Patents for B29K 63 - Use of epoxy resins as moulding material (802)
03/2005
03/15/2005US6866331 Reinforced structural body
02/2005
02/16/2005CN1189684C Thin-walled cylinder made from fiber-reinforced plastics material
02/10/2005US20050029001 Molded electric device and method for making molded electric device
02/09/2005CN1577682A Molded electric device and molding method thereof
02/08/2005CA2269976C Homogenizing process for fiber-wrapped structural composites
02/01/2005CA2118766C Coated abrasive article incorporating an energy cured hot melt make coat
01/2005
01/27/2005US20050020703 Foaming composition formed with steps and crosslinking with amines
01/26/2005EP1501101A2 Molded electric device and molding method thereof
01/26/2005CN1569435A Method for manufacturing elastic cylindrical body
01/20/2005US20050014005 Ink-jettable reactive polymer systems for free-form fabrication of solid three-dimensional objects
01/20/2005US20050012247 Systems and methods for using multi-part curable materials
01/19/2005EP1498277A1 Ink-jettable reactive polymer systems for free-form fabrication of solid three dimensional objects
01/19/2005EP1498256A2 Systems and methods for using multi-part curable materials
01/19/2005CN1567608A Wavelength-converting casting composition and white light-emitting semiconductor component
01/06/2005US20050004270 Comprising polyepoxide, anhydride hardener, 1-substituted imidazole catalyst, at least one diol and filler; thermoset materials; electrical applications; low cost
01/05/2005CN1560931A Luminous optical element with semiconductor main body
12/2004
12/30/2004US20040266899 Suitable for the production of thermosetting laminated bodies with a tacky surface; laminated bodies can be produced and handled in a simple manner and are suitable for stiffening and reinforcing flat structural components, in particular vehicle body structural components, such as vehicle body frames
12/29/2004EP1491566A1 Curable epoxy resin composition, and process for the production of shaped articles therefrom
12/29/2004CN1558455A Light-emitting semiconductor body
12/29/2004CN1558454A Wavelength-converting casting composition and white light-emitting semiconductor component
12/02/2004US20040240836 Precision insert for molding multi-fiber connectors and method for manufacturing thereof
12/01/2004EP1481999A2 Thermally-conductive epoxy resin molded article and method of producing the same
11/2004
11/11/2004US20040224163 the epoxy resin having molecular chains that contain an azomethine group ( CH=N ); applying a magnetic field to the epoxy resin composition to orient the molecular chains of the epoxy resin in a specific direction then curing the epoxy resin
11/11/2004US20040222666 Reinforced structural body
10/2004
10/27/2004EP1469982A1 Reinforced structural body and manufacturing method therefor
10/21/2004US20040209032 Molded parts with metal or wood surface areas and processes for their production
10/19/2004US6806311 Mold release agent for duroplastic molded parts
10/13/2004EP1137957B1 Method of preparing a shaped article having a photochromic coating thereon
10/07/2004US20040195726 lost core method of casting, using water soluble polymer as lost block rather than melt removable agent such as wax
10/06/2004EP1322459B1 Moulding method
09/2004
09/30/2004DE29724849U1 Lichtabstrahlendes optisches Bauelement mit einer wellenlängenkonvertierenden Vergußmasse Light emitting device having an optical wavelength-converting casting composition
09/15/2004EP1456286A1 Expandable epoxy resin-based systems modified with thermoplastic polymers
09/07/2004US6787579 Two-component (epoxy/amine) structural foam-in-place material
08/2004
08/12/2004WO2004067244A1 Semiconductor-sealing-purpose epoxy resin compound producing method
07/2004
07/28/2004CN1515623A Wavelength exchange pouring material, its application and preparation method
07/27/2004US6767199 Precision insert for molding multi-fiber connectors and method for manufacturing thereof
07/15/2004US20040137368 Liquid radiation curable compound
07/14/2004EP1437624A1 Stereolithographic resins containing selected oxetane compounds
07/08/2004US20040130067 Moulding methods
06/2004
06/30/2004CN1156029C Wavelength conversion pouring material, its use and manufacturing method
06/23/2004EP1429908A1 Method of processing a used hdpe by means of extrusion-blow moulding
05/2004
05/25/2004US6740266 Hardened sheet comprising an epoxy resin, and another resin layer formed on one side thereof, wherein the sheet has a retardation of 5 nm or less, an average thickness of 500 mu m or less; smooth surface
05/06/2004US20040084687 Wavelength-converting casting composition and white light-emitting semiconductor component
04/2004
04/21/2004CN1490150A Composite material pressure container or tubular body and composite material intermediate
04/13/2004US6720076 In-mold primer coating for thermoplastic substrates
04/07/2004EP1216128B1 Mold release agent for duroplastic molded parts
03/2004
03/24/2004EP1400342A2 Composite pressure container or tubular body and composite intermediate
03/18/2004US20040052997 Composite pressure container or tubular body and composite intermediate
03/16/2004US6706772 Two component (epoxy/amine) structural foam-in-place material
03/02/2004US6699548 Thin-walled cylinder made from fibre-reinforced plastics material
02/2004
02/12/2004US20040028253 Detoxification of solid freeform fabrication materials
02/05/2004WO2004011224A1 Molded parts with fabric surface areas and processes for their production
02/05/2004US20040023767 Method for manufacturing elastic cylindrical body, method for manufacturing elastic roll, elastic cylinerical body and elastic roll
02/04/2004EP1175290B1 Method for manufacturing encapsulated electronical components
01/2004
01/29/2004WO2003102087A3 In-mold primer coating for thermoplastic substrates
01/29/2004US20040018337 Molded parts with fabric surface areas and processes for their production
01/29/2004US20040016908 Wavelength-converting casting composition and white light-emitting semiconductor component
01/28/2004EP1385055A1 Stereolithographic resins with high temperature and high impact resistance
01/22/2004US20040013977 Stereolithographic resins with high temperature and high impact resistance
01/08/2004US20040005737 Method for manufacturing encapsulated electronic components, particularly integrated circuits
01/02/2004EP1373383A1 Two-component (epoxy/amine) structural foam-in-place material
12/2003
12/11/2003WO2003102087A2 In-mold primer coating for thermoplastic substrates
12/11/2003CA2487510A1 In-mold primer coating for thermoplastic substrates
12/09/2003US6660208 Detoxification of solid freeform fabrication materials
12/04/2003US20030224172 In-mold primer coating for thermoplastic substrates
12/03/2003CN1460055A Method for mfg. elastic cylindrical body, method for mfg. elastic roll, elastic cylindrical body and elastic roll
11/2003
11/19/2003EP1361942A1 Method for producing models
11/05/2003EP1358987A2 A replication matrix
10/2003
10/21/2003US6635202 Pouring free flowing, thermofoamable and curable low density powders comprising epoxy resins into multicompartment structures, then heating, sintering or curing to cover the voids
10/02/2003US20030185557 Manufacturing method of light shielding blade material
10/01/2003EP1121234B1 A matrix and method of producing said matrix
09/2003
09/02/2003US6613607 Method for manufacturing encapsulated electronic components, particularly integrated circuits
08/2003
08/27/2003EP1338397A2 Method for manufacturing encapsulated electronic components
08/20/2003EP1240452B1 Thin-walled cylinder made from fibre-reinforced plastics material
07/2003
07/31/2003WO2003061934A1 Reinforced structural body and manufacturing method therefor
07/31/2003US20030140671 Method and apparatus for applying flowable materials
07/30/2003EP1331080A2 Method and apparatus for applying flowable materials like polyurethane or epoxy resin after pretreating the surface with plasma or primer
07/25/2003CA2417018A1 Method and apparatus for applying flowable materials
07/24/2003US20030137162 Reinforced structural body
07/15/2003US6592780 Using epoxy resin
07/03/2003WO2003054069A1 Expandable epoxy resin-based systems modified with thermoplastic polymers
07/03/2003CA2471368A1 Expandable epoxy resin-based systems modified with thermoplastic polymers
07/02/2003EP1322459A1 Moulding methods
07/02/2003EP1173323B1 Homogenizing process for fiber-wrapped structural composites
06/2003
06/25/2003CN1426105A Semiconductor device and its producing method
06/19/2003US20030114556 Epoxy resin component, filler, initiator; filler contains silanized fused silica; processable as a one-component system
06/19/2003US20030111725 Semiconductor device and method for manufacturing the same
06/05/2003US20030105175 Two component (epoxy/amine) structural foam-in-place material
06/04/2003EP1316401A1 Method for manufacturing elastic cylindrical body, method for manufacturing elastic roll, elastic cylindrical body, and elastic roll
05/2003
05/27/2003US6569371 Method for forming a compound material
04/2003
04/23/2003EP1196239B1 Process and apparatus for preparing a composition of matter utilizing an ultrasonic device
04/08/2003CA2184318C Composite material, method for producing the same and composite material for lateral rigid member for track belt
03/2003
03/18/2003US6534721 Hollow insulator and production method
03/13/2003US20030047823 Matrix and method of producing said matrix
02/2003
02/13/2003WO2002020237A1 Method for manufacturing elastic cylindrical body, method for manufacturing elastic roll, elastic cylindrical body, and elastic roll
01/2003
01/22/2003EP1277554A1 Molding tool and method of fabrication thereof
01/16/2003US20030012957 Hardened sheet comprising an epoxy resin, and another resin layer formed on one side thereof, wherein the sheet has a retardation of 5 nm or less, an average thickness of 500 mu m or less; smooth surface
01/16/2003US20030011106 Molding tool and method of fabrication thereof
01/02/2003EP1270184A1 Selective deposition modeling for forming three-dimensional objects
12/2002
12/31/2002US6500518 Epoxy optical sheet and process for producing the same
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