Patents for B24B 51 - Arrangements for automatic control of a series of individual steps in grinding a workpiece (2,015)
09/2005
09/21/2005EP1577055A2 Grinding device and process for generating a rake face with a variable axial chip angle
09/21/2005CN1670925A CMP process control method
09/21/2005CN1670924A Apparatus for polishing a substrate
09/21/2005CN1669737A Device and method for manufacturing a contour outline chip removal with a variable axial rake angle
09/20/2005CA2225962C Method and apparatus for grinding composite workpieces
09/15/2005US20050202759 Grinder system and method for creating a contoured cutting face with a variable axial rake angle
09/13/2005US6942541 Polishing apparatus
09/08/2005US20050197048 Method for manufacturing a workpiece and torque transducer module
09/06/2005US6939200 Method of predicting plate lapping properties to improve slider fabrication yield
09/06/2005US6939199 Method and apparatus for cutting semiconductor wafers
09/01/2005DE102005005050A1 Verfahren zum Maximieren der Lebensdauer eines beschichteten Schleifrades A method for maximizing the life of a coated abrasive wheel
08/2005
08/25/2005US20050186890 Tool sharpener with web thickness determination capability
08/24/2005CN1657233A Control method and device for crystal ball grinding / polishing machine
08/23/2005US6932675 Plated grinding wheel life maximization method
08/23/2005US6931749 Apparatus and methods for measuring the pin diameter of a crankshaft at the place of grinding
08/17/2005CN1654167A Digital control vertical high precision honing machine
08/11/2005WO2005072465A2 Flexible process optimizer
08/04/2005US20050170752 Plated grinding wheel life maximization method
08/04/2005US20050170751 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
08/03/2005CN1647893A High speed precision digital control grinding processing device based on PMAC
07/2005
07/28/2005US20050165585 Flexible process optimizer
07/20/2005EP1345732B1 Method for smoothing the surface of a gas turbine blade
07/20/2005CN1643537A Computer controlled grinding machine
07/05/2005US6914000 Polishing method, polishing system and process-managing system
07/05/2005US6913512 Material removal monitor
07/05/2005US6913509 Method and apparatus for polishing, and lapping jig
06/2005
06/30/2005US20050142991 Substrate polishing apparatus
06/30/2005DE19910534B4 Verfahren zum Feststellen des Berührens eines Werkzeugs und eines Werkstücks einer optischen Maschine A method of detecting the touching of a tool and a workpiece of an optical machine
06/28/2005US6910944 Method of forming a transparent window in a polishing pad
06/22/2005EP1543921A1 Method and apparatus for polishing a substrate
06/08/2005EP1536919A1 Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
06/08/2005EP0925148B1 Method for computer numerically controlled pin grinder gauge
06/07/2005US6902468 Assembly for machining the edges of spectacle lenses
06/02/2005US20050119780 Computer controlled grinding machine
06/02/2005US20050118929 Aspherical surface processing method, aspherical surface forming method and aspherical surface processing apparatus
06/01/2005CN2702814Y Combined dust collecting controller for electric abrasive finishing machine
05/2005
05/26/2005US20050112997 Advanced process control approach for Cu interconnect wiring sheet resistance control
05/25/2005CN2701579Y High speed precise numerical-control grinding and processing device based on PMAC
05/25/2005CN1620357A Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
05/17/2005US6893324 Angle head grinding apparatus
05/10/2005US6890241 Lens processing management system
05/06/2005WO2005039821A1 Method for machining aspherical surface, method for forming aspherical surface, and system for machining aspherical surface
05/05/2005US20050095961 Angle head grinding apparatus
04/2005
04/26/2005US6884154 Method for apparatus for polishing outer peripheral chamfered part of wafer
04/26/2005US6884151 Method and apparatus for forming grooves on a workpiece and for dressing a grindstone used in the groove formation
04/21/2005US20050085163 Method for preventing edge peeling defect
04/19/2005US6881133 Method of grinding for a vertical type of double disc surface grinding machine for a brake disc
04/14/2005DE10345335A1 Planar grinding machine has optical device for determining position of its upper part relative to a base frame so that an evaluation unit can calculate a set position prior to commencement of machining
04/12/2005US6878302 Method of polishing wafers
04/12/2005US6878043 Rough- and finish-grinding of a crankshaft in one set-up
04/12/2005US6878035 Tool sharpener
04/05/2005US6876454 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
04/05/2005US6875078 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
03/2005
03/22/2005US6869337 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
03/17/2005US20050059322 Method of predicting plate lapping properties to improve slider fabrication yield
03/16/2005CN1593849A Grinding machine data acquisition and failure diagnosis apparatus based on network
03/16/2005CN1192832C Method and device for manufacturing inner cavity walls in continuous casting crystallizer
03/10/2005US20050054265 Method and apparatus for manufacturing trace performing parts with aspherical surfaces
03/09/2005CN2683318Y Grinding machine operating device
03/03/2005WO2005018878A2 Cnc abrasive fluid-jet m illing
03/03/2005US20050048873 CNC abrasive fluid-jet milling
03/01/2005US6860791 Polishing pad for in-situ endpoint detection
02/2005
02/09/2005EP1504400A1 Computer controlled grinding machine
02/09/2005CN1575892A High-speed cutting process for generating desired curved surface on workpiece
02/08/2005US6852015 Method and apparatus for grinding workpiece surfaces to super-finish surface with micro oil pockets
02/08/2005US6852006 Automated system for precision grinding of feedstock
02/03/2005US20050026542 Detection system for chemical-mechanical planarization tool
02/01/2005US6848194 Apparatus for monitoring a semiconductor wafer during a spin drying operation
01/2005
01/25/2005US6846224 Surface planarization equipment for use in the manufacturing of semiconductor devices
01/13/2005US20050005744 High-speed cutting process for generating desired curved surface on workpiece
01/12/2005EP1495839A1 High-speed cutting process for generating desired curved surface on workpiece
12/2004
12/21/2004US6832946 Lens grinding method and lens grinding apparatus
12/09/2004US20040248411 Method and device for simulation, method and device for polishing, method and device for preparing control parameters or control program, polishing system, recording medium, and method of manufacturing semiconductor device
12/08/2004CN1552552A Computer controlled large non-spherical repairing robot
11/2004
11/25/2004US20040235391 Material removal monitor
11/24/2004EP1478494A1 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
11/24/2004EP1478490A2 Method for re-grinding and polishing free-form surfaces, especially rotationally symmetrical aspherical optical lenses
11/10/2004EP1475187A2 Spectacle lens production
11/10/2004CN1544205A Numerical control system and method for logarithmic curve convexity race grinding machine
11/04/2004WO2004095516A2 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
11/04/2004US20040219866 Method and apparatus for forming grooves on a workpiece and for dressing a grindstone used in the groove formation
11/02/2004US6813536 Method and device for computer numerical control of machining of spectacle lenses
10/2004
10/27/2004CN1539599A Grinding method under constant power
10/21/2004US20040209550 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
10/21/2004US20040209546 Lapping machine, lapping method, and method of manufacturing magnetic head
10/14/2004US20040203321 Manufacturing method of semiconductor device, automatic operation method and automatic operation system of semiconductor manufacturing apparatus, and automatic operation method of CMP apparatus
09/2004
09/28/2004US6796877 Abrading machine
09/23/2004US20040185750 Polisher, polishing processing apparatus, polishing processing method, control program to make computer execute polishing, and the record medium
09/16/2004US20040180606 Synchronous control device
09/14/2004US6790123 Method for processing a work piece in a multi-zonal processing apparatus
09/08/2004EP1455438A2 Synchronous control device
09/08/2004CN1527170A Sync control device
08/2004
08/31/2004US6783428 Method for forming grooves on workpiece and for dressing a grindstone used in the groove formation
08/31/2004US6782760 Method for the finishing treatment of workpieces
08/26/2004US20040166782 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
08/19/2004WO2004069477A1 Modeling an abrasive process to achieve controlled material removal
08/12/2004US20040155013 Method and apparatus for polishing a substrate
08/05/2004US20040153197 Modeling an abrasive process to achieve controlled material removal
08/03/2004US6769958 Material removal monitor
07/2004
07/29/2004DE19800032B4 Abricht-Schleifverfahren zum Rund-, Plan- und Profilschleifen von Werkstücken und Schleifmaschine hierfür Dressing grinding method for cylindrical, surface and profile grinding of workpieces and grinding this
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