Patents for B32B 15 - Layered products essentially comprising metal (48,644)
11/2001
11/20/2001US6319387 Copper alloy electroplating bath for microelectronic applications
11/20/2001US6318738 Titanium composite skate blades
11/20/2001CA2015477C Process for continuous forming of panels coated on at least two adjacent sides
11/15/2001WO2001086020A1 Automobile fuel container material excellent in environment compatibility and automobile fuel container
11/15/2001WO2001085854A1 Anticorrosion coating composition
11/15/2001WO2001085840A2 Thermosetting resins and laminates
11/15/2001WO2001085565A1 A method of producing a packaging material
11/15/2001WO2001085362A1 Component of printed circuit board
11/15/2001US20010041389 Smiconductor device having a thermoset- containing dielectric material and methods for fabricating the same
11/15/2001US20010041265 Multilayer
11/15/2001US20010039792 Thin walled attached silver filled gold jewelry
11/15/2001US20010039710 Process for manufacturing a part of a metal matrix composite material
11/15/2001DE10117227A1 Niobium-aluminum extrafine multicore superconductive wire manufacture for reactor magnets involves processing body centered cubic alloy phase formed by hot melting and rapid cooling wire
11/14/2001EP1153095A1 Resin-coated steel sheet for fuel tanks of automobile and method of fabricating the same
11/14/2001EP1153080A1 Compositions of random copolymers of propene containing an alpha-olefin as comonomer
11/14/2001CN1322259A Electrolytic copper foil with carrier foil and method for manufacturing same and copper-clad laminate using electrolytic copper foil with carrier foil
11/14/2001CN1321714A Preparation method of composite adhesive for aluminium foil and paper
11/14/2001CN1321577A Structure of adhesive layer which contained on metal base is no layering and which contained on polypropylene base is strippable
11/14/2001CN1074715C Optical device having low visual light transmission and low visual light reflection
11/14/2001CN1074711C Method and apparatus for producing laminate board
11/13/2001US6316132 Two separately-formed titanium-nitride layers with impenetrable mismatched grain boundaries; integrated circuits; prevention of ?tungsten volcano?
11/13/2001US6316128 Stainless steel substrate; nickel or alloy monolithically pressure-welded to a principle plane and copper to the other; thickness ratio reduced; increased tensile strength; anode case of button cell
11/13/2001US6316126 For heat exchangers; sacrificial anode material clad on one side of aluminum manganese core material alloy
11/13/2001US6316124 Modified InAs hall elements
11/13/2001US6315820 Method of manufacturing thin metal alloy foils
11/08/2001WO2001083842A1 System for protection of submerged marine surfaces
11/08/2001WO2001083630A2 Reinforced foil susceptor adhesive structure
11/08/2001WO2001083623A2 Method of making reactive multilayer foil and resulting product
11/08/2001WO2001083205A2 Reactive multilayer structures for ease of processing and enhanced ductility
11/08/2001WO2001083182A1 Freestanding reactive multilayer foils
11/08/2001US20010038894 Gas barrier film
11/08/2001US20010038216 Plastics-covered metal plate for car
11/08/2001US20010038029 Method of making reactive multilayer foil and resulting product
11/08/2001US20010037553 Method of manufacturing painted profiles from metallic strips and a corresponding machine
11/08/2001DE10115443A1 Composite sheet with improved welding properties for automobile front panel, includes layer of glass-fiber reinforced thermoplastic resin and metal layer
11/08/2001DE10022075A1 Conductive and weldable corrosion protection composition for metal surfaces in coil coating comprises a conductive pigment of zinc, aluminum, graphite, molybdenum sulfide, carbon or iron phosphide.
11/08/2001CA2407190A1 Freestanding reactive multilayer foils
11/07/2001EP1151145A1 Plain bearing
11/07/2001EP1150837A1 Composition and method for promoting adhesion of thermoplastic elastomers to metal substrates
11/07/2001CN1321121A Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil
11/06/2001US6312834 That can be used for the anode cases and cathode cases of button-type microbatteries and other miniature electronic devices requiring the use of comparatively thin, drawable sheets.
11/06/2001US6312833 Multilayered wiring layer
11/06/2001US6312821 Coating structure having corrosion resistance
11/06/2001US6312814 High temperature resistant thermoplastics, such as polyamide imide, polyarylene sulfide and polyether sulfone, as adhesion promoters; functionalized fluoropolymer
11/06/2001US6312778 Web-shaped laminated packaging material, a method of producing the same, and packaging containers produced from the laminated packaging material
11/06/2001US6312763 Inhibits the formation of gaseous species of silicon when exposed to a high temperature
11/06/2001US6312543 Process for producing tubular article for a fixation device
11/01/2001WO2001082269A2 Display member having metallic luster
11/01/2001WO2001081262A1 Transparent substrate comprising metal elements and use thereof
11/01/2001WO2001081191A2 Enhanced anti-corrosive protective coverings
11/01/2001US20010036559 Metal-plastic composite made from long-fiber-reinforced thermoplastics
11/01/2001US20010036542 Metallizable white opaque films, metallized films made therefrom and labels made from the metallized films
11/01/2001US20010036537 Method for marking a laminated film material
11/01/2001US20010035266 Composite steel structural plastic sandwich plate systems
11/01/2001CA2407032A1 Transparent substrate comprising metal elements and use thereof
10/2001
10/31/2001EP1150270A1 Metallised paper including security features
10/31/2001EP1149772A2 Resin-coated seamless can
10/31/2001EP1085977A4 Packaging material for hermetically sealed batteries
10/31/2001EP0843689B1 Copolymers of vinyl chloride, allyl glycidyl ether, and vinyl ester and method of making the same
10/31/2001EP0796721B1 Method and apparatus for producing laminate board
10/31/2001DE10019926A1 Verfahren zum Modifizieren einer Oberfläche eines kompakten Substrates A method of modifying a surface of a compact substrate
10/31/2001CN1319461A Surface treatment agent for zinc plant series steel board and the zinc plating series steel board
10/31/2001CN1073892C Method of mfg. metal compounded plate
10/30/2001US6309762 Hard composite metallic coating
10/30/2001US6309742 EMI/RFI shielding gasket
10/30/2001US6309720 Polyester laminate film, metal plate laminated with this film and film-laminated metal container
10/25/2001WO2001079897A2 Cube corner retroreflective article with enhanced pigmentation
10/25/2001WO2001079371A2 Method for improving bonding of rigid, thermosetting compositions to hydrophilic surfaces, and the articles formed thereby
10/25/2001WO2001078978A2 Bistable shape memory polymer composite
10/25/2001US20010033919 Layered composite materials with a decorative layer made from a chromed metal
10/25/2001US20010032687 Used for tubes, volumes, sheaths, and catalyzer cones; oxidation resistance
10/25/2001DE10019183A1 Interlaminar bond comprises shape memory bond applied to substrate, from polymer layer from thermoplastic polymer
10/25/2001DE10019072A1 Verpackung für Mörtelmassen Packaging for mortars
10/25/2001CA2404062A1 Cube corner retroreflective article with enhanced pigmentation
10/24/2001EP1148243A2 Plastic pump rotor with protection surface
10/24/2001EP1148036A1 Method for modifying the surface of a compact substrate
10/24/2001EP1147924A1 Article decorated by use of a laser beam and process to manufacture such an article
10/24/2001EP1147234A1 Method for treating a brittle thin metal strip and magnetic parts made from a nanocrystalline alloy strip
10/24/2001EP0837953B1 Laminated material
10/24/2001CN2455473Y Composite metal sandwich plates with stainless steel layer
10/24/2001CN1319225A Magnetoresistive devices, giant magnetoresistive devices and methods for making same
10/24/2001CN1318499A Wrapper of mortar
10/23/2001US6306963 Electrical laminates
10/23/2001US6306925 Multilayer composites of glass with ductile metals
10/23/2001US6306526 Lid suitable for use in hermetic sealing of semiconductor package, comprising metal plate having solder layer secured thereto by cladding prior to formation of hermetic seal
10/23/2001US6306524 Diffusion barrier layer
10/23/2001US6306515 Thermal barrier and overlay coating systems comprising composite metal/metal oxide bond coating layers
10/23/2001US6305442 Hydrogen-based ecosystem
10/18/2001WO2001077223A1 Composite polymer/polymer material with high content in amorphous dispersed phase and preparation method
10/18/2001WO2001077222A1 Micro-composite polymer/polymer materials with semicrystalline dispersed phase and preparation method
10/18/2001WO2001076864A2 Multi-dimensional tailored laminate
10/18/2001WO2001021282A3 Laminar structure
10/18/2001US20010031368 Low emissivity, high reflectivity insulation
10/18/2001US20010031348 Sterilisible composite film
10/18/2001US20010031335 Indoor and outdoor screen printed art and method of manufacturing
10/18/2001US20010031327 For producing shaped articles outstanding in such characteristics as gas barrier properties, low-temperature heat drawability, long-run melt moldability, and appearance
10/18/2001US20010031326 Packing material for mortar compositions
10/18/2001US20010030122 Laminate comprising polyimide and conductor layer, multi-layer wiring board with the use of the same and process for producing the same
10/18/2001US20010029990 Heat and corrosion resistant steel pipe having multi-layered coating
10/18/2001DE10015440A1 Composite material used in the production of a semi-finished product or composite part comprises a first material layer joined to a second material layer by a welding connection produced by electron beam welding