Patents for B24B 27 - Other grinding machines or devices (5,368)
07/2003
07/10/2003US20030129930 System and method for duplicating keys
07/09/2003EP1224057B1 Crankpin grinding method
07/08/2003US6588687 High-security data removal process for data-containing disks, portable machine for high-speed, high-security disk data removal, and DVD splitting process and apparatus
07/01/2003US6585578 Girinding wheel machine bracket adjustable in angle
07/01/2003US6585177 High-security data removal process for data-containing disks, portable machine for high-speed, high-security disk removal, and DVD splitting process and apparatus
06/2003
06/25/2003EP1320438A1 Wire saw with means for producing a relative reciprocating motion between the workpiece to be sawn and the wire
06/25/2003CN1426342A Device for mechanically rough machining and/or finish machining cast parts
06/24/2003CA2247444C Method of cutting blocks of hard substances into plates by means of a wire saw, and wire saw for carrying out this method
06/11/2003EP1181132B1 Rough-grinding and finish-grinding a crankshaft in a clamping
06/10/2003US6575818 Apparatus and method for polishing multiple semiconductor wafers in parallel
06/05/2003US20030104765 Resin diamond blade and optical waveguide manufacturing method using the blade
06/04/2003CN1421299A Scroll saw and its cutting method
06/03/2003USH2067 Cutting metallates of refractory metals
06/03/2003US6572459 Machine for machining in particular superfinishing, cylindrical surfaces of circular cylindrical workpieces, using an abrasive belt moving tangentially
06/03/2003US6572455 Method and apparatus for deburring machined workpieces
05/2003
05/29/2003US20030100455 Aqueous grinding fluid for wire-sawing or band-sawing
05/29/2003US20030099522 Device for mechanically rough machining and/or finish machining cast parts
05/27/2003US6568990 System and method for ophthalmic lens manufacture
05/27/2003US6568988 Chemical mechanical polishing apparatus with stable signals
05/27/2003US6568384 Semiconductor material cutting and processing method
05/22/2003WO2003041899A1 Sawing wire
05/22/2003US20030093904 Apparatus for machining, especially cutting tubular or round section bodies
05/20/2003US6565421 Apparatus and method of grinding liquid crystal cell
05/15/2003DE20220352U1 Device for treatment of workpieces in the form of a strip or a plate, particularly for removing oxide layers from cut surfaces or edges comprises a circulating feed unit with at least one brush
05/14/2003EP1310316A1 Saw wire
05/13/2003US6561887 Protective cover detachably installed on a cutting machine/engraving machine combination
05/06/2003US6557689 Assembly for supporting and retaining glass sheets
05/02/2003EP1224059B1 Grinding machine with two grinding wheels
04/2003
04/30/2003CN1414888A Method and device for working cavity walls in continuous casting crystallizer
04/29/2003US6554686 Sawing wire and method for the cutting and lapping of hard brittle workpieces
04/22/2003US6550364 Wire sawing device
04/17/2003DE10139962C1 Verfahren zum Abtrennen von Scheiben von einem sprödharten Werkstück und Drahtsäge zur Durchführung des Verfahrens A method for cutting wafers from a hard brittle workpiece and wire saw for performing the method
04/16/2003EP1301662A1 Method for grinding a rail and device for carrying out said method
04/16/2003EP1301311A1 Apparatus for machining, especially cutting tubular or round section bodies
04/16/2003CN1105621C Improved grinding machine
04/15/2003US6547638 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
04/15/2003US6546992 Method and apparatus for the working of cavity walls of continuous casting molds
04/10/2003WO2003028968A1 Facing machine for hard-fired ceramic tiles
04/08/2003US6544105 Control device to implement a grinding process for a knife shaft
04/08/2003US6543434 Device for simultaneously separating a multiplicity of wafers from a workpiece
04/03/2003US20030064664 Adaptable finishing apparatus and method
04/02/2003EP1297927A2 Polishing apparatus
04/02/2003EP1297926A2 Method and apparatus for grinding workpiece surfaces to super-finish surfaces with micro oil pockets
04/01/2003US6539932 Apparatus and method for cutting ingots
03/2003
03/27/2003US20030060146 Thermal head lapping apparatus
03/27/2003US20030060143 Chemical mechanical polishing apparatus with rotating belt
03/27/2003US20030060129 Control device to implement a grinding process for a knife shaft
03/26/2003EP1295679A2 Inline column polishing unit with preferably four parallel polishing columns for cylindrical workpieces, especially bottles
03/26/2003EP0822885B1 Hot metal grinding
03/20/2003WO2003022520A1 Device and method for sharpening multiple blade knives
03/18/2003US6533649 Sander assembly having adjustable sander member
03/13/2003US20030049996 Bowling ball resurfacing device
03/12/2003EP1140425B1 An abrasive machine for machining a surface of a cylindrical work piece
03/12/2003EP0916449B1 Wire-saw and its manufacturing method
03/12/2003CN1401467A Method for separating thin sheet from hard and friable workpiece, and wire saw for carrying out said method
03/12/2003CN1102876C Method of cutting blocks of hard substances into plates by means of wire saw, and wire saw for carrying out the method
03/06/2003WO2003018255A1 An apparatus for edge grinding of plates
03/06/2003US20030045208 System and method for chemical mechanical polishing using retractable polishing pads
03/05/2003EP1178869B1 Method of and apparatus for removing material
03/05/2003EP1039984B1 Method and device for polishing workpieces with a simultaneous superfinish
03/04/2003US6526960 Wire-saw and method for manufacturing the same
02/2003
02/27/2003WO2003015984A1 Bowling ball resurfacing device
02/27/2003US20030040261 Polishing apparatus and a method of polishing and cleaning and drying a wafer
02/26/2003EP1284847A1 Wire saw and process for slicing multiple semiconductor ingots
02/20/2003WO2003013787A1 Working device and method for working a stack of plate-shaped elements
02/20/2003US20030034022 Method for separating slices from a hard brittle workpiece, and wire saw for carrying out the method
02/20/2003DE10158334C1 Electric angle grinder has protective hood adjusted relative to spindle neck of angle grinder via releasable cam mechanism
02/19/2003CN1397396A Maker of copying cutter
02/13/2003US20030032375 Milling cutter processing machine
02/13/2003US20030032372 Substrate polishing apparatus
02/13/2003US20030029432 Cutting method for hard, brittle materials
02/12/2003EP1283374A1 Quartz coil spring and method of producing the same
02/05/2003EP1281476A2 Method for polishing workpieces and apparatus therefor
02/05/2003EP1280629A1 Nickel-diamond-coated saw wire with improved anchoring of the diamond particles
02/04/2003US6513514 Wire saw for cutting up stone blocks into slabs with tension adjustment of individual saw wires
01/2003
01/28/2003US6511366 Rotary woodworking machine
01/28/2003US6511362 Polishing apparatus and polishing method
01/22/2003EP1276590A1 Device for mechanically rough machining and/or finish machining cast parts
01/16/2003US20030013380 Semiconductor wafer dividing method
01/16/2003US20030011119 Quartz coil spring and method of producing the same
01/14/2003US6505394 Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy magnets using wire saw, and voice coil motor
01/09/2003WO2003002300A1 Apparatus and method for polishing multiple semiconductor wafers in parallel
01/09/2003US20030006325 Desk-top, portable unit with a short (under 10 second) cycle time, pluggable into a wall outlet
01/08/2003EP1273390A1 Control device to implement grinding process for a knife shaft
01/02/2003US20030003852 Apparatus and method for polishing multiple semiconductor wafers in parallel
01/01/2003CN1097726C Equipment for grinding material samples
12/2002
12/31/2002US6500051 Polishing apparatus and method
12/31/2002US6500048 Method for separating profiled foils
12/26/2002US20020197943 Girinding wheel machine bracket adjustable in angle
12/19/2002WO2002100592A1 Apparatus and method for measuring tool degradation
12/19/2002US20020193049 Substrate dicing method
12/18/2002CN2526127Y Multifunctional machine for removing ash and dirt, and polishing angle form board
12/18/2002CN1385288A Method for cutting slice from workpiece
12/12/2002US20020186370 Apparatus and method for measuring the degradation of a tool
12/05/2002US20020182866 Off-concentric polishing system design
12/05/2002DE10125448A1 Grinding machine for finishing concrete or stone workpieces has rotary driven support disc and grinding tools inclined relative to workpiece support to allow air cooling when grinding parts are not in engagement
12/03/2002US6488565 Apparatus for chemical mechanical planarization having nested load cups
11/2002
11/28/2002WO2002094505A1 Multi-spindle end effector
11/28/2002US20020174861 Method for cutting slices from a workpiece
11/26/2002US6485357 Dual-feed single column double-disk grinding machine
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