Patents
Sitemap › B23 - Machine tools; Metal-working not otherwise provided for › B23K - Soldering or unsoldering; Welding; Cladding or plating by soldering or welding; Cutting by applying heat locally, e.g. flame cutting; Working by laser beam › B23K 26 - Working by laser beam, e.g. welding, cutting, boring
Patents for B23K 26 - Working by laser beam, e.g. welding, cutting, boring (47,857)
05/2003
05/08/2003US20030085208 Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device
05/08/2003US20030085203 Method and apparatus for cleaning generator and turbine components
05/08/2003US20030085201 Piston for magneto-rheological fluid systems and method for its manufacture
05/08/2003DE20121770U1 Light metal extruded section for use as a cooler for electrical components has a heat-conducting body with teeth on a front side, a flat rear side and a laser welding-joint to join together single sections abutting in a butt joint
05/08/2003DE10144521C1 Verfahren und Vorrichtung zur Laserbearbeitung mittels eines Laserstrahles Method and apparatus for laser machining using a laser beam
05/07/2003EP1308570A2 Vacuum joining for containers or structures produced under vacuum
05/07/2003EP1308525A2 Method of controlling hardening with laser beam and laser beam hardening device
05/07/2003EP1308236A1 Method of forming a shaped hole
05/07/2003EP1308235A1 Method and device for controlling the energy of a laserbeam
05/07/2003EP1307824A1 Gap welding process
05/07/2003EP1307300A1 Method and system for dust and fume removal in laser marking machines
05/07/2003EP1040017B1 Method and device for marking objects with sintered mineral powders
05/07/2003CN2548757Y Laser carving apparatus
05/07/2003CN1415451A Method for high speed preparing and forming the gradient material by use of laser
05/07/2003CN1108088C Coating for structured prodn. of conductors on surface of electrically insulating substrates
05/07/2003CN1107579C Non-slip floor covering and process for producing it
05/07/2003CN1107570C Method and appts. for supplying gaseous nitrogen to laser beam machine, and laser bean machine
05/07/2003CN1107569C Vacuum caser machining equipment
05/06/2003USRE38105 Apparatus for making nonwoven fabrics having raised portions
05/06/2003US6559934 Method and apparatus for determining characteristics of a laser beam spot
05/06/2003US6559414 Operating head, specifically for a laser machine
05/06/2003US6559413 Method for laser machining explosives and ordnance
05/06/2003US6559412 Laser processing
05/06/2003US6559411 Method and apparatus for laser scribing glass sheet substrate coatings
05/06/2003US6559410 Apparatus and method for laser etching wear patterns into denim pants
05/06/2003US6559409 Method for marking integrated circuits with a laser
05/06/2003US6558991 Laser irradiation apparatus and laser irradiation method
05/06/2003US6558882 Laser working method
05/06/2003US6558493 Releasing of bonded screens
05/06/2003US6558373 Interface for laser eye surgery
05/02/2003EP1306892A1 Single crystal cutting method
05/02/2003EP1306709A2 Laser beam guidance device
05/02/2003EP1306160A1 Laser drilling method
05/02/2003EP1306139A2 Method of coating with fluorocarbon resin, sliding member and gas compressor coated using the same
05/02/2003EP1305179A1 Method for production of a vehicle door and a frameless door made by said method
05/02/2003EP1305169A1 System and method for adjusting the properties of a device by gcib processing
05/02/2003EP1305132A1 Device for parting and/or perforating
05/02/2003EP1305131A1 Laser supported friction stir welding method
05/01/2003WO2003035411A2 Laser-transfer film for permanently labeling components
05/01/2003WO2003035318A1 Device and method for laser beam soldering, in particular, laser beam hard soldering
05/01/2003US20030080100 Laser apparatus, laser irradiation method, manufacturing method for a semiconductor device, semiconductor device and electronic equipment
05/01/2003US20030080099 Laser irradiation method, laser irradiation apparatus, and method of manufacturing a semiconductor device
05/01/2003US20030080098 Method of controlling hardening with laser beam and laser beam hardening device
05/01/2003US20030080096 Thermal cutting machine and dust collecting method thereof
05/01/2003US20030080089 Contains sulfuric acid anions and a trivalent salt; anion-exchanger
05/01/2003US20030079344 Cylinder and method for manufacturing a cylinder for an internal combustion engine
04/2003
04/30/2003DE10138239C1 Method, for producing a metal component structure with little warping, regulates temperatures of two components to be welded together prior to applying fusion welding
04/30/2003CN1414893A Method and device for rapid cutting of workpiece from brittle material
04/30/2003CN1414827A Substrate conducting wiring cutting method and device, electronic device manufacturing method and device
04/30/2003CN1414616A Laser ennealing equipment, TFT device and corresponding ennealing method
04/30/2003CN1414615A Manufacturing method of semiconductor device
04/30/2003CN1414604A Manufacturing method of semiconductor
04/30/2003CN1107364C 气体激光加工机 Gas laser processing machine
04/30/2003CN1107164C Method for mfg. outlet nozzles for rocket engines
04/29/2003US6556331 Optical mirror and optical scanner and laser machining apparatus using the same
04/29/2003US6555784 Laser machining apparatus
04/29/2003US6555783 Laser processing method and laser processing apparatus
04/29/2003US6555782 Laser machining method, laser machining apparatus, and its control method
04/29/2003US6555781 Ultrashort pulsed laser micromachining/submicromachining using an acoustooptic scanning device with dispersion compensation
04/29/2003US6555780 Method for monitoring the size variation and the focus shift of a weld pool in laser welding
04/29/2003US6555779 Underwater processing device and underwater processing method
04/29/2003US6555449 Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication
04/29/2003US6555447 Method for laser scribing of wafers
04/29/2003US6555423 Method of manufacturing a thin film transistor and a method of evaluating a polysilicon film
04/29/2003US6554854 Process for laser joining dissimilar metals and endoluminal stent with radiopaque marker produced thereby
04/29/2003US6554600 Device for producing a three-dimensional object, especially a laser sintering machine
04/29/2003US6554556 Method for the manufacture of a ring part out of sheet metal for a lid of a can
04/29/2003US6554400 Nozzle plate and a manufacturing process thereof
04/29/2003US6554176 Method of manufacturing a vehicle body and frame assembly including an energy absorbing structure
04/24/2003WO2003034555A1 Pulse oscillation solid-sate laser apparatus and laser machining apparatus
04/24/2003WO2003034554A1 Laser apparatus
04/24/2003WO2003033199A1 Method for improved wafer alignment
04/24/2003WO2003032957A2 Methods for hermetically sealing microchip reservoir devices
04/24/2003US20030077880 Method of making semiconductor device that has improved structural strength
04/24/2003US20030075588 Process for continuous production of longitudinally welded metal tubing
04/24/2003US20030075531 Method for locally removing a coat applied on a translucent or transparent substrate
04/24/2003US20030075530 Device for laser cutting preparations, and a microscope
04/24/2003US20030075529 Focusing optics for adaptive deposition in rapid manufacturing
04/24/2003US20030075266 Method for cutting a member to form a desired structure
04/24/2003US20030075190 Method of and apparatus for making perforations in the wrappers of rod-shaped products
04/24/2003CA2461754A1 Pulse oscillating type solid laser unit and laser process unit
04/24/2003CA2461753A1 Laser system
04/24/2003CA2451953A1 Methods for hermetically sealing microchip reservoir devices
04/23/2003EP1304735A2 Semiconductor device manufacture method
04/23/2003EP1304560A1 Method for quality-control of plastic weld seams
04/23/2003EP1304234A2 Automatic marking of diamond girdles using a laser
04/23/2003EP1304198A2 Method for cutting a member to form a desired structure
04/23/2003EP1304186A2 Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device
04/23/2003EP1304179A1 Metal mold for press working
04/23/2003EP1304176A2 Method for the continuous production of longitudinally seam welded metal tubes
04/23/2003EP1303377A1 Laser cutting of semiconductor materials
04/23/2003EP1027271B1 Flexible web converter waste removal apparatus and control
04/23/2003CN2546135Y Radio frequency panel CO2 laser complete machine
04/23/2003CN1413428A Switchable wavelength laser-based etched circuit board processing system
04/23/2003CN1413136A Method and apparatus for separating non-metallic materials
04/23/2003CN1412822A Method for mfg. semiconductor with improved structure intensity
04/23/2003CN1412821A Method for forming through-hole or depression on silicon chip
04/23/2003CN1411943A Laser hole-making method for non-metal thin type material and its equipment
04/23/2003CN1411942A Component and tissue controllable laser stereoforming method
04/23/2003CN1411923A Method for continuous making longitudinal seam welding metal pipe
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