Patents for C04B 37 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating (5,580)
10/2003
10/30/2003US20030201252 Method for brazing and thermal processing
10/29/2003EP1357098A1 Joining methode for high-purity ceramic parts
10/29/2003EP1276704B1 Process for the production of a braking band with venting passages and braking band obtained with said process
10/29/2003CN1125793C Method of mfg. diamond-silicon carbide-silicon composite and composite produced by this method
10/23/2003WO2003087006A1 Direct bonding methods using lithium
10/23/2003US20030199395 High-Tc superconducting products. Completely sealed high-Tc superconducting ceramic oxide provides are made by a macroscopic process including the steps of pressing a superconducting ceramic oxide powder into a hollow body of a
10/23/2003CA2481571A1 Direct bonding methods using lithium
10/22/2003EP1353740A1 Assembly comprising a permeable medium and a frame
10/22/2003CN1450954A Freestanding reactive multilayer foils
10/21/2003US6635993 Joined bodies, high-pressure discharge lamps and a method for manufacturing the same
10/21/2003US6635841 Solder layer and a ceramic member are held in contact with each other at an annular area extending along an entire circumference of an axial end surface of the ceramic member
10/21/2003US6635358 Metal foil on ceramic surface and Au-Ag alloy solder material bonding a metal member through solid phase bonding; susceptor for disposing a semiconductor wafer
10/14/2003CA2211471C Active brazing solder for brazing alumina-ceramic parts
10/09/2003US20030188553 Direct bonding methods using lithium
10/08/2003EP1350593A2 Metal cutting inserts having superhard abrasive bodies and methods of making same
10/02/2003US20030186090 Constructed by a single-crystal dielectric material appropriate for high-density recording, which is extremely thin
10/02/2003US20030183969 Foaming an aluminum-hydroxide sol solution, molding the foamed slurry and drying, calcining it to produce a preform, and sintering
10/02/2003US20030183318 Shrinkage inhibition, dimemsional accuracy
10/01/2003EP1348681A2 Production method of lightweight ceramic molding
09/2003
09/30/2003US6627966 To protect chip component within ceramic main body, first and second sealing are carried out between a metal case and ceramic main body so as to prevent contamination, toimprove shielding effect against external electromagnetic fields
09/25/2003WO2003078353A1 Method for the production of a metal-ceramic substrate, preferably a copper-ceramic substrate
09/25/2003WO2003078158A1 Encapsulated ceramic armor
09/25/2003US20030178939 Joined bodies, assemblies for high pressure discharge lamps and high pressure discharge lamps
09/23/2003US6623865 Candidate materials for electronic and optoelectronic applications, such as ferroelectric memory devices, pyroelectric sensor devices, waveguide modulators and acoustic sensors
09/23/2003US6622894 Article feeding and discharging device
09/18/2003US20030173660 Ceramic circuit board and power module
09/17/2003EP1345480A2 Ceramic circuit board and power module
09/16/2003US6620272 Method of assembling a ceramic body
09/11/2003US20030168496 Adhesive composition for bonding different members, bonding method using the composition and composite members bonded by the bonding method
09/10/2003CN1441522A Composite laser rod its producing method and laser device with composite laser rod
09/10/2003CN1120777C Ceramic-nucleated glass gradient composite plate material and its production process
09/09/2003US6617514 Ceramics joint structure and method of producing the same
09/02/2003US6613462 Method to form dense complex shaped articles
09/02/2003US6613450 Metal/ceramic bonding article
08/2003
08/28/2003WO2003031372A3 Method for the production of metal-ceramic composite materials, especially metal-ceramic substrates and ceramic composite material produced according to said method, especially a metal-ceramic substrate.
08/28/2003US20030162024 Composite substrate material and process for producing the same
08/28/2003US20030159817 Heat sink and its manufacturing method
08/27/2003EP1338584A1 Jointing material and joining method
08/27/2003EP1337496A1 Ceramic material and the production thereof
08/27/2003CN1438204A Method for repairing and connecting broken high-temp. resisting ceramic tube
08/21/2003US20030157360 Bonded member comprising different materials and production method thereof
08/20/2003CN1118530C Adhesive for adhering carbon materials
08/19/2003US6607851 Multi-layer ceramic fiber insulation tile
08/14/2003US20030150563 Joined ceramic article, substrate holding structure and apparatus for treating substrate
08/13/2003CN1436032A Ceramic laminate and making method thereof
08/07/2003WO2003065445A1 Method for preparing gas-tight terminal
08/05/2003US6601662 Polycrystalline diamond cutters with working surfaces having varied wear resistance while maintaining impact strength
07/2003
07/31/2003US20030141345 Bonded member comprising different materials, and production method thereof
07/30/2003CN1432618A Adhesive, fireproof board with adhesive and its production process
07/29/2003US6599637 Power module; mechanical and thermal shock cracking resis-tance; excellent heat radiation property and heat cycle resistance
07/24/2003US20030138585 Bonding of thermal tile insulation
07/23/2003EP1135348B1 Method for joining ceramic to metal
07/23/2003CN1431979A Material composite and prodn. and use of material composite
07/22/2003US6596666 Honeycomb segments do not move due to vibration or exhaust back pressure in use
07/17/2003WO2003057475A1 Improved thermal interface material
07/17/2003US20030131629 Method for making a silicon carbide resistor with silicon/silicon carbide contacts by induction heating
07/16/2003EP1327617A1 Method for joining
07/16/2003CN1430242A Assembly for connector high-tension discharge lamp and high-tension discharge lamp
07/15/2003US6592985 Polycrystalline diamond partially depleted of catalyzing material
07/15/2003US6592974 Conductive paste and ceramic electronic component
07/10/2003US20030126855 Net molded tantalum carbide rocket nozzle throat
07/09/2003EP1324960A1 Polycrystalline diamond with a surface depleted of catalyzing material
07/08/2003US6590760 Joint structure of ceramics and metal and intermediate insertion member used in this joint structure
07/08/2003US6589640 Polycrystalline diamond partially depleted of catalyzing material
07/03/2003US20030121545 Method for constructing a layer structure on a substrate
07/02/2003EP1323688A2 Joined bodies, assemblies for high pressure discharge lamps and high pressure discharge lamps
07/02/2003CN1113164C Heat exchanger in composite material and method for making same
07/01/2003US6586704 Joining of materials using laser heating
07/01/2003US6585064 Polycrystalline diamond partially depleted of catalyzing material
06/2003
06/26/2003WO2003024711A3 Method for producing a ceramic substrate and ceramic substrate
06/26/2003US20030118826 Thermal interface material
06/26/2003US20030117730 Ultra lightweight and ultra rigid solid ceramic reflector and method of making same
06/25/2003EP1321446A1 Method of forming a layered structure on a substrate
06/24/2003US6582812 Article made of a ceramic foam joined to a metallic nonfoam, and its preparation
06/18/2003EP1318969A1 High volume density polycrystalline diamond with working surfaces depleted of catalyzing material
06/17/2003US6579394 Method of producing ceramic slurry, ceramic slurry composition, ceramic green sheet and multilayer ceramic electronic part
06/17/2003US6579393 High thermal conductivity lossy dielectric using co-densified multilayer configuration
06/12/2003WO2003048072A1 Honeycomb structure body and method for manufacturing the same
06/11/2003EP1317331A1 Method of making a tool insert
06/11/2003CN1422721A Method for producing metal-ceramic composite lining and solder material used for same
06/10/2003US6574852 Macroscopic process of forming superconductors
06/04/2003EP0954399A4 Multi-channel structures and processes for making such structures
05/2003
05/30/2003WO2003044338A1 Honeycomb structural body and method of manufacturing the structural body
05/22/2003US20030096059 Semiconductors; void occurence suppressed in junction layer; occurrence of cracks, swelling, and exfoliation in the plating layer suppressed
05/21/2003CN1419700A Lead zirconate titanate dielectric thin film composites on metallic foils
05/20/2003US6566621 Metal-ceramic composite and vacuum switch unit using the same
05/20/2003US6565621 Adhesive composition for bonding different members, bonding method using the composition and composite members bonded by the bonding method
05/15/2003WO2003040061A1 Production of oriented material or composite material through centrifugal burning
05/15/2003US20030089687 Susceptor with built-in electrode and manufacturing method therefor
05/14/2003EP1309523A1 Net molded tantalum carbide rocket nozzle throat
05/14/2003EP1233935B1 Method for attaching a body, which is comprised of a metal matrix composite (mmc) material, to a ceramic body
05/13/2003US6563093 Ceramic pin heating element with integrated connector contacts and method for making same
05/13/2003US6562462 High volume density polycrystalline diamond with working surfaces depleted of catalyzing material
05/08/2003WO2003038881A1 Direct bonding of articles containing silicon
05/08/2003WO2003038857A1 Reaction brazing of tungsten or molybdenum body to carbonaceous support
05/08/2003WO2003037823A1 Metallization and/or brazing method, using a silicon alloy, for oxide ceramic parts which are non-wettable by said alloy
05/08/2003US20030087136 Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same
05/06/2003US6558821 Ceramic sinter, and wear resistant member and electronic component member using thereof
05/02/2003EP1306358A2 Sealing member
05/01/2003US20030082414 Lightweight, thermoconductive, heat resistant barriers joined by high strength, high temperature binders used in spacecraft
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