776929 Method of forming a conductive thermoplastic composition
08/12/2004WO2004067668A1 Polyolefin and copolyamide based thermofusible adhesive composition with improved thermal behavior
08/12/2004WO2004067665A1 Method for gluing fpcb’s
08/12/2004WO2004066760A2 Composition
08/12/2004US20040157996 Impact modified compositions of polyimide and polyamide resins
08/12/2004US20040157978 Toughness; tensile strength; elongation; impact strength; heat resistance; polyamide, polyphenylene ethers alloy with block polymer
08/12/2004US20040157968 Mixture of polyolefin, polyamide and acrylic polymer adjuvant
08/12/2004US20040157068 Mixture of polyamide and antioxidizer; baking
08/12/2004US20040157023 Process for the welding of two polyamide parts
08/12/2004US20040154494 Fast drying coatings
08/11/2004EP1445284A1 Impact modified compositions of polyimide and polyamide resins
08/11/2004EP1445282A1 Resin composition and molded article film and fiber each comprising the same
08/11/2004EP1445278A1 Compositions comprising cellulose ether with high bulk density, their use in building materials and a process for the manufacture thereof
08/11/2004CN1520441A 聚合物共混物 Polymer blend
08/11/2004CN1518930A 枕头 Pillow
08/11/2004CN1161505C Copolyester binder fibers
08/10/2004US6774184 Multilayer sphere
08/10/2004US6774174 Flame-retardant polyamide compositions
08/10/2004US6774162 Crosslinked polyethylene, rubber, and plasticizer; high crystal structure
08/06/2004CA2456793A1 Cellulose ether blends of increased bulk density, their use in construction material systems, and a process for producing cellulose ether blends of increased bulk density
08/05/2004WO2004065471A2 Antistatic composition
08/05/2004WO2004065466A1 Smoke-permeable food envelope based on polyamide and water-soluble polymers
08/05/2004WO2004055109A3 Process for preparing a flame retardant polyamide composition
08/05/2004US20040152847 Thermoplastic resin mixture for molding and structures and with pigments
08/05/2004US20040152829 Thermally conductive polymer molded article and method for producing the same
08/05/2004US20040152808 Resin composition for plating substrate and resin molding using the same, and metal plated parts
08/05/2004DE10317403A1 Verfahren zur Verklebung von FPCB's A method for bonding FPCB's
08/05/2004DE10302960A1 Rauchdurchlässige Nahrungsmittelhülle auf Basis von Polyamid und wasserlöslichen Polymeren Smoke-permeable food casing based on polyamide and water-soluble polymers
08/04/2004EP1443073A1 Polyamid powder with stable, constant pourability
08/04/2004EP1442993A1 Acetaldehyde scavening by addition of active scavengers to bottle closures
08/04/2004EP1442799A1 Process for coating metallic bodies and primer compositions to be used in the process
08/04/2004EP0939782B1 Ester-terminated polyamides of polymerized fatty acids useful in formulating transparent gels in low polarity liquids
08/04/2004CN1518580A Improved flame-retardant polyamide compositions
08/04/2004CN1518577A Stabilised thermoplastic moulding compounds
08/04/2004CN1517407A Method of improving temp resistance of polyamide 6T copolymer ejection mould
08/03/2004US6770378 Reactive transformation; improved homogenization in melts
08/03/2004US6770227 Carbon material
08/03/2004US6769453 Resin tube for automotive piping and method of fabricating the same
08/03/2004CA2111905C Increasing the molecular weight of polyamides
08/03/2004CA2099479C Flame-retardant polyamide moulding compositions
07/2004
07/29/2004WO2004063281A1 Cross-linked elastomer composition and formed product composed of such cross-linked elastomer composition
07/29/2004US20040147674 Thermoplastic resin composition
07/29/2004US20040147658 Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler, and process for producing copper double clad laminate
07/29/2004US20040147645 Polyamide containign steric hindred piperidine compound
07/29/2004US20040146718 Polyester film having improved oxygen barrier and poly(m-xyleneadipamide)-containing base layer, process for its production and its use
07/29/2004US20040146674 By-product inhibition from polyethylene terephthalate generation
07/29/2004US20040146609 Composition
07/29/2004DE10302034A1 Biaxially-oriented polyester film for use in food and other packaging has a base layer containing poly(m-xylene-adipamide) and also a cover layer
07/28/2004EP1440127A1 Polyamide based powder compositions, methods for their preparation and their use in coil coating
07/28/2004EP1440123A1 Thermoplastic silicone elastomers from compatibilized polyamide resins
07/28/2004EP1440120A2 Abs compositions with improved characteristic combinations
07/28/2004EP1440118A1 Blends of waxes and polymer additives
07/28/2004EP1440117A2 Polyester and polyamide compositions of low residual aldehyde content
07/28/2004EP1114845B1 Paste composition, and protective film and semiconductor device both obtained with the same
07/28/2004CN1516724A Polyamide resi ncomposition for fuse device, and fuse device
07/28/2004CN1516714A Multimodel polyamides, polyesters and polyester amides
07/28/2004CN1515625A Alloy coagulated nylon
07/28/2004CN1515624A Production process of alloy coagulated nylon
07/28/2004CN1159370C Polyamide composition stabilized with copper salt and aromatic halogen compound
07/27/2004US6767964 Seeding, graft and emulsion polymerisatiion of of styrene, acrylonitrile; and a-methylstyrene, methyl methacrylate, or n-phenylmaleimide; melt processability, toughness
07/27/2004US6767941 Comprises phosphorus compound, melamine or derivative, and polymer; provides shortened polycondensate combustion
07/22/2004WO2004061000A1 Amorphous, wholly aromatic polyesteramide composition
07/22/2004WO2004060997A1 Static dissipating resin composition and methods for manufacture thereof
07/22/2004WO2004060980A1 Conductive master batch and conductive resin composition
07/22/2004WO2004060968A1 Polyamino acids functionalized by at least one (oligo)amino acid group and therapeutic uses
07/22/2004US20040143061 has good surface appearance even when it is extruded into a molded piece at a high output, retains its Izod impact strength, even after annealing, and has less foreign matter (black spot) generation at the time of production
07/22/2004CA2508751A1 Polyamino acids functionalized by at least one (oligo)amino acid group and therapeutic uses
07/21/2004EP1268185A4 High-temperature polymer/inorganic nanocomposites