Patents for B24B 21 - Machines or devices using grinding or polishing belts; Accessories therefor (4,476)
09/2002
09/12/2002US20020127959 Platen with lateral web tensioner
09/10/2002US6447374 Chemical mechanical planarization system
09/05/2002US20020123298 Linear reciprocating disposable belt polishing method and apparatus
08/2002
08/29/2002WO2002051585A3 Device for grinding an external sleeve surface
08/27/2002US6439978 Substrate polishing system using roll-to-roll fixed abrasive
08/27/2002US6439976 Polishing tape
08/21/2002CN2506396Y Metal wire material polishing machine
08/21/2002CN2506395Y Cutter grinding structure for cutting machine
08/20/2002US6435952 Apparatus and method for qualifying a chemical mechanical planarization process
08/14/2002EP1124666B1 Use of zeta potential during chemical mechanical polishing for end point detection
08/14/2002CN2505230Y Belt-changing mechanism for abrasive belt plate glazing calender
08/14/2002CN2505229Y Automatic belt-adjusting mechanism
08/07/2002EP1227912A1 Methods and apparatuses for planarizing microelectronic substrate assemblies
08/06/2002US6428404 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies
08/06/2002US6428394 Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed
08/01/2002US20020102929 Sander assembly having adjustable sander member
08/01/2002DE10102184A1 Verfahren und Vorrichtung zur Feinstbearbeitung von Oberflächen Method and apparatus for precision finishing of surfaces
07/2002
07/30/2002US6425811 Sander for smoothing curvilinear surfaces
07/25/2002US20020098787 Polishing apparatus
07/25/2002US20020098388 Recording medium substrate having uniform texture and texturing apparatus therefor
07/24/2002CN2501638Y Abrasive band polishing machine with diamond saw bit
07/23/2002US6422929 Polishing pad for a linear polisher and method for forming
07/16/2002US6419569 Hand-held belt sander
07/16/2002US6419560 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies
07/16/2002US6419559 Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet
07/11/2002US20020090819 Windowless belt and method for improved in-situ wafer monitoring
07/11/2002DE10065531A1 Grinding machine has fluid fill contact pressure element formed by flexible hollow body with opposing surfaces interconnected through elastomer to adapt to surface conditions
07/09/2002US6416401 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
07/09/2002US6416385 Method and apparatus for polishing semiconductor wafers
07/04/2002WO2002051585A2 Device for grinding an external sleeve surface
07/04/2002US20020086627 Flex plate attachment for use with belt sanders
07/04/2002DE10065881A1 Vorrichtung zum Schleifen einer Außenmantelfläche An apparatus for grinding an outer circumferential surface
07/03/2002EP1218143A1 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
07/02/2002US6413873 System for chemical mechanical planarization
06/2002
06/27/2002WO2002049806A1 Belt polishing device with double retainer ring
06/27/2002WO2002049805A1 Polishing platen with pressurized membrane
06/27/2002WO2002049802A1 Device and method for polishing, and method and device for manufacturing semiconductor device
06/27/2002US20020081951 Apparatus and method for qualifying a chemical mechanical planarization process
06/27/2002US20020081947 Platen design for improving edge performance in CMP applications
06/27/2002US20020081945 Piezoelectric platen design for improving performance in CMP applications
06/26/2002CN2496597Y Grinder
06/25/2002US6409587 Dual-hardness polishing pad for linear polisher and method for fabrication
06/20/2002US20020077053 Flexible polishing pad having reduced surface stress
06/20/2002US20020074311 Methods of endpoint detection for wafer planarization
06/19/2002EP1215010A2 Grinding apparatus
06/19/2002EP1214175A1 Unsupported polishing belt for chemical mechanical polishing
06/19/2002EP1214174A1 Windowless belt and method for in-situ wafer monitoring
06/18/2002US6406363 Unsupported chemical mechanical polishing belt
06/13/2002US20020072311 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
06/13/2002US20020072296 Abrasive article having a window system for polishing wafers, and methods
06/13/2002US20020069967 Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
06/11/2002US6402601 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies
06/11/2002US6402596 Single-side polishing method for substrate edge, and apparatus therefor
06/06/2002WO2002045127A2 Methods of endpoint detection for wafer planarization
06/06/2002WO2002043925A1 Abrasive article having a window system for polishing wafers, and methods
06/06/2002US20020068513 Unsupported chemical mechanical polishing belt
06/06/2002CA2430377A1 Abrasive article having a window system for polishing wafers, and methods
06/04/2002US6398625 Apparatus and method of polishing with slurry delivery through a polishing pad
06/04/2002US6398623 Processing method of device and processing method of slider
06/04/2002US6398077 Package with multiple chambers and valves
05/2002
05/28/2002US6394883 Method and apparatus for planarizing and cleaning microelectronic substrates
05/23/2002WO2002041392A2 Conductor chemical-mechanical polishing in integrated circuit interconnects
05/23/2002US20020061713 End-point detection system for chemical mechanical polishing applications
05/16/2002WO2002039485A2 Platen for retaining polishing material
05/16/2002WO2002002277A3 A conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
05/16/2002US20020058468 Semiconductor polishing pad
05/15/2002EP0966338B1 Integrated pad and belt for chemical mechanical polishing
05/14/2002US6387924 Benzothiepines having activity as inhibitors of ileal bile acid transport and taurocholate uptake
05/14/2002US6387289 Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
05/14/2002US6386958 Reciprocating-type abrasive device for a sanding machine
05/08/2002CN2489922Y Nutation device of polishing machine
05/07/2002US6383063 Polishing apparatus and polishing method
05/02/2002US20020052171 Apparatus and methods for chemical mechanical polishing with an incrementally advanceable polishing sheet
05/01/2002CN2488641Y Holding abrasive band device in grinder
05/01/2002CN1083754C Apparatus and method for polishing flat surface using belted polishing pad
04/2002
04/30/2002US6379232 Belt lift accessory for combination belt and disk sander and method for making same
04/30/2002US6379231 Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
04/30/2002US6379227 Abrasive-band grinding device and method for controlling an abrasive-band grinding device during grinding of faces of crowned rolls
04/30/2002US6379216 Rotary chemical-mechanical polishing apparatus employing multiple fluid-bearing platens for semiconductor fabrication
04/25/2002WO2002032623A1 Pressing device for sanding machine
04/23/2002US6375540 End-point detection system for chemical mechanical posing applications
04/18/2002US20020045411 Method of and apparatus for manufacturing recording medium
04/18/2002US20020045409 Method and apparatus for planarizing and cleaning microelectronic substrates
04/18/2002US20020045406 Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet
04/18/2002US20020045348 Semiconductor wafer treating method and device for removing deposit on a semiconductor wafer
04/17/2002CN1345263A Hand operated belt sander
04/16/2002US6371225 Drill bit and surface treatment for tungsten carbide insert
04/11/2002WO2002028596A1 Web-style pad conditioning system and methods for implementing the same
04/11/2002WO2002028595A1 Polishing apparatus and method with a refreshing polishing belt and loadable housing
04/09/2002US6368197 Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
04/09/2002US6368193 Method and apparatus for planarizing and cleaning microelectronic substrates
04/03/2002CN1342543A Automatic band regulation mechanism
04/03/2002CN1081972C Abrasive article and method of making same
04/02/2002US6364746 Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic-substrate assemblies
03/2002
03/26/2002US6361421 Belt grinder with pivotable grinding unit and opposite supporting tables at different working heights
03/26/2002US6361417 Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates
03/21/2002DE10041925A1 Grinding process involves bringing workpiece and grinding agent into engagement with feed movement as well as vibrating movement which differs from feed direction
03/19/2002US6358132 Apparatus for grinding spherical objects
03/19/2002US6358127 Method and apparatus for planarizing and cleaning microelectronic substrates
03/19/2002US6358122 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
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