Patents
Patents for B23K 31 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups (10,413)
11/2005
11/10/2005WO2005105357A1 System and method for low loop wire bonding
11/10/2005US20050249030 Extruder screw with long wearing surfaces
11/10/2005US20050247762 Crevice corrosion-resistant liquid-cooled armature bar clip-to-strand connection and related method
11/10/2005US20050247759 Methods for manufacturing optical modules using lead frame connectors
11/10/2005US20050247758 Linear split axis wire bonder
11/10/2005US20050247686 System and method for aligning tubes in an orbital welder
11/09/2005CN1694235A Linear split axis wire bonder
11/08/2005CA2355624C Method and apparatus for welding pipes together
11/03/2005US20050244578 System and method for field coating
11/03/2005US20050242161 Systems and methods for laser soldering flat flexible cable
11/03/2005US20050242160 Electrical circuits with button plated contacts and assembly methods
11/03/2005US20050242159 System and method for low loop wire bonding
11/03/2005US20050242066 Method for modifying or producing materials and joints with specific properties by generating and applying adaptive impulses a normalizing energy thereof and pauses therebetween
11/02/2005CN1689745A Brazing method for brass parts using copper solder
11/02/2005CN1225341C Making process of super big golf club head
11/01/2005US6959853 aluminum-silicon clad aluminum brazing sheet composites; physical vapor deposition and layered sequencing of a metal substrate, eutectic-forming layer and braze-promoting layer; plasma or ion-cleaning minimizes environmental impact
11/01/2005CA2250634C Welded joint for armored vehicles
10/2005
10/27/2005US20050236462 Brazing method for brass parts using copper solder
10/26/2005CN1224493C Aluminium base composite material liquid phase rotating welding material back filling welding method
10/26/2005CN1224492C High efficiency aluminium base composite material liquid phase vibrating welding method
10/25/2005US6957762 Vacuum brazing method for aluminum-based material
10/20/2005WO2005097389A1 Heat exchanger tube, heat exchanger, and manufacturing method thereof
10/20/2005WO2005097374A1 Method for manufacturing a circular metal tank
10/20/2005US20050230457 Soldering process
10/20/2005US20050230379 System and method for heating a workpiece during a welding operation
10/20/2005CA2502896A1 System and method for heating a workpiece during a welding operation
10/19/2005CN1684789A Selective gas knife for wave soldering
10/19/2005CN1684573A Mounting substrate and mounting method of electronic part
10/13/2005US20050224932 Electrically conductive wire
10/13/2005US20050224561 Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device
10/13/2005US20050224560 Mounting substrate and mounting method of electronic part
10/13/2005US20050224487 Welding process
10/13/2005US20050224129 Skinned structures of air hardenable or liquid quench hardenable steel plate and methods of constructing thereof
10/13/2005US20050223807 Method for ultrasonic control of weld joints
10/13/2005DE102004010299A1 Infrarot-Empfänger-Chip Infrared receiver chip
10/13/2005CA2560053A1 Solid state processing of materials through friction stir processing and friction stir mixing
10/12/2005EP1584405A2 Die Plate
10/12/2005EP1584402A2 Welding process
10/12/2005EP1583634A1 Method for evaluating a weld joint formed during a welding process
10/12/2005CN1681377A Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device
10/12/2005CN1680066A Welding process
10/06/2005WO2005093612A1 Welding deformation computing method, welding deformation computing device, computer program, and recording medium
10/06/2005US20050221102 Die plate
10/06/2005US20050218195 Underfill fluxing curative
10/06/2005US20050218194 Wire bonding apparatus
10/06/2005US20050218193 Superplastic forming and diffusion bonding of fine grain titanium
10/06/2005DE102005011429A1 Drahtbondverfahren und Halbleiterbauelement Wire bonding method and semiconductor device
10/05/2005CN1678427A Device and method for controlling an operation involving the laser beam welding, hardfacing or machining of a part
10/05/2005CN1677631A Wire bonding apparatus and method thereof
10/05/2005CN1676296A Die plate
10/05/2005CN1222027C Pressure welding method and pressure welding device
10/05/2005CN1221352C Method of mfg. ball valve
09/2005
09/29/2005WO2005089995A1 Method of producing a cutting blade and cutting blade thus produced
09/29/2005US20050211752 Metallic solder thermal interface material layer and application of the same
09/29/2005US20050211751 Heat treatment; for joints between stainless steel components; impellers
09/29/2005US20050211749 Bumpless die and heat spreader lid module bonded to bumped die carrier
09/29/2005DE102004056619A1 Method for producing a heat exchange partition between a heating space and a heat exchange medium useful for refuse incineration heating chambers
09/28/2005EP1580852A2 Laser unit
09/28/2005EP1579945A1 Boxing joint with excellent fatigue strength, method of manufacturing the boxing joint, and welded structure
09/28/2005CN1674991A Process and apparatus for producing honeycomb bodies and honeycomb body produced by the process
09/27/2005US6949728 Impeder for manufacturing welded pipe
09/22/2005WO2005087430A1 Method of semi-conductor device assembly including fatigue-resistant ternary solder alloy
09/22/2005WO2005087426A1 Method for producing a heat exchanger partition with an armor-plating, and a heat exchanger partition
09/22/2005US20050206391 Method for qualifying joints and contacts of electric circuits
09/22/2005US20050205995 Wire bonding method and semiconductor device
09/22/2005US20050205647 Supplying shielding gas
09/22/2005US20050205643 Desoldering sheath
09/22/2005US20050205642 PCB manufacturing system
09/22/2005DE102005010007A1 Verfahren zum ständigen Verbinden von ersten und zweiten metallischen Komponenten A method for permanent joining of first and second metallic components
09/21/2005CN1670935A Wire bonding method and semiconductor device
09/15/2005WO2005084876A1 A method of improving solder joints of fine wires
09/15/2005US20050199684 Method of semiconductor device assembly including fatigue-resistant ternary solder alloy
09/14/2005EP1574280A2 Airfoil for a gas turbine engine and method of manufacture
09/14/2005EP1572417A1 Method of fabricating multi-channel devices and multi-channel devices therefrom
09/14/2005EP1572349A2 Microchannel apparatus, methods of making microchannel apparatus, and processes of conducting unit operations
09/14/2005CN1668415A EMAT weld inspection
09/14/2005CN1668414A Material for welding and welded article
09/08/2005US20050195867 Laser unit
09/08/2005US20050194538 Infrared receiver chip
09/08/2005US20050194423 Ultrasonic bonding apparatus and method
09/08/2005US20050193545 Method of permanently joining first and second metallic components
09/07/2005CN1665036A Chip of infrared receiver
09/07/2005CN1217721C Manufacture of golf club head
09/06/2005US6938817 depositing a thin film, aligning a metallized microchannel and a dielectric insulator, placing in a bonding fixture under compression and placing in a vacuum heat chamber
09/01/2005US20050191220 Process and apparatus for producing honeycomb bodies and honeycomb body produced by the process
09/01/2005US20050189400 Methods for manufacturing optical modules using lead frame connectors
08/2005
08/31/2005CN1662342A Method of manufacturing annular body
08/30/2005US6937167 Method for joining a jacket element and a core element together
08/30/2005US6935555 Method of brazing and article made therefrom
08/25/2005WO2005077583A1 Soldering method
08/25/2005US20050184268 Laser welded butterfly valve blade
08/25/2005US20050184131 Wire bonding method and apparatus
08/23/2005US6932262 Bonding method and bonding apparatus
08/23/2005US6931931 Device for ultrasonic weld seam testing of longitudinally welded pipes for longitudinal and transversal errors
08/23/2005CA2360736C Engine driven welding power supply with dig circuit
08/18/2005US20050178820 Microsystem enclosure and method of hermetic sealing
08/18/2005US20050178815 Method for preparing integrated circuit modules for attachment to printed circuit substrates
08/18/2005US20050178005 Method of manufacturing annular body
08/17/2005EP1562720A1 Toughness-optimized weld joints and methods for producing said weld joints
08/17/2005EP0859686B1 Fabricating interconnects and tips using sacrificial substrates
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