Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08G - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds › C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
11/1990
11/16/1990CA2014967A1 Polymeric blends prepared with reactive initiators
11/15/1990WO1990013609A1 Novel fluorescent pigment compositions and a process for their preparation and use of same
11/15/1990CA2015164A1 Dioxydiphthalic anhydride
11/14/1990EP0397582A1 Imide groups containing polymers made from hindered diamines
11/14/1990EP0397581A1 Imide groups containing polymers made from maleimides (of which one is a bismaleimide siloxane), and aromatic diamines and process of preparation
11/14/1990EP0397518A2 Photopolymerisation processes
11/14/1990EP0397396A2 Resin composition for sealing semiconductors
11/14/1990EP0397395A2 Resin composition for sealing semiconductors
11/14/1990EP0397346A2 Aminated formaldehyde coupled polyols for curing epoxy resins
11/14/1990EP0397341A1 1-Isopropyl-2-methylimidazole as an epoxy resin curative
11/14/1990EP0397317A1 Diglycidyl ether
11/14/1990EP0397195A2 A composition comprising an epoxy compound
11/14/1990EP0397166A2 Novel silicon-organic compounds containing an oxazolidine group
11/14/1990EP0397010A1 High purity epoxy formlations for use as die attach adhesives
11/14/1990EP0396912A1 Cationically electrodepositable resin composition
11/14/1990EP0256020B1 Water-dilutable binders for cationic electrophoretic lacquers and method for production
11/13/1990US4970399 Method and apparatus for processing UV-hardenable reaction resin compounds
11/13/1990CA1276358C Epoxy resin for preparing electric laminates
11/13/1990CA1276335C Rubber-modified epoxy resins
11/12/1990CA2016645A1 Resin composition for sealing semiconductors
11/12/1990CA2016626A1 Resin composition for sealing semiconductors
11/11/1990CA2016067A1 Epoxy resin compositions
11/08/1990DE4011783A1 Aluminium oxide carboxylate polymer prodn. - by reaction of aluminium alcoholate, mono:carboxylic acid and water to give lower ester content
11/07/1990EP0396203A2 Encapsulating semiconductors
11/07/1990CN1046741A Polysulfide base resin, plastic lens containing resin and process for preparing same
11/06/1990US4968767 Prepregs
11/06/1990US4968732 Imidazolyl-urea compounds and their use as cure accelerators in epoxy resin compositions for the production of moldings
11/06/1990US4968730 Process for the preparation of pigment paste resins for cathodically depositable coating compositions having quaternized oxazolidine functional groups
11/06/1990CA1276021C Substituted diazaoxaspirodecanes, preparation thereof and use thereof as stabilizers for polymers
11/01/1990WO1990012830A1 Resin composition and process for forming transparent thin film
11/01/1990WO1990012829A1 Novel epoxy sulfonamide-based resins, a process for their preparation and use of same
11/01/1990WO1990012828A1 Hydroxy-functional poly(amide ethers) as thermoplastic barrier resins
11/01/1990WO1990012824A1 Organic nitrogen-containing polymerization cocatalyst
11/01/1990CA2051446A1 Hydroxy-functional poly(amide ethers) as thermoplastic barrier resins
10/1990
10/31/1990EP0395432A2 Novel polyether containing at least one 2-halomethyloxyethylene unit and 2,3-dihydroxypropyl end groups
10/31/1990EP0395250A2 Epoxy resin composition and multilayer printed wiring board having insulating layer formed therefrom
10/31/1990EP0395185A1 Curing catalyst for application in powder coatings
10/31/1990EP0395122A2 Electrodeposition paints with a base of aminourethanes
10/31/1990EP0394965A2 Resin composition for laminate
10/31/1990EP0394887A2 Polyamide epoxy ester resin, process for preparation thereof, and coating composition
10/31/1990EP0394761A2 Hydroxyl-, epoxy- and acid anhydrid groups containing copolymers, process for their preparation and their use as binding agent
10/31/1990DE3913488A1 Casting compsn. e.g. for encapsulating semiconductor - contg. cyclo-aliphatic and/or novolak epoxide] resin, methyl-nadic anhydride, imidazole and filler
10/30/1990US4966945 Room temperature curing of a polyepoxide and carboxyl-contain ing polymer after evaporation of an aqueou solvent; films having good adhesion and wear resistance; flexography
10/30/1990US4966928 Epoxy resin based powder coating composition
10/30/1990US4966927 Epoxy resin binder compositions and cured products obtained therefrom
10/30/1990US4966922 Dual curable silicone compositions
10/30/1990US4966790 Applying an epoxy resin obtained from a bisphenol and curing agent to a substrate and contacting with heated liquid
10/28/1990WO1990012695A1 Composition for a solder mask, product thereof and process for using same
10/28/1990CA2031516A1 Composition for a solder mask, product thereof and process for using same
10/28/1990CA2015589A1 Polyamide epoxy ester resin, process for preparation thereof, and coating composition
10/28/1990CA2009205A1 Epoxy resin composition and method of bonding articles using same
10/27/1990WO1990012826A1 Thiolic compound polymerization cocatalysts
10/27/1990CA2053856A1 Thiolic compound polymerisation cocatalysts
10/24/1990EP0394195A2 Corrosion resistant epoxy and polyurethane resin compositions
10/24/1990EP0394192A2 Curable mixture based on cycloaliphatic epoxy resins
10/24/1990EP0393893A1 Sulfonium compound and polymerisation initator comprising the sulfonium compound as the main ingredient
10/24/1990EP0393778A1 The preparation of silanes containing at least two oxazolidinic moieties.
10/24/1990EP0393472A2 Single phase toughened heat-curable resin systems exhibiting high strength after impact
10/24/1990EP0393407A1 Adhesive/sealant composition and method of applying same
10/24/1990EP0393348A2 Negative photoresist and use thereof
10/24/1990EP0214231B1 Non-aqueous dispersions of relatively high molecular weight epoxy resins
10/24/1990CA2014580A1 Epoxy resin composition and multilayer printed wiring board having insulation layer formed therefrom
10/23/1990US4965657 Resin encapsulated semiconductor device
10/23/1990US4965335 Polyphosphinic acids by the ring-opening polymerization of 1,3,2-dioxaphophachcloalkanes persubstituted by carbcyclic rings using an acid catalyst; shrinkage inhibition; electrical apparatus
10/23/1990US4965331 Curable resin compositions
10/23/1990US4965324 Substituted phenol-formaldehyde novolac resins containing reduced quantities of 2-functional components and epoxy novolac resins prepared therefrom
10/23/1990CA1275529C High performance two-component epoxy structural adhesives with chemical thixotropy
10/21/1990WO1990012656A1 Aqueous coating composition
10/18/1990WO1990012066A1 Lewis acid-polymeric amine epoxy resin curing agents, compositions, and processes
10/18/1990CA2014515A1 Silanes containing at least two oxazolidinic moieties, their preparation and their use
10/18/1990CA2014492A1 Corrosion-resistant epoxy and polyurethane resin compositions
10/17/1990EP0392348A2 Toughened thermosetting structural materials
10/17/1990EP0392299A1 Process for preparing organic amines, mixtures of polyamines and their use as curing agents for prepolymers
10/17/1990CN1046165A Reaction products of alpha-aminomethylene phosphonic acids and epoxy compounds and in coating compositions
10/16/1990US4963300 Compression molding a prepreg of fibrous substrate, a polyglycidyl compound and an iron-containing metallocene complex
10/14/1990CA2014517A1 Toughened thermosetting structural materials
10/14/1990CA2014056A1 Process for the production of organic amines, polyamine mixtures and their use as hardeners for polymer precursors
10/10/1990EP0391474A2 Polyglycidyl polyether resins
10/10/1990EP0391370A2 Epoxy resins
10/10/1990EP0391230A2 Reaction products of alpha-aminoethylene phosphonic acids and epoxy compounds and their use in coating compositions
10/10/1990EP0391162A2 Systems of polyols and ultraviolet radiation-curable epoxy silicones
10/10/1990EP0228450B1 Rubber-modified epoxy compounds
10/09/1990US4962179 Curable composition including aromatic amine curing agent and an acidic or metal compound accelorator; pot life; molding materials; thermolatency; polyepoxides
10/09/1990US4962163 Advanced polyepoxides and epoxy resins modified by an unsaturated carboxylic acid; cured coating and films havingi improved tensile and flexural strength and modulus
10/08/1990CA2014047A1 Sulfonium compound and polymerization initiator comprising the sulfonium compound as the main ingredient
10/04/1990WO1990011303A1 Initiators for polymerization
10/03/1990EP0390305A2 Diester and keto-ester derivatives of polyhydroxy compounds and production thereof
10/03/1990EP0389927A2 Epoxysiloxane cure promoters and accelerators for cationic UV cure systems
10/03/1990EP0389797A1 Blends of polyesters and polyolefins
10/03/1990EP0389527A1 Process for producing dispersions of cathodically precipitated binders with crosslinking agents based on polyisocyanates blocked by hydroxyl groups
10/03/1990CN1045795A Initiators for polymerization
10/03/1990CA2012756A1 Lewis acid-polymeric amine epoxy resin curing agents, compositions, and processes
10/03/1990CA2010149A1 Ultraviolet radiation-curable epoxy silicones/polyol systems
10/02/1990USRE33367 Polyether polymer or copolymer, monomer therefor, and process for production thereof
10/02/1990US4960935 Bisphenol derivatives, process for their manufacture, and their use as surfactants
10/02/1990US4960912 Epoxy resins, polyepoxdies
10/02/1990US4960860 Polyimides hardner for epxoy resins for lamination and molding
10/02/1990US4960844 Silane terminated liquid polymers
10/02/1990US4960840 Epoxidized modified acetophenone/formaldehyde resins
10/02/1990US4960836 Polyamide polycarbonate block copolymer
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