Patents
Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880)
08/2009
08/27/2009WO2009104693A1 Solder bonding structure and soldering flux
08/26/2009EP2093008A1 Dispenser for a tin soldering roller with sideplates slidable relative to a base and protrusions for receiving the tin soldering roller
08/26/2009CN201295805Y Lead-free dip-soldering and tin-soldering adhesion hot-air cleaning mechanism
08/26/2009CN101517722A Method and device for wetting the bumps of a semiconductor chip with soldering flux
08/26/2009CN101515556A Solder ball accommodating structure
08/26/2009CN101513687A Reflux brazier soldering flux collection device and using method thereof
08/26/2009CN100533483C Systems and methods for detecting defects in printed solder paste
08/20/2009WO2009102281A1 Apparatus and method for solder ball filing
08/19/2009CN201293946Y Nitrogen gas closed-cycle control system
08/19/2009CN101512723A Device for wetting bumps of a semiconductor chip with a liquid substance
08/19/2009CN101508048A Reflow system
08/19/2009CN100528443C Solder handling system
08/13/2009DE202008004632U1 Verschlußsystem für einen Deckel eines Lötrahmens Closure system for a cover of a Lötrahmens
08/12/2009EP2087961A1 System and method for restoring metal components
08/12/2009CN201287230Y Automatic tin feeding machine
08/12/2009CN201287229Y Handfeel electronic temperature-control electric soldering iron
08/12/2009CN101502902A Solar battery welding device and welding process
08/11/2009US7572492 Method for welding component of a multi-layer construction
08/05/2009EP1663513A4 Deposition and patterning process
08/05/2009CN201283491Y Intermediate frequency induction brazing clamping mechanism of generator rotor coil
08/05/2009CN201283248Y Dross spot filter
08/05/2009CN101500739A Screen printing head, system and method
08/05/2009CN101499428A Double-interface card production method and equipment
08/05/2009CN100522445C Solder-dross mixture separation method and apparatus
08/05/2009CN100522444C Soldering tin connecting device
08/05/2009CN100522442C Soldering method, soldering device, bonding method, bonding device, and nozzle unit
07/2009
07/30/2009WO2009092937A2 Device for feeding gas to a wave brazing or tinning machine
07/30/2009US20090188967 Vapor-Operated Soldering System and Vapor Generation System for a Soldering System
07/29/2009EP2082630A1 Method for forming solder layer on printed-wiring board and slurry discharge device
07/29/2009CN201279647Y Soldering fluid cooling and recovering device
07/29/2009CN201279646Y Welding head cleaning device
07/29/2009CN201279645Y Inner heater electric soldering iron
07/29/2009CN201279644Y Improved structure of soldering bit process integrated apparatus
07/29/2009CN201279643Y Push bar type brazing apparatus
07/29/2009CN201279642Y Brazing process integrated apparatus
07/29/2009CN100519033C Soldering iron
07/23/2009US20090184156 Process for producing semiconductor device and apparatus therefor
07/22/2009CN100515643C Constant temperature type hot-press jointing device and method
07/22/2009CN100515642C Soldering iron and method of manufacturing same
07/15/2009CN201271771Y Soldering device for LED lamp bead
07/15/2009CN101480745A Sealing-off device for ball lattice array packaging module and sealing-off method thereof
07/09/2009US20090173771 Method and device for heat treatment, especially connection by soldering
07/09/2009DE102007060971A1 Verfahren und Vorrichtung zur Herstellung einer Lotverbindung zwischen zwei im Wesentlichen nicht metallisch leitenden Bauteilen Method and apparatus for producing a soldered joint between two substantially non-metallic conductive components
07/09/2009DE102007021269B4 Reparaturlötkopf für oberflächenmontiertes Bauelement und Verfahren zu dessen Betrieb Repair soldering of surface mounted component and method for its operation
07/08/2009CN201267909Y Electric iron
07/08/2009CN101474700A Electric solding iron with resistor monitoring
07/08/2009CN100511612C Wire bonding apparatus and method thereof
07/08/2009CN100509236C Method for controlling contact load in electronic component mounting apparatus
07/08/2009CN100509235C Leadless welding table
07/07/2009US7556689 Device for spreading viscous thermal medium on heat dissipation device for electronic component
07/01/2009CN201264136Y Automatic tin-breaking and sending machine
07/01/2009CN201264135Y Combined electric soldering iron device and electric soldering bit thereof
06/2009
06/30/2009CA2434634C Automatic dross removal apparatus and method
06/30/2009CA2390498C Method and device for producing a soldered joint
06/25/2009WO2009078342A1 Process for producing member for heat exchanger and member for heat exchanger
06/25/2009US20090163615 Uv curable hybridcuring ink jet ink composition and solder mask using the same
06/25/2009US20090159651 Conductive ball mounting method and surplus ball removing apparatus
06/25/2009US20090159648 Device and method for brazing a heat pipe
06/25/2009US20090159646 Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus
06/25/2009DE102007062443A1 Applicator for applying a flux to a solder site comprises a flux container having a flux level which is controlled by a dosing valve above a level sensor and a horizontally and vertically moving flux stamp
06/24/2009EP2073258A2 Conductive ball mounting method and surplus ball removing apparatus
06/24/2009EP2072167A2 Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus
06/24/2009CN100503120C Solder heating tool and tip part thereof
06/24/2009CN100503118C Jet solder vessel
06/21/2009CA2647343A1 Weld viewing
06/18/2009US20090152329 Method and apparatus for mounting at least two types of electronic components
06/18/2009DE202009003700U1 Kühlmodul für Leiterplatten und flächige Güter Cooling module for printed boards and flat goods
06/18/2009DE102008044315A1 Holder for keeping components in position while they are soldered on to circuit board has threaded connector at top of sleeve, connector having longitudinal bore which acts as guide for pressure component at base
06/17/2009CN201257564Y Tin furnace equipment
06/17/2009CN201257563Y Temperature controllable electric soldering iron
06/17/2009CN201257562Y Novel tin feeding welding pen
06/17/2009CN201257561Y Indifferent equilibrium style welding and cutting handling frame
06/11/2009US20090145950 Dispensing solder for mounting semiconductor chips
06/10/2009EP2067561A1 Dispensing solder for mounting semiconductor chips
06/10/2009EP2067166A1 Method and device for wetting the bumps of a semiconductor chip with soldering flux
06/10/2009DE102007058802B3 Thermodenvorrichtung Thermodenvorrichtung
06/10/2009CN201253724Y Novel brazing furnace
06/10/2009CN201253723Y Electric iron
06/10/2009CN201253722Y Multi-function electric soldering iron
06/10/2009CN101450412A Hand iron rack
06/10/2009CN101450411A High-frequency heating electric soldering bit
06/10/2009CN100496846C Ceramic resonator welding machine
06/04/2009US20090140028 Soldering tip, soldering iron, and soldering system
06/03/2009EP2065114A1 Soldering tip with a non-wetting solder contact layer ; Soldering iron comprising such soldering tip ; Soldering system comprising such soldering iron
06/03/2009CN201249318Y Driving device for bin door of table-type backflow soldering machine
06/03/2009CN201249317Y Electric solding iron auxiliary device
06/03/2009CN201249316Y External heating type electric iron
06/03/2009CN201249315Y Energy-saving soldering iron
06/03/2009CN101444866A Energy-saving and safe electric soldering iron
06/03/2009CN101444865A Soldering tip, soldering hammer and soldering system
06/03/2009CN101444864A Automatic tin soldering device of energy-saving lamp
05/2009
05/28/2009US20090134205 Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus
05/28/2009DE102008038418A1 Soldering apparatus, especially useful with lead-free solders, has movable soldering tip and laser beam source to provide additional energy at soldering site
05/27/2009CN201244707Y Automatic tin soldering machine
05/27/2009CN101439432A General-purpose tool for extracting DIP packed chip
05/27/2009CN101439272A Method and device for stirring solder paste
05/27/2009CN100493299C Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method
05/26/2009US7537958 High performance multi-chip flip chip package
05/21/2009US20090127314 In-line package apparatuses and methods
05/20/2009EP2059945A1 Device for wetting bumps of a semiconductor chip with a liquid substance
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